SE7411812L - - Google Patents

Info

Publication number
SE7411812L
SE7411812L SE7411812A SE7411812A SE7411812L SE 7411812 L SE7411812 L SE 7411812L SE 7411812 A SE7411812 A SE 7411812A SE 7411812 A SE7411812 A SE 7411812A SE 7411812 L SE7411812 L SE 7411812L
Authority
SE
Sweden
Application number
SE7411812A
Other languages
Unknown language ( )
Inventor
R J Bacher
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of SE7411812L publication Critical patent/SE7411812L/

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4685Manufacturing of cross-over conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Glass Compositions (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Capacitors (AREA)
SE7411812A 1973-09-21 1974-09-19 SE7411812L (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00399726A US3821611A (en) 1973-09-21 1973-09-21 Cross conductors with double layered insulation

Publications (1)

Publication Number Publication Date
SE7411812L true SE7411812L (it) 1975-03-24

Family

ID=23580721

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7411812A SE7411812L (it) 1973-09-21 1974-09-19

Country Status (6)

Country Link
US (1) US3821611A (it)
JP (1) JPS5058555A (it)
DE (1) DE2445140A1 (it)
FR (1) FR2245062A1 (it)
IT (1) IT1022175B (it)
SE (1) SE7411812L (it)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141055A (en) * 1977-04-27 1979-02-20 Bell Telephone Laboratories, Incorporated Crossover structure for microelectronic circuits
US4163072A (en) * 1977-06-07 1979-07-31 Bell Telephone Laboratories, Incorporated Encapsulation of circuits
DE3372407D1 (en) * 1982-09-29 1987-08-13 Emi Ltd A tactile array sensor
US4724021A (en) * 1986-07-23 1988-02-09 E. I. Du Pont De Nemours And Company Method for making porous bottom-layer dielectric composite structure
US5907265A (en) * 1996-09-13 1999-05-25 Matsushita Electric Industrial Co., Ltd. High-frequency circuit board trace crossing and electronic component therefor
TW340296B (en) * 1997-02-21 1998-09-11 Ricoh Microelectronics Kk Method and apparatus of concave plate printing, method and apparatus for formation of wiring diagram, the contact electrode and the printed wiring nickel substrate
EP2025209B1 (de) * 2006-06-07 2013-03-27 Ab Mikroelektronik Gesellschaft Mit Beschränkter Haftung Verfahren zur herstellung eines schaltungsträgers

Also Published As

Publication number Publication date
IT1022175B (it) 1978-03-20
FR2245062A1 (it) 1975-04-18
US3821611A (en) 1974-06-28
JPS5058555A (it) 1975-05-21
DE2445140A1 (de) 1975-04-10

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