SE7806727L - Ytpassiverat halvledarelement och forfarande for dess tillverkning - Google Patents

Ytpassiverat halvledarelement och forfarande for dess tillverkning

Info

Publication number
SE7806727L
SE7806727L SE7806727A SE7806727A SE7806727L SE 7806727 L SE7806727 L SE 7806727L SE 7806727 A SE7806727 A SE 7806727A SE 7806727 A SE7806727 A SE 7806727A SE 7806727 L SE7806727 L SE 7806727L
Authority
SE
Sweden
Prior art keywords
procedure
manufacture
semiconductor element
surface passivated
passivated semiconductor
Prior art date
Application number
SE7806727A
Other languages
English (en)
Inventor
K Sommer
W Kohler
Original Assignee
Licentia Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Gmbh filed Critical Licentia Gmbh
Publication of SE7806727L publication Critical patent/SE7806727L/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • H01L21/0212—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC the material being fluoro carbon compounds, e.g.(CFx) n, (CHxFy) n or polytetrafluoroethylene
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/312—Organic layers, e.g. photoresist
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Formation Of Insulating Films (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Reciprocating Pumps (AREA)
SE7806727A 1977-06-14 1978-06-09 Ytpassiverat halvledarelement och forfarande for dess tillverkning SE7806727L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772726667 DE2726667A1 (de) 1977-06-14 1977-06-14 Oberflaechenpassiviertes halbleiterbauelement und verfahren zum herstellen desselben

Publications (1)

Publication Number Publication Date
SE7806727L true SE7806727L (sv) 1978-12-15

Family

ID=6011444

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7806727A SE7806727L (sv) 1977-06-14 1978-06-09 Ytpassiverat halvledarelement och forfarande for dess tillverkning

Country Status (4)

Country Link
US (2) US4172698A (sv)
JP (1) JPS545658A (sv)
DE (1) DE2726667A1 (sv)
SE (1) SE7806727L (sv)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1597371A (en) * 1977-02-05 1981-09-09 Molins Ltd Monitoring flow of rod-like articles
JPS55130133A (en) * 1979-03-30 1980-10-08 Hitachi Ltd Semiconductor device
US4242941A (en) * 1979-05-14 1981-01-06 Wilden Pump & Engineering Co. Actuator valve
US4326380A (en) * 1980-01-09 1982-04-27 Rittmaster Peter A Hydraulic engine
JPS6018145B2 (ja) * 1980-09-22 1985-05-09 株式会社日立製作所 樹脂封止型半導体装置
FR2515874A1 (fr) * 1981-11-05 1983-05-06 Comp Generale Electricite Procede d'encapsulation plastique de cellules solaires
US4634350A (en) * 1981-11-12 1987-01-06 The Coca-Cola Company Double acting diaphragm pump and reversing mechanism therefor
US4480969A (en) * 1981-11-12 1984-11-06 The Coca-Cola Company Fluid operated double acting diaphragm pump housing and method
US4682937A (en) * 1981-11-12 1987-07-28 The Coca-Cola Company Double-acting diaphragm pump and reversing mechanism therefor
FR2525697B1 (fr) * 1982-04-21 1986-03-28 Utilisation Ration Gaz Pompe volumetrique a deux etages pour gaz de petrole liquefies en phase liquide, et procede d'injection de carburant pour moteur de vehicule automobile utilisant une telle pompe
US4705458A (en) * 1982-07-30 1987-11-10 Bellofram Corporation Fluid operated pump
US4478560A (en) * 1982-09-23 1984-10-23 The Warren Rupp Company Fluid-operated reciprocating pump
US4827832A (en) * 1982-11-22 1989-05-09 Product Research And Development Valve system for a reciprocating device
US5240390A (en) * 1992-03-27 1993-08-31 Graco Inc. Air valve actuator for reciprocable machine
IL101516A (en) * 1992-04-07 1994-07-31 Abraham Moshe Pressure booster
US5334003A (en) * 1993-01-25 1994-08-02 The Aro Corporation Air valving mechanism, in combination with a double diaphragm pump subassembly
US5470209A (en) * 1993-10-13 1995-11-28 Shurflo Pump Manufacturing Co. Offset reciprocable device
US5505593A (en) * 1993-10-13 1996-04-09 Shurflo Pump Manufacturing Co. Reciprocable device with switching mechanism
US5545016A (en) * 1995-01-31 1996-08-13 Standard-Keil Industries, Inc. Plural chamber pneumatic pump having a motive fluid exhaust valve
US5758563A (en) * 1996-10-23 1998-06-02 Holcom Co. Fluid driven reciprocating pump
DE19737363C1 (de) * 1997-08-27 1999-03-11 Siemens Ag Kalibrierwafer
NL1009405C2 (nl) * 1998-06-15 1999-12-16 Dsm Nv Object omvattende een drager en een zich op de drager bevindende laag.
US6062427A (en) * 1998-08-27 2000-05-16 Du Investments L.L.C. Beer keg and pre-mixed beverage tank change-over device
US6099264A (en) * 1998-08-27 2000-08-08 Itt Manufacturing Enterprises, Inc. Pump controller
DE19946562C2 (de) * 1999-09-29 2003-10-30 Oliver Timmer Kompakt-Doppelmembranpumpe
US6343539B1 (en) 1999-11-10 2002-02-05 Benjamin R. Du Multiple layer pump diaphragm
US6475558B2 (en) * 2001-02-26 2002-11-05 Volvo Trucks North America, Inc. Vehicle electrical ground and process
DE10124334A1 (de) 2001-05-18 2002-11-21 Bosch Gmbh Robert Vorrichtung und Verfahren zur pneumatischen Steuerung und Regelung von Druckmittelströmen
US20040045430A1 (en) * 2002-09-09 2004-03-11 Vangstad Michael D. Reciprocating hydraulic motor utilizing a ramped valve yoke with a tripping spring
US6862972B2 (en) * 2002-12-23 2005-03-08 James Morrison Additive injection device
US7380566B2 (en) * 2005-03-18 2008-06-03 Jon Selander Dewatering system and method for a subsurface vault
GB2470348B (en) * 2009-04-29 2011-06-08 Flotronic Pumps Ltd Double-diaphragm pump with unidirectional valve arrangement
GB2478784B (en) * 2010-03-19 2017-01-25 Finishing Brands Holdings Inc Improvements in diaphragm pumps
US9004881B2 (en) * 2012-04-20 2015-04-14 Simmons Development, Llc Modular fluid-driven diaphragm pump and related methods
JP6062179B2 (ja) * 2012-08-01 2017-01-18 株式会社テクノ高槻 センタリング機能付きセンタープレート搭載電磁駆動型流体ポンプ

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1913308A (en) * 1930-09-18 1933-06-06 Trico Products Corp Windshield cleaner
US2187972A (en) * 1938-03-21 1940-01-23 Byron Jackson Co Pumping apparatus
US2626527A (en) * 1948-12-15 1953-01-27 Bendix Aviat Corp Snap action valve mechanism for reciprocating pistons
US2798440A (en) * 1954-02-26 1957-07-09 Ernest A Hall Fuel feed pump
US2864342A (en) * 1955-08-29 1958-12-16 Lynn J Ziegelmeyer Hydraulically operated motor and control means therefor
US3167083A (en) * 1961-09-05 1965-01-26 Peninsular Distributing Compan Sequence valve
NL300939A (sv) * 1962-12-21 1965-09-27
US3684592A (en) * 1969-09-30 1972-08-15 Westinghouse Electric Corp Passivated surfaces and protective coatings for semiconductor devices and processes for producing the same
US3741689A (en) * 1971-08-05 1973-06-26 Rupp Co Warren Air operated diaphragm pump
US3782863A (en) * 1971-11-16 1974-01-01 Rupp Co Warren Slide valve apparatus
US4017886A (en) * 1972-10-18 1977-04-12 Hitachi, Ltd. Discrete semiconductor device having polymer resin as insulator and method for making the same
US3920793A (en) * 1973-04-02 1975-11-18 Du Pont Corrosion-resistant perfluorocarbon polymer coated metal substrate and process for preparing the same
US3936569A (en) * 1973-12-12 1976-02-03 Allied Chemical Corporation Metals coated with 3,3,3-trifluoro-2-trifluoromethyl propene/vinylidene fluoride copolymer compositions
JPS5619086B2 (sv) * 1974-03-08 1981-05-06
US4013807A (en) * 1975-03-26 1977-03-22 Systemation Div. Of Koerper Engineering Associates, Inc Coating electronic components by means of fluidized bed
US4008984A (en) * 1975-10-23 1977-02-22 Scholle William R Pump apparatus

Also Published As

Publication number Publication date
US4220962A (en) 1980-09-02
US4172698A (en) 1979-10-30
JPS545658A (en) 1979-01-17
DE2726667A1 (de) 1978-12-21

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