SE9904163L - - Google Patents
Info
- Publication number
- SE9904163L SE9904163L SE9904163A SE9904163A SE9904163L SE 9904163 L SE9904163 L SE 9904163L SE 9904163 A SE9904163 A SE 9904163A SE 9904163 A SE9904163 A SE 9904163A SE 9904163 L SE9904163 L SE 9904163L
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0208—Semi-insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2054—Methods of obtaining the confinement
- H01S5/2059—Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion
- H01S5/2063—Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion obtained by particle bombardment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/926—Multiple bond pads having different sizes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB9826227A GB2344455A (en) | 1998-12-01 | 1998-12-01 | Semiconductor device with low parasitic capacitance |
| US09/425,953 US6287881B1 (en) | 1998-12-01 | 1999-10-25 | Semiconductor device with low parasitic capacitance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SE9904163D0 SE9904163D0 (sv) | 1999-11-18 |
| SE9904163L true SE9904163L (cg-RX-API-DMAC10.html) | 2000-06-02 |
Family
ID=26314752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE9904163A SE9904163D0 (sv) | 1998-12-01 | 1999-11-18 | Halvledaranordning med låg parasitisk kapacitans |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6287881B1 (cg-RX-API-DMAC10.html) |
| DE (1) | DE19956344A1 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2786614A1 (cg-RX-API-DMAC10.html) |
| GB (1) | GB2344455A (cg-RX-API-DMAC10.html) |
| SE (1) | SE9904163D0 (cg-RX-API-DMAC10.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7755604B2 (en) | 2006-06-19 | 2010-07-13 | Cypress Semiconductor Corporation | Optical navigation sensor with tracking and lift detection for optically transparent contact surfaces |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3748480A (en) * | 1970-11-02 | 1973-07-24 | Motorola Inc | Monolithic coupling device including light emitter and light sensor |
| US3881113A (en) * | 1973-12-26 | 1975-04-29 | Ibm | Integrated optically coupled light emitter and sensor |
| US4124860A (en) * | 1975-02-27 | 1978-11-07 | Optron, Inc. | Optical coupler |
| JPS52137279A (en) * | 1976-05-12 | 1977-11-16 | Hitachi Ltd | Semiconductor device for optical coupling |
| US4143385A (en) * | 1976-09-30 | 1979-03-06 | Hitachi, Ltd. | Photocoupler |
| US4274104A (en) * | 1979-05-21 | 1981-06-16 | International Business Machines Corporation | Electrooptical integrated circuit communication |
| US4275404A (en) * | 1979-10-05 | 1981-06-23 | Bell Telephone Laboratories, Incorporated | Monolithic opto-isolator |
| JP2772001B2 (ja) * | 1988-11-28 | 1998-07-02 | 株式会社日立製作所 | 半導体装置 |
| JP3012673B2 (ja) * | 1990-08-21 | 2000-02-28 | 三菱電機株式会社 | 半導体装置の製造方法 |
| SE469204B (sv) * | 1991-10-01 | 1993-05-24 | Asea Brown Boveri | Monolitisk optokopplare |
| JPH0927611A (ja) * | 1995-07-11 | 1997-01-28 | Seiko Epson Corp | 光検出部を備えた面発光型半導体レーザ及びその製造方法並びにそれを用いたセンサ |
-
1998
- 1998-12-01 GB GB9826227A patent/GB2344455A/en not_active Withdrawn
-
1999
- 1999-10-25 US US09/425,953 patent/US6287881B1/en not_active Expired - Fee Related
- 1999-11-18 SE SE9904163A patent/SE9904163D0/xx not_active Application Discontinuation
- 1999-11-19 FR FR9914809A patent/FR2786614A1/fr not_active Withdrawn
- 1999-11-24 DE DE19956344A patent/DE19956344A1/de not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| GB2344455A (en) | 2000-06-07 |
| SE9904163D0 (sv) | 1999-11-18 |
| DE19956344A1 (de) | 2000-06-08 |
| GB9826227D0 (en) | 1999-01-20 |
| FR2786614A1 (fr) | 2000-06-02 |
| US6287881B1 (en) | 2001-09-11 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NAV | Patent application has lapsed |