SE7501711L - - Google Patents

Info

Publication number
SE7501711L
SE7501711L SE7501711A SE7501711A SE7501711L SE 7501711 L SE7501711 L SE 7501711L SE 7501711 A SE7501711 A SE 7501711A SE 7501711 A SE7501711 A SE 7501711A SE 7501711 L SE7501711 L SE 7501711L
Authority
SE
Sweden
Prior art keywords
tin
carboxylate
new
plating bath
additive
Prior art date
Application number
SE7501711A
Other languages
Unknown language ( )
Other versions
SE419104B (en
Inventor
W E Rosenber
W E Eckles
Original Assignee
R O Hull & Company Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by R O Hull & Company Inc filed Critical R O Hull & Company Inc
Publication of SE7501711L publication Critical patent/SE7501711L/
Publication of SE419104B publication Critical patent/SE419104B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Abstract

The invention disclosed herein relates to the electrolytic deposition of bright tin and tin-lead alloy. This invention is embodied in a new plating bath and a plating bath additive. The new plating bath includes tin or tin and lead ions, sulfuric acid or fluoboric acid, and the new additive. The new additive is an emulsified or dissolved naphthalene monocarboxaldehyde with or without a substituted olefin, having the general formula: in which R1 is carboxyl, carboxamido, alkali carboxylate, ammonium carboxylate, amine carboxylate, or alkyl carboxylate, and R2, R3, and R4 are hydrogen or lower alkyl. Prior brightener systems require specific surfactants to be used since their brightening ability is essential in the performance of the system as a whole, whereas the emulsified naphthalene monocarboxaldehyde of the present invention produces a brightener without dependence on distinct types of emulsifiers and amines.
SE7501711A 1974-02-19 1975-02-17 Aqueous, acidic electroplating bath for precipitation of tin and tin alloys SE419104B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US443406A US3875029A (en) 1974-02-19 1974-02-19 Plating bath for electrodeposition of bright tin and tin-lead alloy

Publications (2)

Publication Number Publication Date
SE7501711L true SE7501711L (en) 1975-08-20
SE419104B SE419104B (en) 1981-07-13

Family

ID=23760674

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7501711A SE419104B (en) 1974-02-19 1975-02-17 Aqueous, acidic electroplating bath for precipitation of tin and tin alloys

Country Status (7)

Country Link
US (1) US3875029A (en)
JP (1) JPS581195B2 (en)
BR (1) BR7500985A (en)
CA (1) CA1046976A (en)
ES (1) ES434856A1 (en)
FR (1) FR2261351B1 (en)
SE (1) SE419104B (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3977949A (en) * 1975-07-07 1976-08-31 Columbia Chemical Corporation Acidic plating bath and additives for electrodeposition of bright tin
US4207148A (en) * 1975-11-28 1980-06-10 Minnesota Mining And Manufacturing Company Electroplating bath for the electrodeposition of tin and tin/cadmium deposits
US4135991A (en) * 1977-08-12 1979-01-23 R. O. Hull & Company, Inc. Bath and method for electroplating tin and/or lead
US4377449A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic silver plating
US4379738A (en) * 1979-12-31 1983-04-12 Bell Telephone Laboratories, Incorporated Electroplating zinc
US4263106A (en) * 1979-12-31 1981-04-21 Bell Telephone Laboratories, Incorporated Solder plating process
US4376018A (en) * 1979-12-31 1983-03-08 Bell Telephone Laboratories, Incorporated Electrodeposition of nickel
US4377448A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic gold plating
SE8204505L (en) * 1981-09-08 1983-03-09 Occidental Chem Co ELECTROPLETING FOR PROVISION OF TIN LEAD ALLOYS ON DIFFERENT SUBSTRACTS
US5094726B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4871429A (en) * 1981-09-11 1989-10-03 Learonal, Inc Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5066367B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
JPS59500475A (en) * 1982-03-15 1984-03-22 ジ−・エス・ピ−・メタルズ・アンド・ケミカルズ・コ−ポレイシヨン chelated metal
US4586990A (en) * 1982-03-15 1986-05-06 Gsp Metals & Chemicals Corporation Chelating metals
US4530741A (en) * 1984-07-12 1985-07-23 Columbia Chemical Corporation Aqueous acid plating bath and brightener composition for producing bright electrodeposits of tin
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US4816070A (en) * 1985-08-29 1989-03-28 Techo Instruments Investments Ltd. Use of immersion tin and alloys as a bonding medium for multilayer circuits
US4715894A (en) * 1985-08-29 1987-12-29 Techno Instruments Investments 1983 Ltd. Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
US4880507A (en) * 1987-12-10 1989-11-14 Learonal, Inc. Tin, lead or tin/lead alloy electrolytes for high speed electroplating
EP0499638B1 (en) * 1989-04-20 1998-12-02 Tokin Corporation Method for Plating a Permanent Magnet of a R2T14B Intermetallic Compound
US4885064A (en) * 1989-05-22 1989-12-05 Mcgean-Rohco, Inc. Additive composition, plating bath and method for electroplating tin and/or lead
US5698087A (en) * 1992-03-11 1997-12-16 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US5545440A (en) * 1994-12-05 1996-08-13 At&T Global Information Solutions Company (Aka Ncr Corporation) Method and apparatus for polymer coating of substrates
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages
US5814202A (en) * 1997-10-14 1998-09-29 Usx Corporation Electrolytic tin plating process with reduced sludge production

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL124247C (en) * 1963-08-28
NL128321C (en) * 1965-02-13
US3785939A (en) * 1970-10-22 1974-01-15 Conversion Chem Corp Tin/lead plating bath and method

Also Published As

Publication number Publication date
US3875029A (en) 1975-04-01
DE2506158A1 (en) 1975-08-21
JPS581195B2 (en) 1983-01-10
SE419104B (en) 1981-07-13
JPS50118934A (en) 1975-09-18
FR2261351B1 (en) 1979-09-28
BR7500985A (en) 1976-11-16
FR2261351A1 (en) 1975-09-12
CA1046976A (en) 1979-01-23
AU7620874A (en) 1976-06-10
DE2506158B2 (en) 1976-12-02
ES434856A1 (en) 1976-12-01

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