FR2245062A1 - - Google Patents

Info

Publication number
FR2245062A1
FR2245062A1 FR7431481A FR7431481A FR2245062A1 FR 2245062 A1 FR2245062 A1 FR 2245062A1 FR 7431481 A FR7431481 A FR 7431481A FR 7431481 A FR7431481 A FR 7431481A FR 2245062 A1 FR2245062 A1 FR 2245062A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7431481A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of FR2245062A1 publication Critical patent/FR2245062A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Glass Compositions (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Capacitors (AREA)
FR7431481A 1973-09-21 1974-09-18 Withdrawn FR2245062A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00399726A US3821611A (en) 1973-09-21 1973-09-21 Cross conductors with double layered insulation

Publications (1)

Publication Number Publication Date
FR2245062A1 true FR2245062A1 (fr) 1975-04-18

Family

ID=23580721

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7431481A Withdrawn FR2245062A1 (fr) 1973-09-21 1974-09-18

Country Status (6)

Country Link
US (1) US3821611A (fr)
JP (1) JPS5058555A (fr)
DE (1) DE2445140A1 (fr)
FR (1) FR2245062A1 (fr)
IT (1) IT1022175B (fr)
SE (1) SE7411812L (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4141055A (en) * 1977-04-27 1979-02-20 Bell Telephone Laboratories, Incorporated Crossover structure for microelectronic circuits
US4163072A (en) * 1977-06-07 1979-07-31 Bell Telephone Laboratories, Incorporated Encapsulation of circuits
DE3372407D1 (en) * 1982-09-29 1987-08-13 Emi Ltd A tactile array sensor
US4724021A (en) * 1986-07-23 1988-02-09 E. I. Du Pont De Nemours And Company Method for making porous bottom-layer dielectric composite structure
US5907265A (en) * 1996-09-13 1999-05-25 Matsushita Electric Industrial Co., Ltd. High-frequency circuit board trace crossing and electronic component therefor
TW340296B (en) * 1997-02-21 1998-09-11 Ricoh Microelectronics Kk Method and apparatus of concave plate printing, method and apparatus for formation of wiring diagram, the contact electrode and the printed wiring nickel substrate
EP2025209B1 (fr) * 2006-06-07 2013-03-27 Ab Mikroelektronik Gesellschaft Mit Beschränkter Haftung Procédé de fabrication d'un support de circuit

Also Published As

Publication number Publication date
SE7411812L (fr) 1975-03-24
IT1022175B (it) 1978-03-20
US3821611A (en) 1974-06-28
JPS5058555A (fr) 1975-05-21
DE2445140A1 (de) 1975-04-10

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Legal Events

Date Code Title Description
ST Notification of lapse