SE8604627D0 - FOR SEMICONDUCTOR DEVICE DEVICED SILICONE SUBSTRATE OF HIGH SILICENCE AND PREPARATION KIT FOR THIS - Google Patents
FOR SEMICONDUCTOR DEVICE DEVICED SILICONE SUBSTRATE OF HIGH SILICENCE AND PREPARATION KIT FOR THISInfo
- Publication number
- SE8604627D0 SE8604627D0 SE8604627A SE8604627A SE8604627D0 SE 8604627 D0 SE8604627 D0 SE 8604627D0 SE 8604627 A SE8604627 A SE 8604627A SE 8604627 A SE8604627 A SE 8604627A SE 8604627 D0 SE8604627 D0 SE 8604627D0
- Authority
- SE
- Sweden
- Prior art keywords
- crystal body
- silicon
- silicon crystal
- silicence
- deviced
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/30—Mechanisms for rotating or moving either the melt or the crystal
- C30B15/305—Stirring of the melt
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Abstract
A method for producing silicon substrates includes growing the silicon crystal body at a relatively high rate of growth. It has been found that the growth rate of the silicon crystal body exerts substantial influence upon generation of crystal defects in the silicon crystal body or silicon substrate. Furthermore, the oxygen concentration in the silicon crystal body or the silicon substrate is significantly higher than in conventional silicon crystals or substrates. The high growth rate of the silicon crystal body suppresses separation of the oxygen from the crystal body. This reduces the number of defects or faults formed in the crystal body during heat treatment during production of the semiconductor devices. In the preferred process, according to the present invention, the growth rate of the silicon crystal body is greater than or equal to 1.2 mm/min. Furthermore, the preferred oxygen concentration in the grown silicon crystal body is selected to be greater than or equal to 1.8 x 10<18> cm<-3>. <IMAGE>
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60244562A JPS62105998A (en) | 1985-10-31 | 1985-10-31 | Production of silicon substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
SE8604627D0 true SE8604627D0 (en) | 1986-10-30 |
SE8604627L SE8604627L (en) | 1987-05-01 |
Family
ID=17120560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE8604627A SE8604627L (en) | 1985-10-31 | 1986-10-30 | FOR SEMICONDUCTOR DEVICE DEVICED SILICONE SUBSTRATE OF HIGH SILICENCE AND PREPARATION KIT FOR THIS |
Country Status (14)
Country | Link |
---|---|
JP (1) | JPS62105998A (en) |
KR (1) | KR870004498A (en) |
CN (1) | CN1016191B (en) |
AT (1) | ATA289086A (en) |
AU (1) | AU597599B2 (en) |
CA (1) | CA1336061C (en) |
DE (1) | DE3637006A1 (en) |
DK (1) | DK518486A (en) |
FR (1) | FR2589489B1 (en) |
GB (1) | GB2182262B (en) |
IT (1) | IT1198454B (en) |
MY (1) | MY100449A (en) |
NL (1) | NL8602738A (en) |
SE (1) | SE8604627L (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5196085A (en) * | 1990-12-28 | 1993-03-23 | Massachusetts Institute Of Technology | Active magnetic flow control in Czochralski systems |
JP2613498B2 (en) * | 1991-03-15 | 1997-05-28 | 信越半導体株式会社 | Heat treatment method for Si single crystal wafer |
JPH07247197A (en) * | 1994-03-09 | 1995-09-26 | Fujitsu Ltd | Semiconductor device and its production |
JP3443822B2 (en) * | 1996-03-27 | 2003-09-08 | 信越半導体株式会社 | Method for producing silicon single crystal |
DE19711922A1 (en) * | 1997-03-21 | 1998-09-24 | Wacker Siltronic Halbleitermat | Device and method for pulling a single crystal |
MY135749A (en) | 1997-04-09 | 2008-06-30 | Memc Electronic Materials | Process for producing low defect density, ideal oxygen precipitating silicon |
CN1280455C (en) | 1997-04-09 | 2006-10-18 | Memc电子材料有限公司 | Low defect density silicon |
US6379642B1 (en) | 1997-04-09 | 2002-04-30 | Memc Electronic Materials, Inc. | Vacancy dominated, defect-free silicon |
JPH11268987A (en) * | 1998-03-20 | 1999-10-05 | Shin Etsu Handotai Co Ltd | Silicon single crystal and its production |
US6328795B2 (en) | 1998-06-26 | 2001-12-11 | Memc Electronic Materials, Inc. | Process for growth of defect free silicon crystals of arbitrarily large diameters |
KR100581305B1 (en) | 1998-09-02 | 2006-05-22 | 엠이엠씨 일렉트로닉 머티리얼즈 인코포레이티드 | Silicon on insulator structure from low defect density single crystal silicon |
US6312516B2 (en) | 1998-10-14 | 2001-11-06 | Memc Electronic Materials, Inc. | Process for preparing defect free silicon crystals which allows for variability in process conditions |
KR100622884B1 (en) | 1998-10-14 | 2006-09-12 | 엠이엠씨 일렉트로닉 머티리얼즈 인코포레이티드 | Thermally annealed, low defect density single crystal silicon |
WO2000022197A1 (en) | 1998-10-14 | 2000-04-20 | Memc Electronic Materials, Inc. | Epitaxial silicon wafers substantially free of grown-in defects |
US6858307B2 (en) | 2000-11-03 | 2005-02-22 | Memc Electronic Materials, Inc. | Method for the production of low defect density silicon |
US7105050B2 (en) | 2000-11-03 | 2006-09-12 | Memc Electronic Materials, Inc. | Method for the production of low defect density silicon |
DE10103691A1 (en) * | 2001-01-26 | 2002-08-08 | Crystal Growing Systems Gmbh | Electrical energy supply used for an electrical heater for heating a crucible during crystal growing contains a twelve-pulse rectifier |
US6846539B2 (en) | 2001-01-26 | 2005-01-25 | Memc Electronic Materials, Inc. | Low defect density silicon having a vacancy-dominated core substantially free of oxidation induced stacking faults |
US8216362B2 (en) | 2006-05-19 | 2012-07-10 | Memc Electronic Materials, Inc. | Controlling agglomerated point defect and oxygen cluster formation induced by the lateral surface of a silicon single crystal during CZ growth |
JP5974978B2 (en) | 2013-05-29 | 2016-08-23 | 信越半導体株式会社 | Silicon single crystal manufacturing method |
CN105780113B (en) * | 2016-03-10 | 2017-11-28 | 江西赛维Ldk太阳能高科技有限公司 | A kind of method for characterizing crystalline silicon growth interface and the speed of growth |
CN112095154B (en) * | 2019-06-18 | 2021-05-14 | 上海新昇半导体科技有限公司 | Semiconductor crystal growth device |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5556098A (en) * | 1978-10-17 | 1980-04-24 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Method and apparatus for producing si single crystal rod |
DE3069547D1 (en) * | 1980-06-26 | 1984-12-06 | Ibm | Process for controlling the oxygen content of silicon ingots pulled by the czochralski method |
GB2084046B (en) * | 1980-08-27 | 1984-07-25 | Secr Defence | Method and apparatus for crystal growth |
CA1191075A (en) * | 1980-12-29 | 1985-07-30 | Roger A. Frederick | Method for regulating concentration and distribution of oxygen in czochralski grown silicon |
NL8102102A (en) * | 1981-04-29 | 1982-11-16 | Philips Nv | METHOD FOR DRAWING UP A SILICON BAR AND SEMICONDUCTOR DEVICE MADE FROM THE SILICON BAR. |
JPH0244799B2 (en) * | 1981-10-26 | 1990-10-05 | Sony Corp | KETSUSHOSEICHOHOHO |
US4511428A (en) * | 1982-07-09 | 1985-04-16 | International Business Machines Corporation | Method of controlling oxygen content and distribution in grown silicon crystals |
JPS6027684A (en) * | 1983-07-26 | 1985-02-12 | Fujitsu Ltd | Apparatus for producing single crystal |
JPS6033289A (en) * | 1983-07-29 | 1985-02-20 | Toshiba Corp | Preparation of single crystal of silicon |
JPS6094722A (en) * | 1983-08-16 | 1985-05-27 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Silicon wafer |
JPS6153187A (en) * | 1984-08-24 | 1986-03-17 | Sony Corp | Device for growing single crystal |
IT1207497B (en) * | 1985-05-29 | 1989-05-25 | Montedison Spa | MONO CRYSTALS OF GALLIO ARSENIURO WITH LOW DENSITY OF DISLOCATIONS AND HIGH PURITY. |
-
1985
- 1985-10-31 JP JP60244562A patent/JPS62105998A/en active Pending
-
1986
- 1986-08-25 KR KR1019860007019A patent/KR870004498A/en not_active Application Discontinuation
- 1986-10-16 CA CA000520610A patent/CA1336061C/en not_active Expired - Fee Related
- 1986-10-28 IT IT48592/86A patent/IT1198454B/en active
- 1986-10-29 FR FR868615075A patent/FR2589489B1/en not_active Expired - Fee Related
- 1986-10-30 SE SE8604627A patent/SE8604627L/en not_active Application Discontinuation
- 1986-10-30 DK DK518486A patent/DK518486A/en not_active Application Discontinuation
- 1986-10-30 AT AT0289086A patent/ATA289086A/en not_active Application Discontinuation
- 1986-10-30 NL NL8602738A patent/NL8602738A/en not_active Application Discontinuation
- 1986-10-30 DE DE19863637006 patent/DE3637006A1/en not_active Ceased
- 1986-10-30 AU AU64550/86A patent/AU597599B2/en not_active Ceased
- 1986-10-31 MY MYPI86000057A patent/MY100449A/en unknown
- 1986-10-31 CN CN86106346A patent/CN1016191B/en not_active Expired
- 1986-10-31 GB GB8626074A patent/GB2182262B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
NL8602738A (en) | 1987-05-18 |
CN86106346A (en) | 1987-06-17 |
GB2182262B (en) | 1989-09-27 |
DE3637006A1 (en) | 1987-05-07 |
KR870004498A (en) | 1987-05-09 |
GB2182262A (en) | 1987-05-13 |
FR2589489A1 (en) | 1987-05-07 |
GB8626074D0 (en) | 1986-12-03 |
FR2589489B1 (en) | 1994-06-10 |
SE8604627L (en) | 1987-05-01 |
ATA289086A (en) | 1996-01-15 |
IT8648592A0 (en) | 1986-10-28 |
AU6455086A (en) | 1987-05-07 |
DK518486A (en) | 1987-05-01 |
DK518486D0 (en) | 1986-10-30 |
JPS62105998A (en) | 1987-05-16 |
MY100449A (en) | 1990-10-15 |
CA1336061C (en) | 1995-06-27 |
AU597599B2 (en) | 1990-06-07 |
IT1198454B (en) | 1988-12-21 |
CN1016191B (en) | 1992-04-08 |
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