SG10201404443QA - Conductive composition - Google Patents

Conductive composition

Info

Publication number
SG10201404443QA
SG10201404443QA SG10201404443QA SG10201404443QA SG10201404443QA SG 10201404443Q A SG10201404443Q A SG 10201404443QA SG 10201404443Q A SG10201404443Q A SG 10201404443QA SG 10201404443Q A SG10201404443Q A SG 10201404443QA SG 10201404443Q A SG10201404443Q A SG 10201404443QA
Authority
SG
Singapore
Prior art keywords
conductive composition
conductive
composition
Prior art date
Application number
SG10201404443QA
Other languages
English (en)
Inventor
Hagedorn Hans-Werner
Lower Yvonne
Dickel Tanja
Stenger Katja
Xin Yong Ling
Wei Teo Keng
Fritzsche Sebastian
Schafer Michael
Original Assignee
Heraeus Deutschland Gmbh & Co Kg
Heraeus Materials Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Deutschland Gmbh & Co Kg, Heraeus Materials Singapore Pte Ltd filed Critical Heraeus Deutschland Gmbh & Co Kg
Priority to SG10201404443QA priority Critical patent/SG10201404443QA/en
Priority to TW104119631A priority patent/TW201614676A/zh
Priority to PCT/SG2015/000131 priority patent/WO2016018191A1/fr
Publication of SG10201404443QA publication Critical patent/SG10201404443QA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG10201404443QA 2014-07-29 2014-07-29 Conductive composition SG10201404443QA (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SG10201404443QA SG10201404443QA (en) 2014-07-29 2014-07-29 Conductive composition
TW104119631A TW201614676A (en) 2014-07-29 2015-06-17 Conductive composition
PCT/SG2015/000131 WO2016018191A1 (fr) 2014-07-29 2015-06-19 Composition électroconductrice à base de résine époxyde

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201404443QA SG10201404443QA (en) 2014-07-29 2014-07-29 Conductive composition

Publications (1)

Publication Number Publication Date
SG10201404443QA true SG10201404443QA (en) 2016-02-26

Family

ID=53887172

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201404443QA SG10201404443QA (en) 2014-07-29 2014-07-29 Conductive composition

Country Status (3)

Country Link
SG (1) SG10201404443QA (fr)
TW (1) TW201614676A (fr)
WO (1) WO2016018191A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3362530A4 (fr) * 2015-10-15 2019-06-05 Henkel IP & Holding GmbH Utilisation de nickel et d'alliages contenant du nickel en tant que charges conductrices dans des formulations adhésives
DE102017008925A1 (de) * 2017-09-25 2019-03-28 Hexion GmbH Imprägnierharzmischung
CN112371150B (zh) * 2020-10-26 2021-09-17 厦门大学 镍铝双金属氮碳掺杂催化剂及其制备方法和其催化乙酰丙酸加氢制备γ-戊内酯的应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5920371A (ja) * 1982-07-27 1984-02-02 Toyo Ink Mfg Co Ltd 導電性接着剤
JPS59130004A (ja) * 1983-01-18 1984-07-26 三井東圧化学株式会社 銀ペ−スト
KR101036353B1 (ko) * 2009-04-14 2011-05-23 엘지이노텍 주식회사 스크린 프린팅이 가능한 반도체 패키징용 접착 페이스트
CN101792627A (zh) * 2010-03-10 2010-08-04 彩虹集团公司 一种屏蔽导电油墨及其制备方法

Also Published As

Publication number Publication date
TW201614676A (en) 2016-04-16
WO2016018191A1 (fr) 2016-02-04

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