SE9101405D0 - MADE TO MANUFACTURE THE PATTERN PLATE THAT ALLOWS INCREASED PACKING DENSITY AT THE COMPONENT MOUNTING - Google Patents
MADE TO MANUFACTURE THE PATTERN PLATE THAT ALLOWS INCREASED PACKING DENSITY AT THE COMPONENT MOUNTINGInfo
- Publication number
- SE9101405D0 SE9101405D0 SE9101405A SE9101405A SE9101405D0 SE 9101405 D0 SE9101405 D0 SE 9101405D0 SE 9101405 A SE9101405 A SE 9101405A SE 9101405 A SE9101405 A SE 9101405A SE 9101405 D0 SE9101405 D0 SE 9101405D0
- Authority
- SE
- Sweden
- Prior art keywords
- holes
- metal foil
- manufacture
- components
- conductive planes
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000012856 packing Methods 0.000 title 1
- 239000002184 metal Substances 0.000 abstract 4
- 239000011888 foil Substances 0.000 abstract 3
- 238000005056 compaction Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 239000002344 surface layer Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Method of manufacturing circuit boards which permits increased compaction density when assembling components in that a laminate consisting of several plastic substrate and several laminated conductive planes of which one of the outer conductive planes is provided with an electrically insulating layer. The laminate is drilled through where contact is required after which the insulating surface layer and the holes are covered by a glued on metal foil which is then etched with the circuit. The walls of the hole and the part of the metal foil which covers the hole are plated with metal so that an electrical connection is obtained between the required conductive planes. Components can be soldered onto the metal foil surfaces which cover the holes without solder being drawn into the holes which means that the components can be placed directly over the holes or very close to them. <IMAGE>
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9101405A SE9101405L (en) | 1991-05-10 | 1991-05-10 | MADE TO MANUFACTURE THE PATTERN PLATE THAT ALLOWS INCREASED PACKING DENSITY FOR COMPONENT MOUNTING |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9101405A SE9101405L (en) | 1991-05-10 | 1991-05-10 | MADE TO MANUFACTURE THE PATTERN PLATE THAT ALLOWS INCREASED PACKING DENSITY FOR COMPONENT MOUNTING |
Publications (3)
Publication Number | Publication Date |
---|---|
SE9101405D0 true SE9101405D0 (en) | 1991-05-10 |
SE467479B SE467479B (en) | 1992-07-20 |
SE9101405L SE9101405L (en) | 1992-07-20 |
Family
ID=20382687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE9101405A SE9101405L (en) | 1991-05-10 | 1991-05-10 | MADE TO MANUFACTURE THE PATTERN PLATE THAT ALLOWS INCREASED PACKING DENSITY FOR COMPONENT MOUNTING |
Country Status (1)
Country | Link |
---|---|
SE (1) | SE9101405L (en) |
-
1991
- 1991-05-10 SE SE9101405A patent/SE9101405L/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
SE467479B (en) | 1992-07-20 |
SE9101405L (en) | 1992-07-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAL | Patent in force |
Ref document number: 9101405-0 Format of ref document f/p: F |
|
NUG | Patent has lapsed |