SG10201600485SA - Apparatus and method for dynamic control of plated uniformity with the use of remote electric current - Google Patents

Apparatus and method for dynamic control of plated uniformity with the use of remote electric current

Info

Publication number
SG10201600485SA
SG10201600485SA SG10201600485SA SG10201600485SA SG10201600485SA SG 10201600485S A SG10201600485S A SG 10201600485SA SG 10201600485S A SG10201600485S A SG 10201600485SA SG 10201600485S A SG10201600485S A SG 10201600485SA SG 10201600485S A SG10201600485S A SG 10201600485SA
Authority
SG
Singapore
Prior art keywords
electric current
dynamic control
remote electric
plated uniformity
plated
Prior art date
Application number
SG10201600485SA
Inventor
Burhanuddin Kagajwala
Bryan L Buckalew
Steven T Mayer
Lee Peng Chua
Aaron Berke
James Isaac Fortner
Robert Rash
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201600485SA publication Critical patent/SG10201600485SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F5/00—Electrolytic stripping of metallic layers or coatings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
SG10201600485SA 2015-01-22 2016-01-21 Apparatus and method for dynamic control of plated uniformity with the use of remote electric current SG10201600485SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/602,910 US9567685B2 (en) 2015-01-22 2015-01-22 Apparatus and method for dynamic control of plated uniformity with the use of remote electric current

Publications (1)

Publication Number Publication Date
SG10201600485SA true SG10201600485SA (en) 2016-08-30

Family

ID=56432415

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201600485SA SG10201600485SA (en) 2015-01-22 2016-01-21 Apparatus and method for dynamic control of plated uniformity with the use of remote electric current

Country Status (5)

Country Link
US (1) US9567685B2 (en)
KR (1) KR102554254B1 (en)
CN (2) CN105821457B (en)
SG (1) SG10201600485SA (en)
TW (1) TWI697587B (en)

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US9909228B2 (en) 2012-11-27 2018-03-06 Lam Research Corporation Method and apparatus for dynamic current distribution control during electroplating
US9752248B2 (en) 2014-12-19 2017-09-05 Lam Research Corporation Methods and apparatuses for dynamically tunable wafer-edge electroplating
US9567685B2 (en) * 2015-01-22 2017-02-14 Lam Research Corporation Apparatus and method for dynamic control of plated uniformity with the use of remote electric current
US9988733B2 (en) 2015-06-09 2018-06-05 Lam Research Corporation Apparatus and method for modulating azimuthal uniformity in electroplating
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
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US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
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TWI700401B (en) * 2018-08-21 2020-08-01 財團法人工業技術研究院 Panel to be plated, electroplating process using the same, and chip manufactured from the same
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CN113056575A (en) 2018-11-19 2021-06-29 朗姆研究公司 Cross flow conduit for preventing bubbling in high convection plating baths
JP7135958B2 (en) * 2019-03-22 2022-09-13 トヨタ自動車株式会社 Metal film deposition equipment
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JP2021001396A (en) * 2019-06-06 2021-01-07 ピコサン オーワイＰｉｃｏｓｕｎ Ｏｙ Manufacture of coated article
CN110499525B (en) * 2019-08-28 2021-05-07 上海戴丰科技有限公司 Wafer electroplating device and cathode socket box used by same
WO2021046068A1 (en) * 2019-09-03 2021-03-11 Lam Research Corporation Low angle membrane frame for an electroplating cell
EP3868923A1 (en) * 2020-02-19 2021-08-25 Semsysco GmbH Electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate
TW202235695A (en) * 2020-12-01 2022-09-16 美商蘭姆研究公司 Process kit de-bubbling
TWI764446B (en) * 2020-12-17 2022-05-11 善統工業股份有限公司 Jig for advancing anode treatment equipment for metal workpieces
TWI782506B (en) * 2021-04-27 2022-11-01 龍華科技大學 A method for manufacturing high aspect ratio hole
CN116262983A (en) * 2021-12-14 2023-06-16 盛美半导体设备(上海)股份有限公司 Electroplating device
CN115896904B (en) * 2023-03-09 2023-05-30 苏州智程半导体科技股份有限公司 Wafer electroplating chamber structure

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Also Published As

Publication number Publication date
CN108707940B (en) 2020-12-01
US20160215408A1 (en) 2016-07-28
TWI697587B (en) 2020-07-01
CN105821457B (en) 2018-05-22
CN108707940A (en) 2018-10-26
KR102554254B1 (en) 2023-07-12
CN105821457A (en) 2016-08-03
TW201643279A (en) 2016-12-16
KR20160090761A (en) 2016-08-01
US9567685B2 (en) 2017-02-14

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