IT8821454A0 - HARDENABLE EPOXY RESIN/THERMOPLAST MIXTURES. - Google Patents

HARDENABLE EPOXY RESIN/THERMOPLAST MIXTURES.

Info

Publication number
IT8821454A0
IT8821454A0 IT8821454A IT2145488A IT8821454A0 IT 8821454 A0 IT8821454 A0 IT 8821454A0 IT 8821454 A IT8821454 A IT 8821454A IT 2145488 A IT2145488 A IT 2145488A IT 8821454 A0 IT8821454 A0 IT 8821454A0
Authority
IT
Italy
Prior art keywords
thermoplast
mixtures
epoxy resin
hardenable epoxy
hardenable
Prior art date
Application number
IT8821454A
Other languages
Italian (it)
Other versions
IT1226283B (en
Inventor
Rolf Schmid
Werner Stauffer
Original Assignee
Ciba Geigy Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy Ag filed Critical Ciba Geigy Ag
Publication of IT8821454A0 publication Critical patent/IT8821454A0/en
Application granted granted Critical
Publication of IT1226283B publication Critical patent/IT1226283B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/38Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • C08G59/621Phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
IT8821454A 1987-07-23 1988-07-22 HARDENABLE MIXTURES EPOXY RESIN / THERMOPLAST. IT1226283B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH2791/87A CH672494A5 (en) 1987-07-23 1987-07-23

Publications (2)

Publication Number Publication Date
IT8821454A0 true IT8821454A0 (en) 1988-07-22
IT1226283B IT1226283B (en) 1990-12-27

Family

ID=4241672

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8821454A IT1226283B (en) 1987-07-23 1988-07-22 HARDENABLE MIXTURES EPOXY RESIN / THERMOPLAST.

Country Status (10)

Country Link
JP (1) JPS6465118A (en)
BR (1) BR8803677A (en)
CH (1) CH672494A5 (en)
DE (1) DE3824705A1 (en)
ES (1) ES2007541A6 (en)
FR (1) FR2618444A1 (en)
GB (1) GB2207676A (en)
IT (1) IT1226283B (en)
NL (1) NL8801859A (en)
SE (1) SE8802698L (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0379621A (en) * 1989-05-12 1991-04-04 Mitsubishi Electric Corp Resin composition for laminate
JPH02283753A (en) * 1989-04-25 1990-11-21 Mitsubishi Electric Corp Laminate resin composition
JPH0739463B2 (en) * 1989-05-25 1995-05-01 三菱電機株式会社 Resin composition for laminated board
JPH0333124A (en) * 1989-06-30 1991-02-13 Mitsubishi Electric Corp Laminating resin composition
JPH0337256A (en) * 1989-07-04 1991-02-18 Mitsubishi Electric Corp Resin composition for laminated board
JP3415144B2 (en) * 1989-12-21 2003-06-09 ロックヒード マーティン コーポレーション Epoxy / polyimide copolymer blend dielectric and multilayer circuit using the same
US5470622A (en) * 1990-11-06 1995-11-28 Raychem Corporation Enclosing a substrate with a heat-recoverable article
DE4110219A1 (en) * 1991-03-28 1992-10-01 Huels Troisdorf METHOD FOR PRODUCING PREPREGS WITH SOLVENT-FREE EPOXY RESIN
US5250228A (en) * 1991-11-06 1993-10-05 Raychem Corporation Conductive polymer composition
TW215927B (en) * 1992-02-28 1993-11-11 Ciba Geigy
WO1996004329A1 (en) * 1994-08-04 1996-02-15 Hokuriku Toryo Kabushiki Kaisya Flowable sealing resin composition
GB9709166D0 (en) * 1997-05-06 1997-06-25 Cytec Ind Inc Preforms for moulding process and resins therefor
ID22582A (en) * 1998-05-18 1999-11-18 Nippon Catalytic Chem Ind DEHYDROGENATION CATALYST OF LOW ALKANA OXIDATION AND PROCESS TO PRODUCE OLEFIN
US6486256B1 (en) * 1998-10-13 2002-11-26 3M Innovative Properties Company Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst
DE19913431C2 (en) * 1999-03-25 2001-10-11 Inst Verbundwerkstoffe Gmbh Process for toughening of thermoset systems by adding partially cross-linked polyurethane
JP6678075B2 (en) * 2016-06-30 2020-04-08 サンアプロ株式会社 Epoxy resin curing accelerator

Also Published As

Publication number Publication date
NL8801859A (en) 1989-02-16
GB2207676A (en) 1989-02-08
IT1226283B (en) 1990-12-27
FR2618444A1 (en) 1989-01-27
BR8803677A (en) 1989-02-14
SE8802698L (en) 1989-01-24
JPS6465118A (en) 1989-03-10
DE3824705A1 (en) 1989-02-02
GB8817081D0 (en) 1988-08-24
CH672494A5 (en) 1989-11-30
SE8802698D0 (en) 1988-07-21
ES2007541A6 (en) 1989-06-16

Similar Documents

Publication Publication Date Title
DE68904665D1 (en) HARDENABLE RESIN COMPOSITION.
DE58907670D1 (en) Modified epoxy resins.
DE3889950D1 (en) Epoxy resin composition.
DE3864484D1 (en) MODIFIED EPOXY RESINS.
DE3852839D1 (en) Thermosetting resin composition.
DE68920092D1 (en) Resin composition.
KR900700518A (en) Modified epoxy resin
DE3850373D1 (en) Flexibilized epoxy resin compositions.
DE68913781D1 (en) Thermoplastic resin mass.
IT1226283B (en) HARDENABLE MIXTURES EPOXY RESIN / THERMOPLAST.
DE3682310D1 (en) HARDENABLE EPOXY RESIN COMPOSITION.
DE69006422D1 (en) Epoxy resin compound.
DE68903181D1 (en) POLYIMIDE RESIN COMPOSITION.
DE3883933D1 (en) Curable epoxy resin composition.
DE68919151D1 (en) Resin composition.
DE68914150D1 (en) POLYIMIDE RESIN.
DE68911340D1 (en) Resin composition.
DE68913640D1 (en) Thermoplastic resin mass.
DE68920086D1 (en) Thermosetting epoxy resin composition.
DE68924798D1 (en) Resin composition.
DE68918544D1 (en) Resin composition.
DE68920062D1 (en) Thermosetting epoxy resin composition.
DE3886587D1 (en) Epoxy resin composition.
DE58900457D1 (en) HARDENABLE MIXTURE.
DE68911597D1 (en) Resin composition.