SG10201407243SA - Method for uniform flow behavior in an electroplating cell - Google Patents
Method for uniform flow behavior in an electroplating cellInfo
- Publication number
- SG10201407243SA SG10201407243SA SG10201407243SA SG10201407243SA SG10201407243SA SG 10201407243S A SG10201407243S A SG 10201407243SA SG 10201407243S A SG10201407243S A SG 10201407243SA SG 10201407243S A SG10201407243S A SG 10201407243SA SG 10201407243S A SG10201407243S A SG 10201407243SA
- Authority
- SG
- Singapore
- Prior art keywords
- uniform flow
- flow behavior
- electroplating cell
- electroplating
- cell
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/073,022 US9945044B2 (en) | 2013-11-06 | 2013-11-06 | Method for uniform flow behavior in an electroplating cell |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201407243SA true SG10201407243SA (en) | 2015-06-29 |
Family
ID=53006190
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201803755PA SG10201803755PA (en) | 2013-11-06 | 2014-11-05 | Method for uniform flow behavior in an electroplating cell |
SG10201407243SA SG10201407243SA (en) | 2013-11-06 | 2014-11-05 | Method for uniform flow behavior in an electroplating cell |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201803755PA SG10201803755PA (en) | 2013-11-06 | 2014-11-05 | Method for uniform flow behavior in an electroplating cell |
Country Status (4)
Country | Link |
---|---|
US (2) | US9945044B2 (en) |
KR (2) | KR102358030B1 (en) |
SG (2) | SG10201803755PA (en) |
TW (1) | TWI667374B (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9945044B2 (en) | 2013-11-06 | 2018-04-17 | Lam Research Corporation | Method for uniform flow behavior in an electroplating cell |
WO2018071598A1 (en) * | 2016-10-12 | 2018-04-19 | Lam Research Corporation | Pad raising mechanism in wafer positioning pedestal for semiconductor processing |
TW202246583A (en) | 2017-07-10 | 2022-12-01 | 美商應用材料股份有限公司 | Plating systems having reduced air entrainment |
US10494731B2 (en) * | 2017-12-11 | 2019-12-03 | Applied Materials, Inc. | Electroplating dynamic edge control |
US10903050B2 (en) | 2018-12-10 | 2021-01-26 | Lam Research Corporation | Endpoint sensor based control including adjustment of an edge ring parameter for each substrate processed to maintain etch rate uniformity |
CN112397422B (en) * | 2020-11-19 | 2023-08-29 | 苏州尊恒半导体科技有限公司 | Wafer deep hole electroplating pretreatment wetting method |
US11427924B1 (en) * | 2021-04-16 | 2022-08-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus for electro-chemical plating |
WO2023146591A1 (en) * | 2022-01-26 | 2023-08-03 | Applied Materials, Inc. | Surging flow for bubble clearing in electroplating systems |
KR102597424B1 (en) | 2022-10-20 | 2023-11-02 | 최일규 | Plating solution outflow system for electrolytic copper foil making machine |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4466864A (en) * | 1983-12-16 | 1984-08-21 | At&T Technologies, Inc. | Methods of and apparatus for electroplating preselected surface regions of electrical articles |
US5865976A (en) | 1994-10-07 | 1999-02-02 | Toyoda Gosei Co., Inc. | Plating method |
US5980706A (en) * | 1996-07-15 | 1999-11-09 | Semitool, Inc. | Electrode semiconductor workpiece holder |
US5883762A (en) * | 1997-03-13 | 1999-03-16 | Calhoun; Robert B. | Electroplating apparatus and process for reducing oxidation of oxidizable plating anions and cations |
JPH1180989A (en) * | 1997-09-02 | 1999-03-26 | Oki Electric Ind Co Ltd | Plating apparatus |
AU5907798A (en) * | 1997-09-30 | 1999-04-23 | Semitool, Inc. | Electroplating system having auxiliary electrode exterior to main reactor chamber for contact cleaning operations |
US6080291A (en) * | 1998-07-10 | 2000-06-27 | Semitool, Inc. | Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member |
US6254760B1 (en) * | 1999-03-05 | 2001-07-03 | Applied Materials, Inc. | Electro-chemical deposition system and method |
US6613214B2 (en) * | 1998-11-30 | 2003-09-02 | Applied Materials, Inc. | Electric contact element for electrochemical deposition system and method |
WO2000038218A2 (en) | 1998-12-22 | 2000-06-29 | Steag Microtech Gmbh | Device and method for treating substrates |
US6136163A (en) * | 1999-03-05 | 2000-10-24 | Applied Materials, Inc. | Apparatus for electro-chemical deposition with thermal anneal chamber |
US6585876B2 (en) * | 1999-04-08 | 2003-07-01 | Applied Materials Inc. | Flow diffuser to be used in electro-chemical plating system and method |
KR100707121B1 (en) * | 1999-04-13 | 2007-04-16 | 세미툴 인코포레이티드 | An apparatus for electrochemically processing a microelectronic workpiece and a method for electroplating a material on a microelectronic workpiece |
US6916412B2 (en) * | 1999-04-13 | 2005-07-12 | Semitool, Inc. | Adaptable electrochemical processing chamber |
US6361675B1 (en) | 1999-12-01 | 2002-03-26 | Motorola, Inc. | Method of manufacturing a semiconductor component and plating tool therefor |
US6913680B1 (en) * | 2000-05-02 | 2005-07-05 | Applied Materials, Inc. | Method of application of electrical biasing to enhance metal deposition |
US7273535B2 (en) * | 2003-09-17 | 2007-09-25 | Applied Materials, Inc. | Insoluble anode with an auxiliary electrode |
JP2002212786A (en) | 2001-01-17 | 2002-07-31 | Ebara Corp | Substrate processor |
TW554069B (en) | 2001-08-10 | 2003-09-21 | Ebara Corp | Plating device and method |
US6664122B1 (en) * | 2001-10-19 | 2003-12-16 | Novellus Systems, Inc. | Electroless copper deposition method for preparing copper seed layers |
JP2003221698A (en) | 2002-01-29 | 2003-08-08 | Mitsubishi Electric Corp | Plating apparatus |
US7247222B2 (en) * | 2002-07-24 | 2007-07-24 | Applied Materials, Inc. | Electrochemical processing cell |
US8262871B1 (en) | 2008-12-19 | 2012-09-11 | Novellus Systems, Inc. | Plating method and apparatus with multiple internally irrigated chambers |
KR101087229B1 (en) * | 2009-02-17 | 2011-11-29 | 세메스 주식회사 | Apparatus and method for processing substrate |
JP2012007201A (en) | 2010-06-23 | 2012-01-12 | Lapis Semiconductor Co Ltd | Plating device |
TWI564988B (en) * | 2011-06-03 | 2017-01-01 | Tel Nexx公司 | Parallel and single substrate processing system |
US9945044B2 (en) | 2013-11-06 | 2018-04-17 | Lam Research Corporation | Method for uniform flow behavior in an electroplating cell |
-
2013
- 2013-11-06 US US14/073,022 patent/US9945044B2/en active Active
-
2014
- 2014-11-05 SG SG10201803755PA patent/SG10201803755PA/en unknown
- 2014-11-05 TW TW103138434A patent/TWI667374B/en active
- 2014-11-05 SG SG10201407243SA patent/SG10201407243SA/en unknown
- 2014-11-06 KR KR1020140153774A patent/KR102358030B1/en active IP Right Grant
-
2018
- 2018-03-16 US US15/923,873 patent/US10711364B2/en active Active
-
2022
- 2022-01-26 KR KR1020220011773A patent/KR102583188B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TWI667374B (en) | 2019-08-01 |
KR102583188B1 (en) | 2023-09-27 |
TW201525197A (en) | 2015-07-01 |
KR20220017982A (en) | 2022-02-14 |
US20180202062A1 (en) | 2018-07-19 |
US9945044B2 (en) | 2018-04-17 |
KR20150052801A (en) | 2015-05-14 |
KR102358030B1 (en) | 2022-01-28 |
US20150122638A1 (en) | 2015-05-07 |
US10711364B2 (en) | 2020-07-14 |
SG10201803755PA (en) | 2018-06-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HRP20181491T1 (en) | Method for maintaining water quality in large water bodies | |
IL241627B (en) | Method for activating t cells | |
HK1220056A1 (en) | Method and apparatus for testing cell phones | |
EP2984468A4 (en) | Automated set-up for cell sorting | |
SG10201407243SA (en) | Method for uniform flow behavior in an electroplating cell | |
EP3016192A4 (en) | Fuel cell and method for manufacturing same | |
EP2913921A4 (en) | Solar cell apparatus and method for manufacturing same | |
EP2980207A4 (en) | Cell sorting method | |
EP2963724A4 (en) | Fuel cell device and manufacturing method for same | |
EP2955777A4 (en) | Fuel cell and method for manufacturing same | |
IL245392B (en) | Cell culture method | |
HK1219175A1 (en) | Electrochemical cell | |
EP2957630A4 (en) | Undifferentiated cell elimination method | |
HK1212735A1 (en) | Method for evaluating an immunorepertoire | |
EP3000876A4 (en) | Method for preparing nk cells | |
EP2988337A4 (en) | Solar cell and method for manufacturing solar cell | |
EP2998269A4 (en) | Fuel cell and method for manufacturing same | |
EP3024081A4 (en) | Method for producing cell | |
ZA201400415B (en) | Method for operating an electrolytic cell | |
SG11201508392QA (en) | Method and device for electrodeposition in cylindrical geometry | |
GB2535017B (en) | CART-based Flow Simulations for Predicting Changes in Reservoir Properties | |
EP2980202A4 (en) | Cell culture apparatus and cell culture method | |
PL2978839T3 (en) | Method for cell culture | |
IL240033B (en) | Method for assessing cell aging | |
EP2922117A4 (en) | Electrolyte injection method |