SG10201403275UA - Automatic fault detection and classification in a plasma processing system and methods thereof - Google Patents

Automatic fault detection and classification in a plasma processing system and methods thereof

Info

Publication number
SG10201403275UA
SG10201403275UA SG10201403275UA SG10201403275UA SG10201403275UA SG 10201403275U A SG10201403275U A SG 10201403275UA SG 10201403275U A SG10201403275U A SG 10201403275UA SG 10201403275U A SG10201403275U A SG 10201403275UA SG 10201403275U A SG10201403275U A SG 10201403275UA
Authority
SG
Singapore
Prior art keywords
classification
methods
processing system
plasma processing
fault detection
Prior art date
Application number
SG10201403275UA
Inventor
Gunsu Yun
Vijayakumar C Venugopal
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201403275UA publication Critical patent/SG10201403275UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/3299—Feedback systems
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Databases & Information Systems (AREA)
  • Data Mining & Analysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
SG10201403275UA 2009-06-30 2010-06-29 Automatic fault detection and classification in a plasma processing system and methods thereof SG10201403275UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US22209809P 2009-06-30 2009-06-30

Publications (1)

Publication Number Publication Date
SG10201403275UA true SG10201403275UA (en) 2014-09-26

Family

ID=43411703

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201403275UA SG10201403275UA (en) 2009-06-30 2010-06-29 Automatic fault detection and classification in a plasma processing system and methods thereof
SG2011091717A SG176797A1 (en) 2009-06-30 2010-06-29 Automatic fault detection and classification in a plasma processing system and methods thereof

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2011091717A SG176797A1 (en) 2009-06-30 2010-06-29 Automatic fault detection and classification in a plasma processing system and methods thereof

Country Status (7)

Country Link
US (1) US8989888B2 (en)
JP (1) JP5735499B2 (en)
KR (1) KR101799603B1 (en)
CN (1) CN102473660B (en)
SG (2) SG10201403275UA (en)
TW (1) TWI509376B (en)
WO (1) WO2011002798A2 (en)

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US8983631B2 (en) * 2009-06-30 2015-03-17 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
US8618807B2 (en) * 2009-06-30 2013-12-31 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
US8538572B2 (en) * 2009-06-30 2013-09-17 Lam Research Corporation Methods for constructing an optimal endpoint algorithm
US8473089B2 (en) * 2009-06-30 2013-06-25 Lam Research Corporation Methods and apparatus for predictive preventive maintenance of processing chambers
CN103250107A (en) * 2010-12-31 2013-08-14 中国科学院自动化研究所 Intelligent detecting system and detecting method for detecting fault of device
JP5779482B2 (en) 2011-11-15 2015-09-16 株式会社日立ハイテクノロジーズ Plasma processing apparatus and plasma processing method
CN102539192B (en) * 2012-01-20 2015-06-17 北京信息科技大学 Failure prediction method based on ICA reconstruction
US10128090B2 (en) 2012-02-22 2018-11-13 Lam Research Corporation RF impedance model based fault detection
CN104063984A (en) * 2013-03-21 2014-09-24 英华达（南京）科技有限公司 Automatic standard exceeding alarm method of defective product
KR102026069B1 (en) 2013-08-05 2019-09-30 삼성전자 주식회사 Segmentation system of sensor data in semiconductor manufacturing equipment and method thereof
KR102339317B1 (en) * 2013-12-13 2021-12-14 램 리써치 코포레이션 Rf impedance model based fault detection
US10950421B2 (en) * 2014-04-21 2021-03-16 Lam Research Corporation Using modeling for identifying a location of a fault in an RF transmission system for a plasma system
KR102223623B1 (en) 2014-07-30 2021-03-08 삼성전자주식회사 method for managing a semiconductor manufacturing equipment and management system of the same
US20160048399A1 (en) * 2014-08-15 2016-02-18 At&T Intellectual Property I, L.P. Orchestrated sensor set
US10133263B1 (en) 2014-08-18 2018-11-20 Kla-Tencor Corporation Process condition based dynamic defect inspection
US10692705B2 (en) * 2015-11-16 2020-06-23 Tokyo Electron Limited Advanced optical sensor and method for detecting an optical event in a light emission signal in a plasma chamber
JP6675014B2 (en) * 2016-11-30 2020-04-01 株式会社日立製作所 Data collection system, abnormality detection method, and gateway device
JP6840013B2 (en) * 2017-03-31 2021-03-10 アズビル株式会社 Time series data recording method and equipment
JP6857068B2 (en) * 2017-03-31 2021-04-14 アズビル株式会社 Time series data recording method and equipment
US10545821B2 (en) * 2017-07-31 2020-01-28 Hewlett Packard Enterprise Development Lp Fault-tolerant dot product engine
KR101994036B1 (en) * 2018-02-21 2019-06-27 한양대학교 산학협력단 Plasma monitoring apparatus
WO2019226462A1 (en) * 2018-05-25 2019-11-28 Lam Research Corporation Heater fault determination during processing
US11316537B2 (en) 2019-06-03 2022-04-26 Hewlett Packard Enterprise Development Lp Fault-tolerant analog computing
CN110380389B (en) * 2019-06-25 2021-09-10 昆明理工大学 Novel hybrid compensation line transient state quantity direction protection method based on two-dimensional judgment plane
JP7482651B2 (en) * 2020-03-04 2024-05-14 キヤノン株式会社 Information processing device, monitoring method, program, and article manufacturing method
EP4242904A3 (en) 2021-07-02 2023-11-01 Comet AG Method for machine learning a detection of at least one irregularity in a plasma system
EP4113352A1 (en) 2021-07-02 2023-01-04 Comet AG A method for improving digital signal processing in a radio-frequency system
EP4113574B1 (en) 2021-07-02 2024-01-03 Comet AG Method for machine learning a detection of at least one irregularity in a plasma system

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US5710555A (en) * 1994-03-01 1998-01-20 Sonic Systems Corporation Siren detector
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WO2004003968A2 (en) * 2002-06-28 2004-01-08 Tokyo Electron Limited Method and system for arc suppression in a plasma processing system
US8073667B2 (en) * 2003-09-30 2011-12-06 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process
US8014991B2 (en) * 2003-09-30 2011-09-06 Tokyo Electron Limited System and method for using first-principles simulation to characterize a semiconductor manufacturing process
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Also Published As

Publication number Publication date
US8989888B2 (en) 2015-03-24
KR20120107846A (en) 2012-10-04
JP2012532425A (en) 2012-12-13
WO2011002798A3 (en) 2011-03-17
JP5735499B2 (en) 2015-06-17
US20120101622A1 (en) 2012-04-26
KR101799603B1 (en) 2017-11-20
TWI509376B (en) 2015-11-21
WO2011002798A2 (en) 2011-01-06
TW201122743A (en) 2011-07-01
CN102473660B (en) 2015-03-18
SG176797A1 (en) 2012-01-30
CN102473660A (en) 2012-05-23

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