SE9502240D0 - Magasin - Google Patents

Magasin

Info

Publication number
SE9502240D0
SE9502240D0 SE9502240A SE9502240A SE9502240D0 SE 9502240 D0 SE9502240 D0 SE 9502240D0 SE 9502240 A SE9502240 A SE 9502240A SE 9502240 A SE9502240 A SE 9502240A SE 9502240 D0 SE9502240 D0 SE 9502240D0
Authority
SE
Sweden
Prior art keywords
wall parts
mutually opposing
circuit board
mutually
guide strips
Prior art date
Application number
SE9502240A
Other languages
English (en)
Other versions
SE504430C2 (sv
SE9502240L (sv
Inventor
Lars Goeran Nygren
Uno Dahl
Jan Roger Wennerberg
Lars Yngve Bertilsson
Original Assignee
Ellemtel Utvecklings Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ellemtel Utvecklings Ab filed Critical Ellemtel Utvecklings Ab
Priority to SE9502240A priority Critical patent/SE504430C2/sv
Publication of SE9502240D0 publication Critical patent/SE9502240D0/sv
Priority to AU62468/96A priority patent/AU6246896A/en
Priority to PCT/SE1996/000787 priority patent/WO1997001264A1/en
Priority to US08/981,121 priority patent/US6201705B1/en
Publication of SE9502240L publication Critical patent/SE9502240L/sv
Publication of SE504430C2 publication Critical patent/SE504430C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1424—Card cages
    • H05K7/1425—Card cages of standardised dimensions, e.g. 19"-subrack

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Packages (AREA)
SE9502240A 1995-06-20 1995-06-20 Magasin SE504430C2 (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE9502240A SE504430C2 (sv) 1995-06-20 1995-06-20 Magasin
AU62468/96A AU6246896A (en) 1995-06-20 1996-06-17 Magazine
PCT/SE1996/000787 WO1997001264A1 (en) 1995-06-20 1996-06-17 Magazine
US08/981,121 US6201705B1 (en) 1995-06-20 1996-06-17 Magazine for enclosing a plurality of circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9502240A SE504430C2 (sv) 1995-06-20 1995-06-20 Magasin

Publications (3)

Publication Number Publication Date
SE9502240D0 true SE9502240D0 (sv) 1995-06-20
SE9502240L SE9502240L (sv) 1996-12-21
SE504430C2 SE504430C2 (sv) 1997-02-10

Family

ID=20398682

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9502240A SE504430C2 (sv) 1995-06-20 1995-06-20 Magasin

Country Status (4)

Country Link
US (1) US6201705B1 (sv)
AU (1) AU6246896A (sv)
SE (1) SE504430C2 (sv)
WO (1) WO1997001264A1 (sv)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6356444B1 (en) 1999-06-03 2002-03-12 Fujitsu Network Communications, Inc. Card shelf heat transfer system and method
DE10141652B4 (de) 2001-08-24 2011-04-07 Lts Lohmann Therapie-Systeme Ag Transdermales therapeutisches System auf der Basis von Polyacrylat-Haftklebern ohne funktionelle Gruppen und seine Verwendung
US6606248B2 (en) 2002-01-04 2003-08-12 Micron Technology, Inc. Universal memory module/PCB storage, transport, automation handling tray
TW592029B (en) * 2003-04-11 2004-06-11 Delta Electronics Inc Electronic apparatus with natural convection structure
US7236358B2 (en) * 2003-06-11 2007-06-26 Hewlett-Packard Development Company, L.P. Computer system
US6967847B2 (en) * 2003-06-11 2005-11-22 Hewlett-Packard Development Company, L.P. Computer system with movable card guide
US7136283B2 (en) * 2003-06-11 2006-11-14 Hewlett-Packard Development Company, L.P. Multi-computer system
JP4293004B2 (ja) * 2004-02-04 2009-07-08 株式会社デンソー 放電灯点灯装置
US7903405B1 (en) * 2009-09-18 2011-03-08 Fisher-Rosemount Systems, Inc. Electronic device enclosures having improved ventilation to dissipate heat
US8611088B2 (en) * 2011-11-16 2013-12-17 Cooper Technologies Company Mechanical heat pump for an electrical housing
WO2014118900A1 (ja) * 2013-01-29 2014-08-07 三菱電機株式会社 電子機器
US9326386B2 (en) 2013-04-22 2016-04-26 International Business Machines Corporation Computer system component bay
US9526191B2 (en) * 2013-05-15 2016-12-20 Dy 4 Systems Inc. Fluid cooled enclosure for circuit module apparatus and methods of cooling a conduction cooled circuit module
US11026343B1 (en) * 2013-06-20 2021-06-01 Flextronics Ap, Llc Thermodynamic heat exchanger
US10197310B2 (en) 2014-06-20 2019-02-05 Nortek Air Solutions Canada, Inc. Systems and methods for managing conditions in enclosed space
SG10201913923WA (en) 2015-05-15 2020-03-30 Nortek Air Solutions Canada Inc Using liquid to air membrane energy exchanger for liquid cooling
CA3010515C (en) 2016-01-08 2023-03-21 Nortek Air Solutions Canada, Inc. Integrated make-up air system in 100% air recirculation system
CN109219282A (zh) * 2017-06-29 2019-01-15 鸿富锦精密工业(武汉)有限公司 电子装置壳体
DE102018118275A1 (de) * 2018-07-27 2020-01-30 Valeo Siemens Eautomotive Germany Gmbh Rotoranordnung für eine elektrische Maschine, elektrische Maschine für ein Fahrzeug und Fahrzeug
CN114342232A (zh) * 2019-09-09 2022-04-12 三菱电机株式会社 电力转换装置及电力转换装置的制造方法
EP4124189A1 (en) * 2021-07-21 2023-01-25 HENSOLDT Sensors GmbH Closed housing for an electronic component

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4454566A (en) * 1981-11-27 1984-06-12 Bell Telephone Laboratories, Incorporated Heat removal from cabinets housing electronic equipment
EP0091733A1 (en) 1982-03-09 1983-10-19 BICC-Vero Electronics Limited Cooling module for use in a circuit board array
DE3606334A1 (de) * 1986-02-27 1987-09-10 Autz & Herrmann Maschf Waermetauscherelement
US4758924A (en) * 1986-05-29 1988-07-19 Honeywell Bull Inc. Electronic equipment housing
US4840225A (en) * 1987-04-10 1989-06-20 Digital Equipment Corporation Heat exchange element and enclosure incorporating same
DE3717009A1 (de) 1987-05-21 1988-12-15 Philips Patentverwaltung Funkgeraet fuer eine mobilfunkanlage
ES2128302T3 (es) * 1990-03-26 1999-05-16 Labinal Components & Systems Placa de transferencia termica y pastilla de circuito integrado u otros montajes de componentes electricos que incluyen dicha placa.
DE69112543D1 (de) * 1990-08-21 1995-10-05 Ibm Gekühltes elektrisches Gerät.
SE469298B (sv) * 1991-10-24 1993-06-14 Ericsson Telefon Ab L M Anordning foer kylning av elektronik medelst straalningsoeverfoering
US5218516A (en) * 1991-10-31 1993-06-08 Northern Telecom Limited Electronic module
FR2689361B1 (fr) * 1992-03-24 1994-05-13 Thomson Csf Dispositif de refroidissement de circuit inductif.
US5777846A (en) * 1996-05-30 1998-07-07 Northern Telecom Limited Circuit packs and circuit pack and shelf assemblies
US5844777A (en) * 1997-01-27 1998-12-01 At&T Corp. Apparatus for heat removal from a PC card array

Also Published As

Publication number Publication date
US6201705B1 (en) 2001-03-13
AU6246896A (en) 1997-01-22
WO1997001264A1 (en) 1997-01-09
SE504430C2 (sv) 1997-02-10
SE9502240L (sv) 1996-12-21

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Legal Events

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