SG10201404443QA - Conductive composition - Google Patents
Conductive compositionInfo
- Publication number
- SG10201404443QA SG10201404443QA SG10201404443QA SG10201404443QA SG10201404443QA SG 10201404443Q A SG10201404443Q A SG 10201404443QA SG 10201404443Q A SG10201404443Q A SG 10201404443QA SG 10201404443Q A SG10201404443Q A SG 10201404443QA SG 10201404443Q A SG10201404443Q A SG 10201404443QA
- Authority
- SG
- Singapore
- Prior art keywords
- conductive composition
- conductive
- composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG10201404443QA SG10201404443QA (en) | 2014-07-29 | 2014-07-29 | Conductive composition |
TW104119631A TW201614676A (en) | 2014-07-29 | 2015-06-17 | Conductive composition |
PCT/SG2015/000131 WO2016018191A1 (fr) | 2014-07-29 | 2015-06-19 | Composition électroconductrice à base de résine époxyde |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG10201404443QA SG10201404443QA (en) | 2014-07-29 | 2014-07-29 | Conductive composition |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201404443QA true SG10201404443QA (en) | 2016-02-26 |
Family
ID=53887172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201404443QA SG10201404443QA (en) | 2014-07-29 | 2014-07-29 | Conductive composition |
Country Status (3)
Country | Link |
---|---|
SG (1) | SG10201404443QA (fr) |
TW (1) | TW201614676A (fr) |
WO (1) | WO2016018191A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3362530A4 (fr) * | 2015-10-15 | 2019-06-05 | Henkel IP & Holding GmbH | Utilisation de nickel et d'alliages contenant du nickel en tant que charges conductrices dans des formulations adhésives |
DE102017008925A1 (de) * | 2017-09-25 | 2019-03-28 | Hexion GmbH | Imprägnierharzmischung |
CN112371150B (zh) * | 2020-10-26 | 2021-09-17 | 厦门大学 | 镍铝双金属氮碳掺杂催化剂及其制备方法和其催化乙酰丙酸加氢制备γ-戊内酯的应用 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5920371A (ja) * | 1982-07-27 | 1984-02-02 | Toyo Ink Mfg Co Ltd | 導電性接着剤 |
JPS59130004A (ja) * | 1983-01-18 | 1984-07-26 | 三井東圧化学株式会社 | 銀ペ−スト |
KR101036353B1 (ko) * | 2009-04-14 | 2011-05-23 | 엘지이노텍 주식회사 | 스크린 프린팅이 가능한 반도체 패키징용 접착 페이스트 |
CN101792627A (zh) * | 2010-03-10 | 2010-08-04 | 彩虹集团公司 | 一种屏蔽导电油墨及其制备方法 |
-
2014
- 2014-07-29 SG SG10201404443QA patent/SG10201404443QA/en unknown
-
2015
- 2015-06-17 TW TW104119631A patent/TW201614676A/zh unknown
- 2015-06-19 WO PCT/SG2015/000131 patent/WO2016018191A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
TW201614676A (en) | 2016-04-16 |
WO2016018191A1 (fr) | 2016-02-04 |
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