SE8802698D0 - Hardenable epoxy resin mixtures - Google Patents

Hardenable epoxy resin mixtures

Info

Publication number
SE8802698D0
SE8802698D0 SE8802698A SE8802698A SE8802698D0 SE 8802698 D0 SE8802698 D0 SE 8802698D0 SE 8802698 A SE8802698 A SE 8802698A SE 8802698 A SE8802698 A SE 8802698A SE 8802698 D0 SE8802698 D0 SE 8802698D0
Authority
SE
Sweden
Prior art keywords
epoxy resin
functionality
resin mixtures
hardenable epoxy
compositions
Prior art date
Application number
SE8802698A
Other languages
Swedish (sv)
Other versions
SE8802698L (en
Inventor
R Schmid
W Stauffer
Original Assignee
Ciba Geigy Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy Ag filed Critical Ciba Geigy Ag
Publication of SE8802698D0 publication Critical patent/SE8802698D0/en
Publication of SE8802698L publication Critical patent/SE8802698L/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen

Abstract

Hot-curable compositions which are stable on storage contain, in specified proportions, a) an epoxy resin having a functionality of at least 3, b) an epoxy resin having a functionality of 2-2.5, c) a diphenol curing agent, d) an accelerator, and e) a thermoplastic having a glass transition temperature of at least 180 DEG C. The compositions are particularly suitable for the production of prepregs for fibre-reinforced composite materials or for the preparation of adhesive films. The resulting cured mouldings are distinguished by a high heat distortion resistance and outstanding mechanical strength properties.
SE8802698A 1987-07-23 1988-07-21 HARDWARE EPOXY RESIN MIXTURES SE8802698L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH2791/87A CH672494A5 (en) 1987-07-23 1987-07-23

Publications (2)

Publication Number Publication Date
SE8802698D0 true SE8802698D0 (en) 1988-07-21
SE8802698L SE8802698L (en) 1989-01-24

Family

ID=4241672

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8802698A SE8802698L (en) 1987-07-23 1988-07-21 HARDWARE EPOXY RESIN MIXTURES

Country Status (10)

Country Link
JP (1) JPS6465118A (en)
BR (1) BR8803677A (en)
CH (1) CH672494A5 (en)
DE (1) DE3824705A1 (en)
ES (1) ES2007541A6 (en)
FR (1) FR2618444A1 (en)
GB (1) GB2207676A (en)
IT (1) IT1226283B (en)
NL (1) NL8801859A (en)
SE (1) SE8802698L (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02283753A (en) * 1989-04-25 1990-11-21 Mitsubishi Electric Corp Laminate resin composition
JPH0379621A (en) * 1989-05-12 1991-04-04 Mitsubishi Electric Corp Resin composition for laminate
JPH0739463B2 (en) * 1989-05-25 1995-05-01 三菱電機株式会社 Resin composition for laminated board
JPH0333124A (en) * 1989-06-30 1991-02-13 Mitsubishi Electric Corp Laminating resin composition
JPH0337256A (en) * 1989-07-04 1991-02-18 Mitsubishi Electric Corp Resin composition for laminated board
JP3415144B2 (en) * 1989-12-21 2003-06-09 ロックヒード マーティン コーポレーション Epoxy / polyimide copolymer blend dielectric and multilayer circuit using the same
US5470622A (en) * 1990-11-06 1995-11-28 Raychem Corporation Enclosing a substrate with a heat-recoverable article
DE4110219A1 (en) * 1991-03-28 1992-10-01 Huels Troisdorf METHOD FOR PRODUCING PREPREGS WITH SOLVENT-FREE EPOXY RESIN
US5250228A (en) * 1991-11-06 1993-10-05 Raychem Corporation Conductive polymer composition
TW215927B (en) * 1992-02-28 1993-11-11 Ciba Geigy
WO1996004329A1 (en) * 1994-08-04 1996-02-15 Hokuriku Toryo Kabushiki Kaisya Flowable sealing resin composition
GB9709166D0 (en) * 1997-05-06 1997-06-25 Cytec Ind Inc Preforms for moulding process and resins therefor
ID22582A (en) * 1998-05-18 1999-11-18 Nippon Catalytic Chem Ind DEHYDROGENATION CATALYST OF LOW ALKANA OXIDATION AND PROCESS TO PRODUCE OLEFIN
US6486256B1 (en) * 1998-10-13 2002-11-26 3M Innovative Properties Company Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst
DE19913431C2 (en) * 1999-03-25 2001-10-11 Inst Verbundwerkstoffe Gmbh Process for toughening of thermoset systems by adding partially cross-linked polyurethane

Also Published As

Publication number Publication date
SE8802698L (en) 1989-01-24
BR8803677A (en) 1989-02-14
JPS6465118A (en) 1989-03-10
IT1226283B (en) 1990-12-27
NL8801859A (en) 1989-02-16
CH672494A5 (en) 1989-11-30
ES2007541A6 (en) 1989-06-16
GB8817081D0 (en) 1988-08-24
FR2618444A1 (en) 1989-01-27
DE3824705A1 (en) 1989-02-02
IT8821454A0 (en) 1988-07-22
GB2207676A (en) 1989-02-08

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NAV Patent application has lapsed

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Effective date: 19900705