SE9202077L - component Module - Google Patents

component Module

Info

Publication number
SE9202077L
SE9202077L SE9202077A SE9202077A SE9202077L SE 9202077 L SE9202077 L SE 9202077L SE 9202077 A SE9202077 A SE 9202077A SE 9202077 A SE9202077 A SE 9202077A SE 9202077 L SE9202077 L SE 9202077L
Authority
SE
Sweden
Prior art keywords
component module
carrier substrate
circuit
directly mounted
enclosing device
Prior art date
Application number
SE9202077A
Other languages
Swedish (sv)
Other versions
SE9202077D0 (en
Inventor
M O J Hedberg
Original Assignee
Ellemtel Utvecklings Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ellemtel Utvecklings Ab filed Critical Ellemtel Utvecklings Ab
Priority to SE9202077A priority Critical patent/SE9202077L/en
Publication of SE9202077D0 publication Critical patent/SE9202077D0/en
Priority to PCT/SE1993/000486 priority patent/WO1994001987A1/en
Priority to KR1019950700054A priority patent/KR950702790A/en
Priority to EP93915044A priority patent/EP0649590A1/en
Priority to BR9306685A priority patent/BR9306685A/en
Priority to AU45171/93A priority patent/AU4517193A/en
Priority to JP6503208A priority patent/JPH08501657A/en
Priority to MXPA93003941A priority patent/MXPA93003941A/en
Priority to CN93108141A priority patent/CN1041479C/en
Publication of SE9202077L publication Critical patent/SE9202077L/en
Priority to FI950058A priority patent/FI950058A/en
Priority to NO950038A priority patent/NO950038D0/en
Priority to AU46816/97A priority patent/AU4681697A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4285—Optical modules characterised by a connectorised pigtail
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
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    • G02B6/42—Coupling light guides with opto-electronic elements
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    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
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    • G02B6/42—Coupling light guides with opto-electronic elements
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    • G02B6/4286—Optical modules with optical power monitoring
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    • H01L2224/45001—Core members of the connector
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
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    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Abstract

The present invention relates to a component module (70) comprised by at least one internal or external carrier substrate, at least one circuit (71) with at least thereto belonging surrounding components or components (72). The circuit (71) is directly mounted to the carrier substrate and the component module (70) comprises an enclosing device and furthermore is so formed that it can be directly mounted onto an external carrier substrate and or a printed board externally having the form and dimensions of a standard circuit and the enclosing device at least in one direction essentially encapsulating the major part component module. The invention furthermore relates to a transceiver module per se forming component module.
SE9202077A 1992-07-06 1992-07-06 component Module SE9202077L (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
SE9202077A SE9202077L (en) 1992-07-06 1992-07-06 component Module
JP6503208A JPH08501657A (en) 1992-07-06 1993-06-02 Composition module
BR9306685A BR9306685A (en) 1992-07-06 1993-06-02 Component module and transceiver module
KR1019950700054A KR950702790A (en) 1992-07-06 1993-06-02 COMPONENT MODULE
EP93915044A EP0649590A1 (en) 1992-07-06 1993-06-02 Component module
PCT/SE1993/000486 WO1994001987A1 (en) 1992-07-06 1993-06-02 Component module
AU45171/93A AU4517193A (en) 1992-07-06 1993-06-02 Component module
MXPA93003941A MXPA93003941A (en) 1992-07-06 1993-06-30 Component module.
CN93108141A CN1041479C (en) 1992-07-06 1993-07-05 Component module
FI950058A FI950058A (en) 1992-07-06 1995-01-05 component module
NO950038A NO950038D0 (en) 1992-07-06 1995-01-05 component Module
AU46816/97A AU4681697A (en) 1992-07-06 1997-12-01 Component module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9202077A SE9202077L (en) 1992-07-06 1992-07-06 component Module

Publications (2)

Publication Number Publication Date
SE9202077D0 SE9202077D0 (en) 1992-07-06
SE9202077L true SE9202077L (en) 1994-01-07

Family

ID=20386708

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9202077A SE9202077L (en) 1992-07-06 1992-07-06 component Module

Country Status (11)

Country Link
EP (1) EP0649590A1 (en)
JP (1) JPH08501657A (en)
KR (1) KR950702790A (en)
CN (1) CN1041479C (en)
AU (2) AU4517193A (en)
BR (1) BR9306685A (en)
FI (1) FI950058A (en)
MX (1) MXPA93003941A (en)
NO (1) NO950038D0 (en)
SE (1) SE9202077L (en)
WO (1) WO1994001987A1 (en)

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EP0936485A1 (en) * 1998-02-12 1999-08-18 Alcatel Optoelectronic device
US6381283B1 (en) * 1998-10-07 2002-04-30 Controlnet, Inc. Integrated socket with chip carrier
DE10008340A1 (en) * 2000-02-23 2001-08-30 Siemens Ag Electronic circuit board for electronic devices, in particular communication terminals
JP2004523908A (en) * 2001-01-17 2004-08-05 ハネウェル・インターナショナル・インコーポレーテッド Adapters for plastic leaded chip carriers (PLCC) and other surface mount technology (SMT) chip carriers
US6894903B2 (en) 2001-02-28 2005-05-17 Sumitomo Electric Industries, Ltd. Optical data link
TW529181B (en) * 2001-02-28 2003-04-21 Sumitomo Electric Industries Optical data connector
FR2822246B1 (en) * 2001-03-15 2003-05-16 Opsitech Optical Sys On A Chip METHOD FOR MANUFACTURING AN OPTICAL PACKAGE AND OPTO-ELECTRONIC DEVICE
GB2385664B (en) * 2001-10-19 2004-03-10 Visteon Global Tech Inc LCC-Based strain-gage sensor integrated with cylinder-head gasket
US20040156149A1 (en) * 2002-09-05 2004-08-12 Odd Steijer Method of and apparatus for plastic optical-chip encapsulation
CN101378624B (en) * 2007-08-29 2010-11-10 海华科技股份有限公司 Module structure integrating perimeter circuit and manufacturing method thereof
CN101965104A (en) * 2010-04-20 2011-02-02 力帆实业(集团)股份有限公司 Circuit packaging device
US20130230272A1 (en) * 2012-03-01 2013-09-05 Oracle International Corporation Chip assembly configuration with densely packed optical interconnects
CN103413797B (en) * 2013-07-29 2015-10-14 中国科学院电工研究所 A kind of power semiconductor modular of three-dimensional structure unit assembling
CN103984065B (en) * 2014-05-30 2015-07-15 武汉光迅科技股份有限公司 Optical transmission module
CN106298761A (en) * 2016-09-24 2017-01-04 苏州捷研芯纳米科技有限公司 Photosensor package part, semi-finished product and batch method for packing

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US4979787A (en) * 1990-01-12 1990-12-25 Pco, Inc. Optical-electronic interface module

Also Published As

Publication number Publication date
JPH08501657A (en) 1996-02-20
FI950058A0 (en) 1995-01-05
AU4517193A (en) 1994-01-31
CN1081297A (en) 1994-01-26
FI950058A (en) 1995-01-05
MXPA93003941A (en) 2010-11-12
BR9306685A (en) 1998-12-08
EP0649590A1 (en) 1995-04-26
NO950038L (en) 1995-01-05
NO950038D0 (en) 1995-01-05
WO1994001987A1 (en) 1994-01-20
AU4681697A (en) 1998-02-05
CN1041479C (en) 1998-12-30
KR950702790A (en) 1995-07-29
SE9202077D0 (en) 1992-07-06

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