SG10201500486QA - Probing device - Google Patents

Probing device

Info

Publication number
SG10201500486QA
SG10201500486QA SG10201500486QA SG10201500486QA SG10201500486QA SG 10201500486Q A SG10201500486Q A SG 10201500486QA SG 10201500486Q A SG10201500486Q A SG 10201500486QA SG 10201500486Q A SG10201500486Q A SG 10201500486QA SG 10201500486Q A SG10201500486Q A SG 10201500486QA
Authority
SG
Singapore
Prior art keywords
probing device
probing
Prior art date
Application number
SG10201500486QA
Other languages
English (en)
Inventor
Wu Chien-Chou
Chi Chen Ming
Che Li Chung
Original Assignee
Mpi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW100127587A external-priority patent/TWI431282B/zh
Priority claimed from TW101213755U external-priority patent/TWM442506U/zh
Application filed by Mpi Corp filed Critical Mpi Corp
Publication of SG10201500486QA publication Critical patent/SG10201500486QA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
SG10201500486QA 2011-08-03 2012-08-02 Probing device SG10201500486QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW100127587A TWI431282B (zh) 2011-08-03 2011-08-03 探針測試裝置
TW101213755U TWM442506U (en) 2012-07-17 2012-07-17 Probe testing device

Publications (1)

Publication Number Publication Date
SG10201500486QA true SG10201500486QA (en) 2015-03-30

Family

ID=47613129

Family Applications (2)

Application Number Title Priority Date Filing Date
SG2012057501A SG187376A1 (en) 2011-08-03 2012-08-02 Probing device
SG10201500486QA SG10201500486QA (en) 2011-08-03 2012-08-02 Probing device

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG2012057501A SG187376A1 (en) 2011-08-03 2012-08-02 Probing device

Country Status (3)

Country Link
US (1) US9347971B2 (zh)
CN (1) CN102914673B (zh)
SG (2) SG187376A1 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI541959B (zh) * 2013-10-22 2016-07-11 And a space converter for a wafer carrier for a wafer having a long strip contact is used And its manufacturing method
CN104793026B (zh) * 2014-01-20 2018-09-28 旺矽科技股份有限公司 应用于探针测试装置的支撑结构及其制作方法
TWI605255B (zh) * 2016-04-29 2017-11-11 中華精測科技股份有限公司 堆疊式測試介面板件及其製造方法
CN108572265A (zh) * 2017-03-14 2018-09-25 旺矽科技股份有限公司 微机电探针及其制造方法以及具有该微机电探针的探针头
KR102590407B1 (ko) * 2017-10-31 2023-10-16 폼팩터, 인크. 디커플링된 전기 및 기계 프로브 연결들을 갖는 mems 프로브 카드 조립체
TWI679427B (zh) * 2018-10-01 2019-12-11 巨擘科技股份有限公司 探針卡裝置
US11333683B2 (en) 2019-12-24 2022-05-17 Teradyne, Inc. Transposed via arrangement in probe card for automated test equipment
US11162980B2 (en) * 2019-12-24 2021-11-02 Teradyne, Inc. Coaxial via arrangement in probe card for automated test equipment
US11340260B2 (en) 2019-12-24 2022-05-24 Teradyne, Inc. Probe card pad geometry in automated test equipment
US11215641B2 (en) 2019-12-24 2022-01-04 Teradyne, Inc. Probe card assembly in automated test equipment
CN113945741B (zh) * 2020-07-15 2023-11-10 台湾中华精测科技股份有限公司 探针卡装置及其栅栏状探针
TWI792528B (zh) * 2021-08-31 2023-02-11 旺矽科技股份有限公司 探針卡及其晶圓測試組件
CN115951203B (zh) * 2023-03-14 2023-06-16 杭州朗迅科技股份有限公司 一种双模组集成电路高频测试设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534784A (en) * 1994-05-02 1996-07-09 Motorola, Inc. Method for probing a semiconductor wafer
TW369601B (en) * 1997-06-17 1999-09-11 Advantest Corp Probe card
JPH1172534A (ja) 1997-08-28 1999-03-16 Mitsubishi Electric Corp テスト端子付き半導体装置およびｉｃソケット
US6917525B2 (en) 2001-11-27 2005-07-12 Nanonexus, Inc. Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
KR101025895B1 (ko) * 2006-06-08 2011-03-30 니혼 하츠쵸 가부시키가이샤 프로브 카드
CN200968961Y (zh) * 2006-11-10 2007-10-31 中兴通讯股份有限公司 一种界面针床
US7696766B2 (en) 2007-01-31 2010-04-13 Taiwan Semiconductor Manufacturing Company, Ltd. Ultra-fine pitch probe card structure

Also Published As

Publication number Publication date
US20130033283A1 (en) 2013-02-07
CN102914673B (zh) 2015-09-30
US9347971B2 (en) 2016-05-24
CN102914673A (zh) 2013-02-06
SG187376A1 (en) 2013-02-28

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