SE470275B - Procedure for attaching connection plates to electrical conductors in printed circuit - Google Patents

Procedure for attaching connection plates to electrical conductors in printed circuit

Info

Publication number
SE470275B
SE470275B SE9103761A SE9103761A SE470275B SE 470275 B SE470275 B SE 470275B SE 9103761 A SE9103761 A SE 9103761A SE 9103761 A SE9103761 A SE 9103761A SE 470275 B SE470275 B SE 470275B
Authority
SE
Sweden
Prior art keywords
laminate
hole
contact
contact plate
plastic laminate
Prior art date
Application number
SE9103761A
Other languages
Swedish (sv)
Other versions
SE9103761D0 (en
SE9103761L (en
Inventor
Sandor Katona
Original Assignee
Sandor Katona
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sandor Katona filed Critical Sandor Katona
Priority to SE9103761A priority Critical patent/SE470275B/en
Publication of SE9103761D0 publication Critical patent/SE9103761D0/en
Priority to EP93900479A priority patent/EP0617850A1/en
Priority to PCT/SE1992/000852 priority patent/WO1993012560A1/en
Priority to HU9401729A priority patent/HUT68305A/en
Publication of SE9103761L publication Critical patent/SE9103761L/en
Publication of SE470275B publication Critical patent/SE470275B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/59Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/65Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
    • H01R12/69Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal deformable terminals, e.g. crimping terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/06Riveted connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/04Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool
    • H01R43/048Crimping apparatus or processes
    • H01R43/0484Crimping apparatus or processes for eyelet contact members
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/091Locally and permanently deformed areas including dielectric material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10401Eyelets, i.e. rings inserted into a hole through a circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/1059Connections made by press-fit insertion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10962Component not directly connected to the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Description

470 275 i med ovanpâliggande golvbeläggning utan nämnvärd risk för skador i värmefolie och golvbeläggning. 470 275 in with superimposed floor covering without significant risk of damage to heating foil and floor covering.

Vid en föredragen utföringsform anbringas mellan kon- taktblecket och det övre plastlaminatet en ring med axi- ellt riktade nedåtriktade nabbar, vilka vid nitningen pressas genom plastlaminatet och till kontakt ,med me- tallfolien. Detta ger bättre elektrisk kontakt kontakt- bleck- metallfolie. Ringen belägges lämpligen med elek-.¿. triskt ledande färg.In a preferred embodiment, a ring with axially directed downwardly directed hubs is applied between the contact plate and the upper plastic laminate, which are pressed through the plastic laminate and into contact with the metal foil during riveting. This provides better electrical contact contact sheet metal foil. The ring is suitably coated with elek-.¿. tric conductive paint.

Figereri Uppfinningen är närmare exemplifierad i bifogade figu- rer, av vilka figur l visar ett upptaget, genomgående hål i en blivande metallfolie, figur 2 visar appliceringen av en varm dorn, figur 3 avlägsnande av dornen, figur 4 appli- ceringen an kontaktblecket, och figur 5 anordnande av mellanliggande, nabbförsedd ring. §igurbeskrivning¿ I figur l visas två plastlaminat 1,2 med en mellanliggande metallfolie 3. I dessa tre skikt l-3 upptages ett genomgående hål 4 (diameter Dl), exempelvis medelst stansning. Plastlami- natet 1 kan vara exempelvis 0,05 mm och cirka 0,1 mm för lami- nat 2. Folien 3 är cirka 0,01 mm tjock.The invention is further exemplified in the accompanying figures, of which Figure 1 shows a occupied, through hole in a future metal foil, Figure 2 shows the application of a hot mandrel, Figure 3 removal of the mandrel, Figure 4 the application to the contact plate, and figure 5 arrangement of intermediate, hub-fitted ring. Figure description In Figure 1, two plastic laminates 1,2 are shown with an intermediate metal foil 3. In these three layers 1-3, a through hole 4 (diameter D1) is taken up, for example by punching. The plastic laminate 1 can be, for example, 0.05 mm and about 0.1 mm for the laminate 2. The foil 3 is about 0.01 mm thick.

I figur 2 visas uppkragning av hålet 4 medelst en konisk eller delvis konisk dorn 5 (temp. 100-3000 C). Uppkragningen sker till diameter D 2, och förhållandet Dl/D2 väljes så, att både sprickfri uppkragning och lämpli presspassning till senare anbgagt rörnit erhålles.Figure 2 shows the support of the hole 4 by means of a conical or partially conical mandrel 5 (temp. 100-3000 C). The collar is made to a diameter D 2, and the ratio D1 / D2 is chosen so that both crack-free collar and suitable press fit to a later applied pipe rivet are obtained.

I figur 3 visas hur dornen 5 avlägsnats, varvid det uppkra- 5 470 275 gade hålet (D2) på översidan formats till en försänkt tät- ningsyta för rörnit 6. På mitten är utformad en frilagd, metallisk kontaktyta 7 mot rörniten 6. På hålets undersida är utformad en kantförsedd tätningsvulst 8, som ökar kon%eL takttrycket och hermetiskt tillsluter utrymmet kring konf>. taktytan 7.Figure 3 shows how the mandrel 5 was removed, whereby the coiled hole (D2) on the upper side is formed into a recessed sealing surface for pipe rivets 6. In the middle an exposed, metallic contact surface 7 is formed against the pipe rivets 6. On the hole the underside is formed with an edge-provided sealing bead 8, which increases the pressure pressure and hermetically closes the space around the conf>. tact surface 7.

I figur 4 visas hur ett kontaktbleck 9 nitas fast med-g elst rörniten 6, vilken nit även bockas runt vulsten 8 på sin nedersida, varvid en oxidationsskyddad, elektriskt le- dande förbindning metallfolie-rörnit-kontaktbleck erhålles.Figure 4 shows how a contact plate 9 is riveted to the pipe rivet 6, which rivet is also bent around the bead 8 on its lower side, whereby an oxidation-protected, electrically conductive connection metal foil pipe rivet contact plate is obtained.

I figur 5 visas det alternativa utförandet med en nabb- försedd ring lO mellan kontaktbleck 9 och metallfolie 3, där de helt eller delvis axiellt riktade nabbarna pressats genom den övre plastfolien 1 till kontakt med metallfolien 3.Figure 5 shows the alternative embodiment with a hub-provided ring 10 between contact plate 9 and metal foil 3, where the fully or partially axially directed hubs are pressed through the upper plastic foil 1 into contact with the metal foil 3.

Ringen 10 är lämpligen ifylld med elektriskt ledande ;=. färg, exempelvis grafitblandad, vilken vid anbringandet fyller i hålrum och eliminerar missbildningar.The ring 10 is suitably filled with electrically conductive; =. paint, for example graphite mixed, which during application fills voids and eliminates deformities.

På den färdiga värmefolien kan exempelvis ett laminat av glasfiöer eller dylikt påläggas (ej visat) för skydd av folien och för skydd mot och av ovanpåliggande beläggning.On the finished heating foil, for example, a laminate of glass sheets or the like can be applied (not shown) for protection of the foil and for protection against and of the surface coating.

Sättet enligt ovan kan varieras på mångahanda vis inom ramen för nedanstående patentkrav.The method as above can be varied in many ways within the scope of the following claims.

Claims (4)

J? *il cx INQ '\'l (Il 11 P A T E N T K R A V.J? * il cx INQ '\' l (Il 11 P A T E N T K R A V. 1. Förfaringssätt att fästa anslutningsbleck till elek- triska ledare i tryckt krets i värmefolier och dylikt,där ett kontaktbleck nitas fast vid ett genomgående hål i plastlaminat (1,2) och en metalldel (3), k ä n n e é t e c k n a f d ä r a v , att det genomgående hålet (4) i plastlaminaten (1,2) uppkragas medelst en dorn (5), lämpligen en varm dorn, åtminstone delvis konisk, så att hålet på översidan uppkragas till en försänkt tätnings- yta för en nit (6), på mitten formas till en frilagd, cylindrisk, metallisk kontaktyta (7) mot niten (6) och på undersidan till en tätningsvulst (8), lämpligen kant- försedd, ökande kontakttrycket och hermetiskt tillslutan- de utrymmet kring kontaktytan, samt att kontaktblecket (9) nitas fast vid det genomgående hålet (4) i plastla- minaten (1,2) och en vid laminaten anordnad metallfolie- (3) medelst den hålet genomgående niten, lämpligen en rör- nit (6), vilken på motsatt sida bockats kring en i hå- lets under-(neder-)sida formad vulst.1. A method of attaching connection plates to electrical conductors in a printed circuit in heating foils and the like, in which a contact plate is riveted to a through hole in plastic laminate (1,2) and a metal part (3), which may be a sign thereof, that the through hole (4) in the plastic laminate (1,2) is unscrewed by means of a mandrel (5), preferably a hot mandrel, at least partially conical, so that the hole on the upper side is unscrewed to a recessed sealing surface for a rivet (6), in the middle is formed into an exposed, cylindrical, metallic contact surface (7) against the rivet (6) and on the underside of a sealing bead (8), suitably edge-provided, increasing the contact pressure and hermetically sealing space around the contact surface, and that the contact plate (9 ) riveted to the through hole (4) in the plastic laminate (1,2) and a metal foil (3) arranged at the laminate by means of that hole, preferably a pipe rivet (6), which is bent around on the opposite side a bead formed in the lower (lower) side of the hole. 2. Förfaringssätt enligt patentkrav 1, k ä n n e t e c k- n a ? d ä r a v , att mellan kontaktblecket (9) och öv- re plastlaminatet (1) anbragts en ring (10) med axiellt nedåtriktade nabbar, vilka vid nitningen pressats genom laminatet och till kontakt med metallfolien.A method according to claim 1, k ä n n e t e c k- n a? that is, that between the contact plate (9) and the upper plastic laminate (1) a ring (10) is arranged with axially downwardly directed hubs, which during riveting are pressed through the laminate and into contact with the metal foil. 3. Förfaringssätt enligt patentkrav 1, k ä n n e t e c k- n a t d ä r a v , att mellan kontaktblecket (9) och övre plastlaminatet (1) anbragts en ring (10), belagd med elektriskt ledande färg och försedd med axiellt ned- åtriktade nabbar, vilka vid nitningen pressats genom la- minatet och till kontakt med metallfolien. 5 t t4¿p 275A method according to claim 1, characterized in that between the contact plate (9) and the upper plastic laminate (1) a ring (10) is arranged, coated with electrically conductive paint and provided with axially downwardly directed hubs, which during riveting pressed through the laminate and into contact with the metal foil. 5 t t4¿p 275 4. Förfaringssätt enligt något eller några av föregåen patentkrav, k ä n n e t eac k n a t d ä r a v , att ett skyddslaminat, exempelvis av glasfiber, lägges på den färdiga värmefolien.Method according to one or more of the preceding claims, characterized in that a protective laminate, for example of fiberglass, is laid on the finished heating foil.
SE9103761A 1991-12-19 1991-12-19 Procedure for attaching connection plates to electrical conductors in printed circuit SE470275B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE9103761A SE470275B (en) 1991-12-19 1991-12-19 Procedure for attaching connection plates to electrical conductors in printed circuit
EP93900479A EP0617850A1 (en) 1991-12-19 1992-12-10 Method of joining connection plates
PCT/SE1992/000852 WO1993012560A1 (en) 1991-12-19 1992-12-10 Method of joining connection plates
HU9401729A HUT68305A (en) 1991-12-19 1992-12-10 Method of joining connection plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9103761A SE470275B (en) 1991-12-19 1991-12-19 Procedure for attaching connection plates to electrical conductors in printed circuit

Publications (3)

Publication Number Publication Date
SE9103761D0 SE9103761D0 (en) 1991-12-19
SE9103761L SE9103761L (en) 1993-06-20
SE470275B true SE470275B (en) 1993-12-20

Family

ID=20384655

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9103761A SE470275B (en) 1991-12-19 1991-12-19 Procedure for attaching connection plates to electrical conductors in printed circuit

Country Status (4)

Country Link
EP (1) EP0617850A1 (en)
HU (1) HUT68305A (en)
SE (1) SE470275B (en)
WO (1) WO1993012560A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI935373A0 (en) * 1993-12-01 1993-12-01 Iws International Inc Kopplingsstycke eller koppling Foer ledning
FR2770935B1 (en) * 1997-11-12 1999-12-17 Peugeot ELECTRICAL CONNECTION BETWEEN RTM COMPOSITE PANELS

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IE34672B (en) * 1969-11-28 1975-07-09 Gen Electric Method of mounting a terminal assembly on an electrical device,and a terminal assembly mounted on an electrical device
DE2109119A1 (en) * 1970-03-12 1971-09-23 Gen Electric Rivet sealing device
DE2754619A1 (en) * 1977-12-08 1979-06-13 Reinshagen Kabelwerk Gmbh ELECTRICAL CONNECTION DEVICE AND METHOD FOR MANUFACTURING IT
US4831722A (en) * 1981-10-26 1989-05-23 Burndy Corporation Apparatus and method for installing electrical connectors on flat conductor cable

Also Published As

Publication number Publication date
SE9103761D0 (en) 1991-12-19
EP0617850A1 (en) 1994-10-05
HU9401729D0 (en) 1994-09-28
HUT68305A (en) 1995-06-28
SE9103761L (en) 1993-06-20
WO1993012560A1 (en) 1993-06-24

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