SG10201407243SA - Method for uniform flow behavior in an electroplating cell - Google Patents

Method for uniform flow behavior in an electroplating cell

Info

Publication number
SG10201407243SA
SG10201407243SA SG10201407243SA SG10201407243SA SG10201407243SA SG 10201407243S A SG10201407243S A SG 10201407243SA SG 10201407243S A SG10201407243S A SG 10201407243SA SG 10201407243S A SG10201407243S A SG 10201407243SA SG 10201407243S A SG10201407243S A SG 10201407243SA
Authority
SG
Singapore
Prior art keywords
uniform flow
flow behavior
electroplating cell
electroplating
cell
Prior art date
Application number
SG10201407243SA
Other languages
English (en)
Inventor
Daniel Mark Dinneen
Jingbin Feng
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201407243SA publication Critical patent/SG10201407243SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
SG10201407243SA 2013-11-06 2014-11-05 Method for uniform flow behavior in an electroplating cell SG10201407243SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/073,022 US9945044B2 (en) 2013-11-06 2013-11-06 Method for uniform flow behavior in an electroplating cell

Publications (1)

Publication Number Publication Date
SG10201407243SA true SG10201407243SA (en) 2015-06-29

Family

ID=53006190

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201407243SA SG10201407243SA (en) 2013-11-06 2014-11-05 Method for uniform flow behavior in an electroplating cell
SG10201803755PA SG10201803755PA (en) 2013-11-06 2014-11-05 Method for uniform flow behavior in an electroplating cell

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201803755PA SG10201803755PA (en) 2013-11-06 2014-11-05 Method for uniform flow behavior in an electroplating cell

Country Status (4)

Country Link
US (2) US9945044B2 (ko)
KR (2) KR102358030B1 (ko)
SG (2) SG10201407243SA (ko)
TW (1) TWI667374B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9945044B2 (en) 2013-11-06 2018-04-17 Lam Research Corporation Method for uniform flow behavior in an electroplating cell
WO2018071598A1 (en) * 2016-10-12 2018-04-19 Lam Research Corporation Pad raising mechanism in wafer positioning pedestal for semiconductor processing
TW202246583A (zh) 2017-07-10 2022-12-01 美商應用材料股份有限公司 具有減少的夾帶空氣的電鍍系統
US10494731B2 (en) * 2017-12-11 2019-12-03 Applied Materials, Inc. Electroplating dynamic edge control
US10903050B2 (en) 2018-12-10 2021-01-26 Lam Research Corporation Endpoint sensor based control including adjustment of an edge ring parameter for each substrate processed to maintain etch rate uniformity
CN112397422B (zh) * 2020-11-19 2023-08-29 苏州尊恒半导体科技有限公司 一种晶圆深孔电镀前处理润湿方法
US11427924B1 (en) * 2021-04-16 2022-08-30 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for electro-chemical plating
WO2023146591A1 (en) * 2022-01-26 2023-08-03 Applied Materials, Inc. Surging flow for bubble clearing in electroplating systems
KR102597424B1 (ko) 2022-10-20 2023-11-02 최일규 전해동박 제박기용 도금액 유출시스템

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US4466864A (en) * 1983-12-16 1984-08-21 At&T Technologies, Inc. Methods of and apparatus for electroplating preselected surface regions of electrical articles
US5865976A (en) 1994-10-07 1999-02-02 Toyoda Gosei Co., Inc. Plating method
US5980706A (en) * 1996-07-15 1999-11-09 Semitool, Inc. Electrode semiconductor workpiece holder
US5883762A (en) * 1997-03-13 1999-03-16 Calhoun; Robert B. Electroplating apparatus and process for reducing oxidation of oxidizable plating anions and cations
JPH1180989A (ja) * 1997-09-02 1999-03-26 Oki Electric Ind Co Ltd メッキ装置
CN1168854C (zh) * 1997-09-30 2004-09-29 塞米图尔公司 用于电镀半导体晶片的系统、装置和方法
US6080291A (en) * 1998-07-10 2000-06-27 Semitool, Inc. Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member
US6254760B1 (en) * 1999-03-05 2001-07-03 Applied Materials, Inc. Electro-chemical deposition system and method
US6613214B2 (en) * 1998-11-30 2003-09-02 Applied Materials, Inc. Electric contact element for electrochemical deposition system and method
WO2000038218A2 (de) 1998-12-22 2000-06-29 Steag Microtech Gmbh Vorrichtung und verfahren zum behandeln von substraten
US6136163A (en) * 1999-03-05 2000-10-24 Applied Materials, Inc. Apparatus for electro-chemical deposition with thermal anneal chamber
US6585876B2 (en) * 1999-04-08 2003-07-01 Applied Materials Inc. Flow diffuser to be used in electro-chemical plating system and method
KR100695660B1 (ko) * 1999-04-13 2007-03-19 세미툴 인코포레이티드 개선된 처리 유체 유동을 갖는 처리 챔버를 구비하는가공편 프로세서
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US6361675B1 (en) 1999-12-01 2002-03-26 Motorola, Inc. Method of manufacturing a semiconductor component and plating tool therefor
US6913680B1 (en) * 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition
US7273535B2 (en) * 2003-09-17 2007-09-25 Applied Materials, Inc. Insoluble anode with an auxiliary electrode
JP2002212786A (ja) 2001-01-17 2002-07-31 Ebara Corp 基板処理装置
TW554069B (en) 2001-08-10 2003-09-21 Ebara Corp Plating device and method
US6664122B1 (en) * 2001-10-19 2003-12-16 Novellus Systems, Inc. Electroless copper deposition method for preparing copper seed layers
JP2003221698A (ja) 2002-01-29 2003-08-08 Mitsubishi Electric Corp めっき装置
US7247222B2 (en) * 2002-07-24 2007-07-24 Applied Materials, Inc. Electrochemical processing cell
US8262871B1 (en) 2008-12-19 2012-09-11 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
KR101087229B1 (ko) * 2009-02-17 2011-11-29 세메스 주식회사 기판 처리 장치 및 방법
JP2012007201A (ja) 2010-06-23 2012-01-12 Lapis Semiconductor Co Ltd めっき装置
US20120308346A1 (en) * 2011-06-03 2012-12-06 Arthur Keigler Parallel single substrate processing system loader
US9945044B2 (en) 2013-11-06 2018-04-17 Lam Research Corporation Method for uniform flow behavior in an electroplating cell

Also Published As

Publication number Publication date
US20180202062A1 (en) 2018-07-19
US9945044B2 (en) 2018-04-17
KR102358030B1 (ko) 2022-01-28
TWI667374B (zh) 2019-08-01
US10711364B2 (en) 2020-07-14
US20150122638A1 (en) 2015-05-07
KR20220017982A (ko) 2022-02-14
SG10201803755PA (en) 2018-06-28
KR20150052801A (ko) 2015-05-14
KR102583188B1 (ko) 2023-09-27
TW201525197A (zh) 2015-07-01

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