EP0617850A1 - Method of joining connection plates - Google Patents

Method of joining connection plates

Info

Publication number
EP0617850A1
EP0617850A1 EP93900479A EP93900479A EP0617850A1 EP 0617850 A1 EP0617850 A1 EP 0617850A1 EP 93900479 A EP93900479 A EP 93900479A EP 93900479 A EP93900479 A EP 93900479A EP 0617850 A1 EP0617850 A1 EP 0617850A1
Authority
EP
European Patent Office
Prior art keywords
hole
contact
rivet
ring
contact plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP93900479A
Other languages
German (de)
French (fr)
Inventor
Sandor Katona
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP0617850A1 publication Critical patent/EP0617850A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/65—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
    • H01R12/69—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal deformable terminals, e.g. crimping terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/06—Riveted connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/04—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool
    • H01R43/048—Crimping apparatus or processes
    • H01R43/0484—Crimping apparatus or processes for eyelet contact members
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10962—Component not directly connected to the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Definitions

  • the present invention relates to a method of securing electrical connection tags to electrical conductors in printed circuits in thermal foils and the like, in which a contact plate is riveted in place near a hole passing through plastic layers and a metal part.
  • thermal foils and other components having printed circuits are extremely thin which makes it difficult to attach contact plates and similar contact members without risk of damage, sparking, poor contact, etc.
  • the object of the invention is to provide a method for solving this and other associated problems, and is characterised in that the contact plate is riveted in place near a hole passing through the plastic layers and a metal foil arranged adjacent to the layers, by means of a rivet, preferably a hollow rivet, which is passed through the hole and bent on the opposite side around an upset at the lower edge of the hole, the hole being made with the aid of a mandrel, suitably hot and at least partly conical in shape, so that the upper edge of the hole is flanged to a recessed sealing surface for the rivet, the central part is formed to an exposed cylindrical metal contact surface against the rivet, and the lower side to a sealing upset, preferably reinforced at the edge, increasing the contact pressure and hermetically sealing the area around the contact surface.
  • a reliable and easily applied contact to the contact plate is thus obtained from the metal foil, and such a thermal foil can easily be applied in a floor with flooring on top with negligible risk of damage to the thermal foil or the flooring.
  • a ring with protrusions directed axially downwards is applied between the contact plate and the upper plastic layer, said ring being pressed through the layer into contact with the metal foil during riveting.
  • This provides better electrical contact between contact plate and metal foil.
  • the ring is suitably coated with electrically conducting paint.
  • Figure 1 shows a hole produced in what is to become a metal foil
  • Figure 2 shows application of a hot mandrel
  • Figure 3 removal of the mandrel
  • Figure 4 application of the contact plate
  • Figures 5 and 6 the arrangement of an intermediate ring provided with protrusions.
  • Figure 1 shows two plastic layers 1, 2 with a metal foil 3 located between them.
  • a hole 4 (diameter Dl) is produced in these three layers 1-3 by means of punching, for instance.
  • the plastic layer 1 may have a thickness of 0.05 mm, for instance, and the layer 2 a thickness of approximately 0.1 mm.
  • the foil 3 is approximately 0.01 mm thick.
  • Figure 2 shows flanging of the hole 4 by means of a conical or partly conical mandrel 5 (temperature 100-300°C). Flanging is performed to a diameter D2 and the ratio D1.D2 is chosen so as to ensure crack-free flanging and suitable fit to the hollow rivet applied subsequently.
  • Figure 3 shows how the mandrel 5 has been removed, the flange hole (D2) thus having been shaped to provide a recessed sealing surface for the hollow rivet 6.
  • the central part has been formed to an exposed metal contact surface 7 against the rivet 6.
  • a sealing upset 8, reinforced at the edge, is formed on the lower side of the hole, increasing the contact pressure and hermetically sealing the area around the contact surface 7.
  • Figure 4 shows how a contact plate 9 has been riveted in place by means of the hollow rivet 6 which has also been bent around the upset 8 on the lower side, thereby producing an electrically conducting connection between metal foil, hollow rivet and contact plate, which is also protected against oxidization.
  • Figure 5 shows the alternative embodiment with a studded ring 10 between the contact plate 9 and the metal foil 3, where the entirely or partially axially directed studs are pressed through the upper layer of plastic 1 into contact with the metal foil 3.
  • the ring 10 is suitably filled with electrically conducting paint, for example mixed with graphite, which fills any cavities and eliminates deformations when applied.
  • Figure 6 shows more in detail the embodiment according to the invention with a studded ring 10 filled with electrically conducting paint, for example mixed with graphite, inserted between the contact plate 9 and plastic foil 1.
  • 3 denotes a metal foil and contact between the plate 9 and foil 3 is ensured in the manner described above.
  • a layer of glass fibre or the like may be applied on the finished plastic foil to protect the foil and the flooring on top of the foil.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Procédé permettant de fixer des cosses de branchement à des conducteurs électriques pris dans des couches thermoisolantes ou des éléments analogues. Une plaque de contact est rivetée en place à l'endroit d'un trou traversant les couches plastiques (1, 2) et l'élément métallique (3). Selon ce procédé, la plaque (9) est rivetée en place près d'un trou (4) traversant les couches de plastique et la couche métallique (3) prise entre les deux premières à l'aide d'un rivet (6) creux. Du côté opposé, le rivet est recourbé autour d'un relèvement (8) formé à l'extrémité inférieure du trou (4), lequel a été formé au moyen d'une broche (5) de forme tronconique élevée à une température suffisamment haute, de telle sorte que le bord supérieur du trou se trouve embouti en creux pour former une surface de joint accueillant le rivet (6), la partie centrale formant un corps cylindrique creux exposant la surface métallique (7) au contact du rivet (6), tandis que la partie inférieure forme un relèvement (8) réalisant un scellement, de préférence renforcé sur son pourtour, ce qui augmente ainsi la pression de contact et assure l'étanchéité de la surface entourant la surface de contact.Method for attaching terminal lugs to electrical conductors embedded in heat-insulating layers or the like. A contact plate is riveted in place at the location of a hole passing through the plastic layers (1, 2) and the metal element (3). According to this method, the plate (9) is riveted in place near a hole (4) passing through the plastic layers and the metal layer (3) taken between the first two using a hollow rivet (6) . On the opposite side, the rivet is bent around a bearing (8) formed at the lower end of the hole (4), which has been formed by means of a pin (5) of frustoconical shape raised at a sufficiently high temperature , in such a way that the upper edge of the hole is recessed to form a joint surface receiving the rivet (6), the central part forming a hollow cylindrical body exposing the metal surface (7) in contact with the rivet (6) , while the lower part forms a raising (8) forming a seal, preferably reinforced around its periphery, which thus increases the contact pressure and seals the surface surrounding the contact surface.

Description

METHOD OF JOINING CONNECTION PLATES . Technical field
The present invention relates to a method of securing electrical connection tags to electrical conductors in printed circuits in thermal foils and the like, in which a contact plate is riveted in place near a hole passing through plastic layers and a metal part.
Background Art
A problem with thermal foils and other components having printed circuits is that the electrical conductors are extremely thin which makes it difficult to attach contact plates and similar contact members without risk of damage, sparking, poor contact, etc.
Summary of the Invention
The object of the invention is to provide a method for solving this and other associated problems, and is characterised in that the contact plate is riveted in place near a hole passing through the plastic layers and a metal foil arranged adjacent to the layers, by means of a rivet, preferably a hollow rivet, which is passed through the hole and bent on the opposite side around an upset at the lower edge of the hole, the hole being made with the aid of a mandrel, suitably hot and at least partly conical in shape, so that the upper edge of the hole is flanged to a recessed sealing surface for the rivet, the central part is formed to an exposed cylindrical metal contact surface against the rivet, and the lower side to a sealing upset, preferably reinforced at the edge, increasing the contact pressure and hermetically sealing the area around the contact surface. A reliable and easily applied contact to the contact plate is thus obtained from the metal foil, and such a thermal foil can easily be applied in a floor with flooring on top with negligible risk of damage to the thermal foil or the flooring.
In a preferred embodiment a ring with protrusions directed axially downwards is applied between the contact plate and the upper plastic layer, said ring being pressed through the layer into contact with the metal foil during riveting. This provides better electrical contact between contact plate and metal foil. The ring is suitably coated with electrically conducting paint.
Drawings
The invention will be described in more detail with reference to the accompanying drawings in which Figure 1 shows a hole produced in what is to become a metal foil, Figure 2 shows application of a hot mandrel, Figure 3 removal of the mandrel, Figure 4 application of the contact plate and Figures 5 and 6 the arrangement of an intermediate ring provided with protrusions.
Description of the Drawings
Figure 1 shows two plastic layers 1, 2 with a metal foil 3 located between them. A hole 4 (diameter Dl) is produced in these three layers 1-3 by means of punching, for instance. The plastic layer 1 may have a thickness of 0.05 mm, for instance, and the layer 2 a thickness of approximately 0.1 mm. The foil 3 is approximately 0.01 mm thick.
Figure 2 shows flanging of the hole 4 by means of a conical or partly conical mandrel 5 (temperature 100-300°C). Flanging is performed to a diameter D2 and the ratio D1.D2 is chosen so as to ensure crack-free flanging and suitable fit to the hollow rivet applied subsequently.
Figure 3 shows how the mandrel 5 has been removed, the flange hole (D2) thus having been shaped to provide a recessed sealing surface for the hollow rivet 6. The central part has been formed to an exposed metal contact surface 7 against the rivet 6. A sealing upset 8, reinforced at the edge, is formed on the lower side of the hole, increasing the contact pressure and hermetically sealing the area around the contact surface 7.
Figure 4 shows how a contact plate 9 has been riveted in place by means of the hollow rivet 6 which has also been bent around the upset 8 on the lower side, thereby producing an electrically conducting connection between metal foil, hollow rivet and contact plate, which is also protected against oxidization.
Figure 5 shows the alternative embodiment with a studded ring 10 between the contact plate 9 and the metal foil 3, where the entirely or partially axially directed studs are pressed through the upper layer of plastic 1 into contact with the metal foil 3.
The ring 10 is suitably filled with electrically conducting paint, for example mixed with graphite, which fills any cavities and eliminates deformations when applied.
Figure 6 shows more in detail the embodiment according to the invention with a studded ring 10 filled with electrically conducting paint, for example mixed with graphite, inserted between the contact plate 9 and plastic foil 1. 3 denotes a metal foil and contact between the plate 9 and foil 3 is ensured in the manner described above.
A layer of glass fibre or the like may be applied on the finished plastic foil to protect the foil and the flooring on top of the foil.
The method according to the invention can be varied in many ways within the scope of the appended claims.

Claims

CLAIMS;
1. A method of securing connection tags to electrical conductors in printed circuits in thermal foils and the like in which a contact plate is riveted in place near a hole passing through plastic layers 1, 2 and a metal part 3, characterised in that the contact plate 9 is riveted in place near a hole 4 passing through the plastic layers 1, 2 and a metal foil 3 arranged adjacent to the layers, by means of a rivet, preferably a hollow rivet 6, which is passed through the hole and bent on the opposite side around an upset 8 at the lower edge of the hole, the hole 4 being made with the aid of a mandrel 5, suitably hot and at least partly conical in shape, so that the upper edge of the hole is flanged to a recessed sealing surface for the rivet 6, the central part is formed to an exposed cylindrical metal contact surface 7 against the rivet 6, and the lower side to a sealing upset 8, preferably reinforced at the edge, increasing the contact pressure and hermetically sealing the area around the contact surface.
2. A method as claimed in claim 1, characterised in that between the contact plate 9 and the upper plastic layer 1 a ring 10 with protrusions directed axially downwards is applied, said ring being pressed through the layer into contact with the metal foil during riveting.
3. A method as claimed in claim 2, characterised in that the ring 10 is coated with electrically conducting paint
4. A method as claimed in any of the preceding claims, characterised in that a protective layer of glass fibre, for instance, is applied on the finished thermal foil to protect the thermal foil and to facilitate laying flooring on top of the foil in the case of electrically heated floors, for instance. AMENDED CLAIMS
[received by the International Bureau on 16 Apri l 1993( 16.04.93) ; original claims 1 -4 replaced by amended claims 1-4 ( 1 page) ]
CLAIMS:
1. A method of securing connection tags to electrical conductors in printed circuits in thermal foils and the like in which a contact plate is riveted in place near a hole passing through plastic layers 1, 2 and a metal part 3, characterised in that the through-hole (4) in the plastic layers (1, 2) is flanged by means of a mandrel (5), suitably hot and at least partly conical in shape, so that the upper edge of the hole is flanged to a recessed sealing surface for the rivet (6), the central part is formed to an exposed cylindrical metal contact surface (7) against the rivet (6), and the lower side to a sealing upset 8, preferably reinforced at the edge, increasing the contact pressure and hermetically sealing the area around the contact surface, and in that the contact plate 9 is riveted in place near the through-hole 4 in the plastic layers (1, 2) and a metal foil (3) arranged adjacent to the layers, by means of a rivet, preferably a hollow rivet (6), which is passed through the hole and bent on the opposite side around an upset at the lower edge of the hole.
2. A method as claimed in claim 1, characterised in that between the contact plate (9) and the upper plastic layer (1) a ring (10) with protrusions directed axially downwards is applied, said ring being pressed through the layer into contact with the metal foil during riveting.
3. A method as claimed in claim 2, characterised in that between the contact plate (9) and the upper plastic layer (1) a ring (10) is applied, said ring being coated with electrically conducting paint and provided with protrusions directed axially downwards, which are pressed through the layer into contact with the metal foil during riveting.
4. A method as claimed in any of the preceding claims, characterised in that a protective layer of glass fibre, for instance, is applied on the finished theπnal foil.
EP93900479A 1991-12-19 1992-12-10 Method of joining connection plates Ceased EP0617850A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9103761A SE470275B (en) 1991-12-19 1991-12-19 Procedure for attaching connection plates to electrical conductors in printed circuit
SE9103761 1991-12-19
PCT/SE1992/000852 WO1993012560A1 (en) 1991-12-19 1992-12-10 Method of joining connection plates

Publications (1)

Publication Number Publication Date
EP0617850A1 true EP0617850A1 (en) 1994-10-05

Family

ID=20384655

Family Applications (1)

Application Number Title Priority Date Filing Date
EP93900479A Ceased EP0617850A1 (en) 1991-12-19 1992-12-10 Method of joining connection plates

Country Status (4)

Country Link
EP (1) EP0617850A1 (en)
HU (1) HUT68305A (en)
SE (1) SE470275B (en)
WO (1) WO1993012560A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI935373A0 (en) * 1993-12-01 1993-12-01 Iws International Inc Kopplingsstycke eller koppling Foer ledning
FR2770935B1 (en) * 1997-11-12 1999-12-17 Peugeot ELECTRICAL CONNECTION BETWEEN RTM COMPOSITE PANELS

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IE34672B (en) * 1969-11-28 1975-07-09 Gen Electric Method of mounting a terminal assembly on an electrical device,and a terminal assembly mounted on an electrical device
DE2109119A1 (en) * 1970-03-12 1971-09-23 Gen Electric Rivet sealing device
DE2754619A1 (en) * 1977-12-08 1979-06-13 Reinshagen Kabelwerk Gmbh ELECTRICAL CONNECTION DEVICE AND METHOD FOR MANUFACTURING IT
US4831722A (en) * 1981-10-26 1989-05-23 Burndy Corporation Apparatus and method for installing electrical connectors on flat conductor cable

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9312560A1 *

Also Published As

Publication number Publication date
HUT68305A (en) 1995-06-28
HU9401729D0 (en) 1994-09-28
SE9103761D0 (en) 1991-12-19
SE470275B (en) 1993-12-20
WO1993012560A1 (en) 1993-06-24
SE9103761L (en) 1993-06-20

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