SE9503884D0 - Förfarande för att montera högtalare och högtalarmontage - Google Patents
Förfarande för att montera högtalare och högtalarmontageInfo
- Publication number
- SE9503884D0 SE9503884D0 SE9503884A SE9503884A SE9503884D0 SE 9503884 D0 SE9503884 D0 SE 9503884D0 SE 9503884 A SE9503884 A SE 9503884A SE 9503884 A SE9503884 A SE 9503884A SE 9503884 D0 SE9503884 D0 SE 9503884D0
- Authority
- SE
- Sweden
- Prior art keywords
- loudspeaker
- circuit board
- pct
- holes
- board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/60—Substation equipment, e.g. for use by subscribers including speech amplifiers
- H04M1/62—Constructional arrangements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Telephone Set Structure (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Telephone Function (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9503884A SE9503884L (sv) | 1995-11-03 | 1995-11-03 | Förfarande för att montera högtalare och högtalarmontage |
AU75916/96A AU712848B2 (en) | 1995-11-03 | 1996-10-25 | A method and device to fasten a loudspeaker to a circuit board |
JP9517266A JPH11514807A (ja) | 1995-11-03 | 1996-10-25 | スピーカを回路基板へ留める方法と装置 |
EP96938569A EP0872099B1 (en) | 1995-11-03 | 1996-10-25 | A method and device to fasten a loudspeaker to a circuit board |
US08/765,364 US5974655A (en) | 1995-11-03 | 1996-10-25 | Method of mounting loudspeakers and a loudspeaker mounting |
BR9611147A BR9611147A (pt) | 1995-11-03 | 1996-10-25 | Processo e dispositivo de montagem de alto-falante para montagem de pelo menos um alto-falante em equipamento de comunicações |
PCT/SE1996/001376 WO1997016913A1 (en) | 1995-11-03 | 1996-10-25 | A method and device to fasten a loudspeaker to a circuit board |
KR1019980702489A KR19990064012A (ko) | 1995-11-03 | 1996-10-25 | 확성기 장비와 확성기를 설치하는 방법 |
CNB961979879A CN1171431C (zh) | 1995-11-03 | 1996-10-25 | 一种固定扬声器到电路板的方法和装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9503884A SE9503884L (sv) | 1995-11-03 | 1995-11-03 | Förfarande för att montera högtalare och högtalarmontage |
Publications (2)
Publication Number | Publication Date |
---|---|
SE9503884D0 true SE9503884D0 (sv) | 1995-11-03 |
SE9503884L SE9503884L (sv) | 1997-05-04 |
Family
ID=20400070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9503884A SE9503884L (sv) | 1995-11-03 | 1995-11-03 | Förfarande för att montera högtalare och högtalarmontage |
Country Status (9)
Country | Link |
---|---|
US (1) | US5974655A (sv) |
EP (1) | EP0872099B1 (sv) |
JP (1) | JPH11514807A (sv) |
KR (1) | KR19990064012A (sv) |
CN (1) | CN1171431C (sv) |
AU (1) | AU712848B2 (sv) |
BR (1) | BR9611147A (sv) |
SE (1) | SE9503884L (sv) |
WO (1) | WO1997016913A1 (sv) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI221851B (en) * | 2000-04-05 | 2004-10-11 | Kaneka Corp | Vibration damper composition |
JP2004510280A (ja) * | 2000-05-22 | 2004-04-02 | シーゲイト テクノロジー エルエルシー | 接着フィルムを使用したディスク・ドライブの取付け |
FI111116B (sv) * | 2000-10-30 | 2003-05-30 | It Innovations Finland Oy | Framställningsförfarande för ett skal till mobiltelefon |
DE50107300D1 (de) * | 2001-10-08 | 2005-10-06 | Siemens Ag | Mobiles Kommunikationsendgerät mit im Gerätegehäuse angeordnetem Flachlautsprecher und einem weiteren Schallwandler angeordnet zu einem Zwei-Wege-Systems mit dem Flachlautsprecher |
US20030202671A1 (en) * | 2002-04-30 | 2003-10-30 | Koninklijke Philips Electronics N.V. | Product configuration with a double-side adhesive mounting disc |
JP4196089B2 (ja) * | 2003-08-29 | 2008-12-17 | パナソニック株式会社 | スピ−カ装置 |
JP2006222533A (ja) * | 2005-02-08 | 2006-08-24 | Aiphone Co Ltd | インターホンのスピーカ固定構造 |
US8150091B2 (en) * | 2007-12-14 | 2012-04-03 | Sony Ericsson Mobile Communications Ab | Printed circuit board for a flat-panel speaker |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2064264B (en) * | 1979-11-30 | 1983-08-03 | Pye Electronic Prod Ltd | Microphone unit |
SE451933B (sv) * | 1982-09-10 | 1987-11-02 | Ellemtel Utvecklings Ab | Hogtalarforsedd apparat |
DE3346461A1 (de) * | 1983-12-22 | 1985-07-04 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung einer fernsprechstation |
DK62484D0 (da) * | 1984-02-13 | 1984-02-13 | Gnt Automatic As | Kombineret transducerenhed til mikrotelefon |
GB2172437A (en) * | 1985-03-16 | 1986-09-17 | Marconi Electronic Devices | Printed circuits |
EP0218832B1 (de) * | 1985-09-30 | 1990-11-22 | Siemens Aktiengesellschaft | Bauelement für die Oberflächenmontage und Verfahren zur Befestigung eines Bauelements für die Oberflächenmontage |
GB2228209B (en) * | 1989-03-20 | 1993-02-03 | Kyooh Precision Industry Co Lt | Musical toy tumbler |
-
1995
- 1995-11-03 SE SE9503884A patent/SE9503884L/sv not_active Application Discontinuation
-
1996
- 1996-10-25 BR BR9611147A patent/BR9611147A/pt not_active Application Discontinuation
- 1996-10-25 US US08/765,364 patent/US5974655A/en not_active Expired - Lifetime
- 1996-10-25 WO PCT/SE1996/001376 patent/WO1997016913A1/en not_active Application Discontinuation
- 1996-10-25 EP EP96938569A patent/EP0872099B1/en not_active Expired - Lifetime
- 1996-10-25 AU AU75916/96A patent/AU712848B2/en not_active Ceased
- 1996-10-25 KR KR1019980702489A patent/KR19990064012A/ko not_active Application Discontinuation
- 1996-10-25 JP JP9517266A patent/JPH11514807A/ja active Pending
- 1996-10-25 CN CNB961979879A patent/CN1171431C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5974655A (en) | 1999-11-02 |
KR19990064012A (ko) | 1999-07-26 |
SE9503884L (sv) | 1997-05-04 |
CN1201574A (zh) | 1998-12-09 |
JPH11514807A (ja) | 1999-12-14 |
BR9611147A (pt) | 1999-03-30 |
AU7591696A (en) | 1997-05-22 |
CN1171431C (zh) | 2004-10-13 |
WO1997016913A1 (en) | 1997-05-09 |
EP0872099A1 (en) | 1998-10-21 |
AU712848B2 (en) | 1999-11-18 |
EP0872099B1 (en) | 2004-01-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |