GB8817081D0 - Curable epoxy resin/thermoplastic compositions - Google Patents

Curable epoxy resin/thermoplastic compositions

Info

Publication number
GB8817081D0
GB8817081D0 GB888817081A GB8817081A GB8817081D0 GB 8817081 D0 GB8817081 D0 GB 8817081D0 GB 888817081 A GB888817081 A GB 888817081A GB 8817081 A GB8817081 A GB 8817081A GB 8817081 D0 GB8817081 D0 GB 8817081D0
Authority
GB
United Kingdom
Prior art keywords
epoxy resin
curable epoxy
thermoplastic compositions
thermoplastic
compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB888817081A
Other versions
GB2207676A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
Original Assignee
Ciba Geigy AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy AG filed Critical Ciba Geigy AG
Publication of GB8817081D0 publication Critical patent/GB8817081D0/en
Publication of GB2207676A publication Critical patent/GB2207676A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
GB08817081A 1987-07-23 1988-07-18 Curable epoxy resin/thermoplastic compositions Withdrawn GB2207676A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH2791/87A CH672494A5 (en) 1987-07-23 1987-07-23

Publications (2)

Publication Number Publication Date
GB8817081D0 true GB8817081D0 (en) 1988-08-24
GB2207676A GB2207676A (en) 1989-02-08

Family

ID=4241672

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08817081A Withdrawn GB2207676A (en) 1987-07-23 1988-07-18 Curable epoxy resin/thermoplastic compositions

Country Status (10)

Country Link
JP (1) JPS6465118A (en)
BR (1) BR8803677A (en)
CH (1) CH672494A5 (en)
DE (1) DE3824705A1 (en)
ES (1) ES2007541A6 (en)
FR (1) FR2618444A1 (en)
GB (1) GB2207676A (en)
IT (1) IT1226283B (en)
NL (1) NL8801859A (en)
SE (1) SE8802698L (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02283753A (en) * 1989-04-25 1990-11-21 Mitsubishi Electric Corp Laminate resin composition
JPH0379621A (en) * 1989-05-12 1991-04-04 Mitsubishi Electric Corp Resin composition for laminate
JPH0739463B2 (en) * 1989-05-25 1995-05-01 三菱電機株式会社 Resin composition for laminated board
JPH0333124A (en) * 1989-06-30 1991-02-13 Mitsubishi Electric Corp Laminating resin composition
JPH0337256A (en) * 1989-07-04 1991-02-18 Mitsubishi Electric Corp Resin composition for laminated board
JP3415144B2 (en) * 1989-12-21 2003-06-09 ロックヒード マーティン コーポレーション Epoxy / polyimide copolymer blend dielectric and multilayer circuit using the same
US5470622A (en) * 1990-11-06 1995-11-28 Raychem Corporation Enclosing a substrate with a heat-recoverable article
DE4110219A1 (en) * 1991-03-28 1992-10-01 Huels Troisdorf METHOD FOR PRODUCING PREPREGS WITH SOLVENT-FREE EPOXY RESIN
US5250228A (en) * 1991-11-06 1993-10-05 Raychem Corporation Conductive polymer composition
TW215927B (en) * 1992-02-28 1993-11-11 Ciba Geigy
WO1996004329A1 (en) * 1994-08-04 1996-02-15 Hokuriku Toryo Kabushiki Kaisya Flowable sealing resin composition
GB9709166D0 (en) * 1997-05-06 1997-06-25 Cytec Ind Inc Preforms for moulding process and resins therefor
ID22582A (en) * 1998-05-18 1999-11-18 Nippon Catalytic Chem Ind DEHYDROGENATION CATALYST OF LOW ALKANA OXIDATION AND PROCESS TO PRODUCE OLEFIN
US6486256B1 (en) * 1998-10-13 2002-11-26 3M Innovative Properties Company Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst
DE19913431C2 (en) * 1999-03-25 2001-10-11 Inst Verbundwerkstoffe Gmbh Process for toughening of thermoset systems by adding partially cross-linked polyurethane

Also Published As

Publication number Publication date
SE8802698D0 (en) 1988-07-21
DE3824705A1 (en) 1989-02-02
JPS6465118A (en) 1989-03-10
IT1226283B (en) 1990-12-27
GB2207676A (en) 1989-02-08
BR8803677A (en) 1989-02-14
NL8801859A (en) 1989-02-16
SE8802698L (en) 1989-01-24
CH672494A5 (en) 1989-11-30
FR2618444A1 (en) 1989-01-27
IT8821454A0 (en) 1988-07-22
ES2007541A6 (en) 1989-06-16

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)