SE9101405L - MADE TO MANUFACTURE THE PATTERN PLATE THAT ALLOWS INCREASED PACKING DENSITY FOR COMPONENT MOUNTING - Google Patents

MADE TO MANUFACTURE THE PATTERN PLATE THAT ALLOWS INCREASED PACKING DENSITY FOR COMPONENT MOUNTING

Info

Publication number
SE9101405L
SE9101405L SE9101405A SE9101405A SE9101405L SE 9101405 L SE9101405 L SE 9101405L SE 9101405 A SE9101405 A SE 9101405A SE 9101405 A SE9101405 A SE 9101405A SE 9101405 L SE9101405 L SE 9101405L
Authority
SE
Sweden
Prior art keywords
holes
metal foil
manufacture
components
conductive planes
Prior art date
Application number
SE9101405A
Other languages
Swedish (sv)
Other versions
SE9101405D0 (en
SE467479B (en
Inventor
Karl-Erik Leeb
Original Assignee
Leeb Karl Erik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leeb Karl Erik filed Critical Leeb Karl Erik
Priority to SE9101405A priority Critical patent/SE467479B/en
Publication of SE9101405D0 publication Critical patent/SE9101405D0/en
Publication of SE9101405L publication Critical patent/SE9101405L/en
Publication of SE467479B publication Critical patent/SE467479B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Method of manufacturing circuit boards which permits increased compaction density when assembling components in that a laminate consisting of several plastic substrate and several laminated conductive planes of which one of the outer conductive planes is provided with an electrically insulating layer. The laminate is drilled through where contact is required after which the insulating surface layer and the holes are covered by a glued on metal foil which is then etched with the circuit. The walls of the hole and the part of the metal foil which covers the hole are plated with metal so that an electrical connection is obtained between the required conductive planes. Components can be soldered onto the metal foil surfaces which cover the holes without solder being drawn into the holes which means that the components can be placed directly over the holes or very close to them. <IMAGE>
SE9101405A 1991-05-10 1991-05-10 Method of manufacturing circuit boards which permits increased compaction density when assembling components SE467479B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SE9101405A SE467479B (en) 1991-05-10 1991-05-10 Method of manufacturing circuit boards which permits increased compaction density when assembling components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9101405A SE467479B (en) 1991-05-10 1991-05-10 Method of manufacturing circuit boards which permits increased compaction density when assembling components

Publications (3)

Publication Number Publication Date
SE9101405D0 SE9101405D0 (en) 1991-05-10
SE9101405L true SE9101405L (en) 1992-07-20
SE467479B SE467479B (en) 1992-07-20

Family

ID=20382687

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9101405A SE467479B (en) 1991-05-10 1991-05-10 Method of manufacturing circuit boards which permits increased compaction density when assembling components

Country Status (1)

Country Link
SE (1) SE467479B (en)

Also Published As

Publication number Publication date
SE9101405D0 (en) 1991-05-10
SE467479B (en) 1992-07-20

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