SG11201508392QA - Method and device for electrodeposition in cylindrical geometry - Google Patents
Method and device for electrodeposition in cylindrical geometryInfo
- Publication number
- SG11201508392QA SG11201508392QA SG11201508392QA SG11201508392QA SG11201508392QA SG 11201508392Q A SG11201508392Q A SG 11201508392QA SG 11201508392Q A SG11201508392Q A SG 11201508392QA SG 11201508392Q A SG11201508392Q A SG 11201508392QA SG 11201508392Q A SG11201508392Q A SG 11201508392QA
- Authority
- SG
- Singapore
- Prior art keywords
- electrodeposition
- cylindrical geometry
- geometry
- cylindrical
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/028—Electroplating of selected surface areas one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0635—In radial cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/04—Electrolytic coating other than with metals with inorganic materials
- C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/003—Electroplating using gases, e.g. pressure influence
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1353249A FR3004466B1 (en) | 2013-04-10 | 2013-04-10 | ELECTRO-DEPOSITION METHOD AND DEVICE IN CYLINDRICAL GEOMETRY |
| PCT/FR2014/050703 WO2014167201A1 (en) | 2013-04-10 | 2014-03-25 | Method and device for electrodeposition in cylindrical geometry |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201508392QA true SG11201508392QA (en) | 2015-11-27 |
Family
ID=48906287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201508392QA SG11201508392QA (en) | 2013-04-10 | 2014-03-25 | Method and device for electrodeposition in cylindrical geometry |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10167565B2 (en) |
| EP (1) | EP2984211A1 (en) |
| JP (1) | JP2016519720A (en) |
| CN (1) | CN105324518B (en) |
| FR (1) | FR3004466B1 (en) |
| SG (1) | SG11201508392QA (en) |
| TW (1) | TWI507567B (en) |
| WO (1) | WO2014167201A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109423686B (en) * | 2017-09-01 | 2021-03-02 | 泉州市同兴反光材料有限公司 | Round electroplating bath |
| KR102225379B1 (en) * | 2018-11-27 | 2021-03-10 | 한국에너지기술연구원 | Continuous reactor type core-shell catalyst electrode manufacturing apparatus and method Thereof |
| CN110438537B (en) * | 2019-08-09 | 2021-10-01 | 常州大学 | High-flux heat exchange tube and preparation method and application thereof |
| CN110592645B (en) * | 2019-09-23 | 2021-08-17 | 徐州徐工液压件有限公司 | Novel electroplating hanger for inner wall of oil cylinder |
| CN110644023B (en) * | 2019-09-27 | 2021-04-27 | 江苏澳光电子有限公司 | Winding reinforced type cylindrical body electroplating process and electroplating structure thereof |
| CN113549982B (en) * | 2021-07-26 | 2022-12-13 | 成都飞机工业（集团）有限责任公司 | Cylindrical part electroplating device and electroplating method |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US902892A (en) * | 1908-06-27 | 1908-11-03 | American Circular Loom Co | Method of and apparatus for electroplating. |
| US4102770A (en) * | 1977-07-18 | 1978-07-25 | American Chemical And Refining Company Incorporated | Electroplating test cell |
| JPS5881990A (en) * | 1981-11-11 | 1983-05-17 | Fujitsu Ltd | Electroplating treatment |
| DE3343544A1 (en) * | 1983-12-01 | 1985-06-13 | Carl Aug. Heinz Glashüttenwerke GmbH & Co KG, 8641 Tettau | TREATMENT DEVICE FOR TREATING OBJECTS |
| JPH0632366B2 (en) * | 1985-07-19 | 1994-04-27 | 日立電線株式会社 | Electric plating method on flexible printed wiring board |
| JPH0222499A (en) * | 1988-07-12 | 1990-01-25 | Yamaha Corp | Plating equipment |
| DE19751021C2 (en) | 1997-11-18 | 2000-04-27 | Bolta Werke Gmbh | Process for the production of a cobalt foil |
| JP2000002598A (en) * | 1998-06-15 | 2000-01-07 | Yamamoto Mekki Shikenki:Kk | Apparatus for testing high-speed electroplating internal stress |
| US6162333A (en) * | 1999-01-22 | 2000-12-19 | Renovare International, Inc. | Electrochemical cell for removal of metals from solutions |
| US6139711A (en) * | 1999-02-17 | 2000-10-31 | Lucent Technologies Inc. | Hydrodynamically controlled hull cell and method of use |
| GB2360235B (en) | 2000-03-10 | 2002-02-06 | Platarg Engineering Ltd | Workpiece ejector for transfer press |
| US7189647B2 (en) * | 2001-04-05 | 2007-03-13 | Novellus Systems, Inc. | Sequential station tool for wet processing of semiconductor wafers |
| KR20090050588A (en) * | 2007-11-16 | 2009-05-20 | 삼성전기주식회사 | Circular plating bath |
| FR2975107B1 (en) | 2011-05-10 | 2014-01-10 | Electricite De France | TREATMENT OF A PRECURSOR BY INJECTION OF A REACTIVE ELEMENT IN A STEAM PHASE. |
| FR2975223B1 (en) | 2011-05-10 | 2016-12-23 | Electricite De France | THERMAL TREATMENT BY INJECTION OF A CALOPORANT GAS. |
-
2013
- 2013-04-10 FR FR1353249A patent/FR3004466B1/en active Active
-
2014
- 2014-03-25 CN CN201480031016.7A patent/CN105324518B/en active Active
- 2014-03-25 JP JP2016507026A patent/JP2016519720A/en active Pending
- 2014-03-25 WO PCT/FR2014/050703 patent/WO2014167201A1/en active Application Filing
- 2014-03-25 SG SG11201508392QA patent/SG11201508392QA/en unknown
- 2014-03-25 US US14/783,553 patent/US10167565B2/en active Active
- 2014-03-25 EP EP14719044.1A patent/EP2984211A1/en not_active Withdrawn
- 2014-04-09 TW TW103113095A patent/TWI507567B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| FR3004466B1 (en) | 2015-05-15 |
| TW201441425A (en) | 2014-11-01 |
| CN105324518A (en) | 2016-02-10 |
| EP2984211A1 (en) | 2016-02-17 |
| CN105324518B (en) | 2019-04-16 |
| US10167565B2 (en) | 2019-01-01 |
| TWI507567B (en) | 2015-11-11 |
| WO2014167201A1 (en) | 2014-10-16 |
| JP2016519720A (en) | 2016-07-07 |
| US20160083861A1 (en) | 2016-03-24 |
| FR3004466A1 (en) | 2014-10-17 |
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