SE7415451L - - Google Patents

Info

Publication number
SE7415451L
SE7415451L SE7415451A SE7415451A SE7415451L SE 7415451 L SE7415451 L SE 7415451L SE 7415451 A SE7415451 A SE 7415451A SE 7415451 A SE7415451 A SE 7415451A SE 7415451 L SE7415451 L SE 7415451L
Authority
SE
Sweden
Application number
SE7415451A
Other versions
SE410997B (sv
Inventor
W M Moreau
C H Ting
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of SE7415451L publication Critical patent/SE7415451L/xx
Publication of SE410997B publication Critical patent/SE410997B/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/76—Patterning of masks by imaging
    • G03F1/78—Patterning of masks by imaging by charged particle beam [CPB], e.g. electron beam patterning of masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31909—Next to second addition polymer from unsaturated monomers
    • Y10T428/31928—Ester, halide or nitrile of addition polymer

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electron Beam Exposure (AREA)
SE7415451A 1973-12-19 1974-12-10 Hogkenslig resistbeleggning bestaende av ett flertal skikt pa ett substrat SE410997B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/426,403 US3934057A (en) 1973-12-19 1973-12-19 High sensitivity positive resist layers and mask formation process

Publications (2)

Publication Number Publication Date
SE7415451L true SE7415451L (de) 1975-06-23
SE410997B SE410997B (sv) 1979-11-19

Family

ID=23690667

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7415451A SE410997B (sv) 1973-12-19 1974-12-10 Hogkenslig resistbeleggning bestaende av ett flertal skikt pa ett substrat

Country Status (11)

Country Link
US (1) US3934057A (de)
JP (1) JPS5319899B2 (de)
CA (1) CA1035624A (de)
CH (1) CH619303A5 (de)
DE (1) DE2451902C3 (de)
ES (1) ES433048A1 (de)
FR (1) FR2254881B1 (de)
GB (1) GB1473194A (de)
IT (1) IT1025918B (de)
NL (1) NL7416464A (de)
SE (1) SE410997B (de)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3982943A (en) * 1974-03-05 1976-09-28 Ibm Corporation Lift-off method of fabricating thin films and a structure utilizable as a lift-off mask
JPS524834A (en) * 1975-06-30 1977-01-14 Agency Of Ind Science & Technol Image formation method through electron beam and resisting agent compo sitions which are used for the methoi
US4024293A (en) * 1975-12-10 1977-05-17 International Business Machines Corporation High sensitivity resist system for lift-off metallization
DE2636351C2 (de) * 1976-08-12 1984-01-26 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen einer strukturierten Schicht auf einem Substrat
US4204009A (en) * 1977-12-30 1980-05-20 International Business Machines Corporation Two layer resist system
US4180604A (en) * 1977-12-30 1979-12-25 International Business Machines Corporation Two layer resist system
US4238559A (en) * 1978-08-24 1980-12-09 International Business Machines Corporation Two layer resist system
DE3060510D1 (en) * 1979-03-09 1982-07-29 Thomson Csf Photomasking substances, process for preparing them and mask obtained
US4349620A (en) * 1979-06-15 1982-09-14 E. I. Du Pont De Nemours And Company Solvent developable photoresist film
US4229520A (en) * 1979-06-18 1980-10-21 E. I. Du Pont De Nemours And Company Photo-polymerization and development process which produces dot-etchable material
US4339525A (en) * 1979-06-18 1982-07-13 E. I. Du Pont De Nemours And Company Color proofing system using dot-etchable photopolymerizable elements
CA1155238A (en) * 1979-11-27 1983-10-11 Richard E. Howard High resolution two-layer resists
DE3027941A1 (de) * 1980-07-23 1982-02-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von reliefstrukturen aus doppellackschichten fuer integrierte halbleiterschaltungen, wobei zur strukturierung hochenergetische strahlung verwendet wird
DE3036710A1 (de) * 1980-09-29 1982-05-13 Siemens AG, 1000 Berlin und 8000 München Verfahren zur erzeugung von photolackstrukuren
US4415653A (en) * 1981-05-07 1983-11-15 Honeywell Inc. Method of making sensitive positive electron beam resists
DE3127350C2 (de) * 1981-07-10 1985-01-03 Hans 8202 Bad Aibling Ribbert Verfahren zur Bodenverfestigung
JPS59226346A (ja) * 1983-06-07 1984-12-19 Fuotopori Ouka Kk プリント回路の製造方法
DE3340154A1 (de) * 1983-11-07 1985-05-15 Basf Ag, 6700 Ludwigshafen Verfahren zur herstellung von bildmaessig strukturierten resistschichten und fuer dieses verfahren geeigneter trockenfilmresist
US4539222A (en) * 1983-11-30 1985-09-03 International Business Machines Corporation Process for forming metal patterns wherein metal is deposited on a thermally depolymerizable polymer and selectively removed
US4508812A (en) * 1984-05-03 1985-04-02 Hughes Aircraft Company Method of applying poly(methacrylic anhydride resist to a semiconductor
US4519872A (en) * 1984-06-11 1985-05-28 International Business Machines Corporation Use of depolymerizable polymers in the fabrication of lift-off structure for multilevel metal processes
US4737425A (en) * 1986-06-10 1988-04-12 International Business Machines Corporation Patterned resist and process
WO1988009961A1 (en) * 1987-06-10 1988-12-15 Siemens Aktiengesellschaft Arrangement for producing a structure by means of photolithography and manufacturing process thereof
US5006488A (en) * 1989-10-06 1991-04-09 International Business Machines Corporation High temperature lift-off process
US5958630A (en) * 1997-12-30 1999-09-28 Kabushiki Kaisha Toshiba Phase shifting mask and method of manufacturing the same
US5922509A (en) * 1998-03-18 1999-07-13 Morton International, Inc. Photoimageable compositions having improved stripping properties in aqueous alkaline solutions
EP1470449A1 (de) * 2002-01-31 2004-10-27 Scandinavian Micro Biodevices A/S Verfahren zur verbindung von einem bauteil an einer mikrostruktur durch lichtbestrahlung
US7384727B2 (en) * 2003-06-26 2008-06-10 Micron Technology, Inc. Semiconductor processing patterning methods
US6969677B2 (en) * 2003-10-20 2005-11-29 Micron Technology, Inc. Methods of forming conductive metal silicides by reaction of metal with silicon
US7026243B2 (en) * 2003-10-20 2006-04-11 Micron Technology, Inc. Methods of forming conductive material silicides by reaction of metal with silicon
US7153769B2 (en) * 2004-04-08 2006-12-26 Micron Technology, Inc. Methods of forming a reaction product and methods of forming a conductive metal silicide by reaction of metal with silicon
US7241705B2 (en) * 2004-09-01 2007-07-10 Micron Technology, Inc. Methods of forming conductive contacts to source/drain regions and methods of forming local interconnects
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
US7932615B2 (en) * 2006-02-08 2011-04-26 Amkor Technology, Inc. Electronic devices including solder bumps on compliant dielectric layers
DE102006009696B4 (de) * 2006-03-02 2008-04-30 Forschungszentrum Jülich GmbH Bauteil für die Nano- und Molekularelektronik
US20070134943A2 (en) * 2006-04-02 2007-06-14 Dunnrowicz Clarence J Subtractive - Additive Edge Defined Lithography
DE102007006640A1 (de) * 2007-02-06 2008-08-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Aufbringen einer Struktur auf ein Halbleiterbauelement
ITTO20080358A1 (it) * 2008-05-14 2009-11-15 Consiglio Nazionale Ricerche Procedimento e sistema per la fabbricazione di nanostrutture e nanodispositivi tramite proiezione di materiale in forma atomica o molecolare da sorgente sagomata attraverso un diaframma con aperture di dimensioni nanometriche
US9401336B2 (en) 2014-11-04 2016-07-26 International Business Machines Corporation Dual layer stack for contact formation
EP3398202B1 (de) * 2015-12-30 2023-08-09 FujiFilm Electronic Materials USA, Inc. Lichtempfindliche stapelstruktur

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2964401A (en) * 1957-02-18 1960-12-13 Du Pont Photopolymerizable elements and processes
GB841454A (en) * 1957-09-16 1960-07-13 Du Pont Improvements in or relating to photopolymerisable elements
US3535137A (en) * 1967-01-13 1970-10-20 Ibm Method of fabricating etch resistant masks
US3779806A (en) * 1972-03-24 1973-12-18 Ibm Electron beam sensitive polymer t-butyl methacrylate resist
US3799777A (en) * 1972-06-20 1974-03-26 Westinghouse Electric Corp Micro-miniature electronic components by double rejection

Also Published As

Publication number Publication date
JPS5319899B2 (de) 1978-06-23
DE2451902A1 (de) 1975-07-03
US3934057A (en) 1976-01-20
IT1025918B (it) 1978-08-30
SE410997B (sv) 1979-11-19
FR2254881B1 (de) 1976-10-22
GB1473194A (en) 1977-05-11
JPS5093570A (de) 1975-07-25
CH619303A5 (de) 1980-09-15
ES433048A1 (es) 1977-03-01
DE2451902B2 (de) 1981-07-16
NL7416464A (nl) 1975-06-23
CA1035624A (en) 1978-08-01
FR2254881A1 (de) 1975-07-11
DE2451902C3 (de) 1982-05-06

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