JPS5058555A - - Google Patents
Info
- Publication number
- JPS5058555A JPS5058555A JP49107845A JP10784574A JPS5058555A JP S5058555 A JPS5058555 A JP S5058555A JP 49107845 A JP49107845 A JP 49107845A JP 10784574 A JP10784574 A JP 10784574A JP S5058555 A JPS5058555 A JP S5058555A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Glass Compositions (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US00399726A US3821611A (en) | 1973-09-21 | 1973-09-21 | Cross conductors with double layered insulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5058555A true JPS5058555A (ja) | 1975-05-21 |
Family
ID=23580721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49107845A Pending JPS5058555A (ja) | 1973-09-21 | 1974-09-20 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3821611A (ja) |
| JP (1) | JPS5058555A (ja) |
| DE (1) | DE2445140A1 (ja) |
| FR (1) | FR2245062A1 (ja) |
| IT (1) | IT1022175B (ja) |
| SE (1) | SE7411812L (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4141055A (en) * | 1977-04-27 | 1979-02-20 | Bell Telephone Laboratories, Incorporated | Crossover structure for microelectronic circuits |
| US4163072A (en) * | 1977-06-07 | 1979-07-31 | Bell Telephone Laboratories, Incorporated | Encapsulation of circuits |
| DE3372407D1 (en) * | 1982-09-29 | 1987-08-13 | Emi Ltd | A tactile array sensor |
| US4724021A (en) * | 1986-07-23 | 1988-02-09 | E. I. Du Pont De Nemours And Company | Method for making porous bottom-layer dielectric composite structure |
| US5907265A (en) * | 1996-09-13 | 1999-05-25 | Matsushita Electric Industrial Co., Ltd. | High-frequency circuit board trace crossing and electronic component therefor |
| TW340296B (en) * | 1997-02-21 | 1998-09-11 | Ricoh Microelectronics Kk | Method and apparatus of concave plate printing, method and apparatus for formation of wiring diagram, the contact electrode and the printed wiring nickel substrate |
| EP2025209B1 (de) * | 2006-06-07 | 2013-03-27 | Ab Mikroelektronik Gesellschaft Mit Beschränkter Haftung | Verfahren zur herstellung eines schaltungsträgers |
-
1973
- 1973-09-21 US US00399726A patent/US3821611A/en not_active Expired - Lifetime
-
1974
- 1974-09-18 FR FR7431481A patent/FR2245062A1/fr not_active Withdrawn
- 1974-09-19 SE SE7411812A patent/SE7411812L/ not_active Application Discontinuation
- 1974-09-20 DE DE19742445140 patent/DE2445140A1/de active Pending
- 1974-09-20 JP JP49107845A patent/JPS5058555A/ja active Pending
- 1974-09-20 IT IT27541/74A patent/IT1022175B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| SE7411812L (ja) | 1975-03-24 |
| IT1022175B (it) | 1978-03-20 |
| FR2245062A1 (ja) | 1975-04-18 |
| US3821611A (en) | 1974-06-28 |
| DE2445140A1 (de) | 1975-04-10 |