SE448784B - Anordning for automatiskt tjockleksmetning av en metallfilm - Google Patents

Anordning for automatiskt tjockleksmetning av en metallfilm

Info

Publication number
SE448784B
SE448784B SE7906144A SE7906144A SE448784B SE 448784 B SE448784 B SE 448784B SE 7906144 A SE7906144 A SE 7906144A SE 7906144 A SE7906144 A SE 7906144A SE 448784 B SE448784 B SE 448784B
Authority
SE
Sweden
Prior art keywords
current
circuit
value
test piece
input
Prior art date
Application number
SE7906144A
Other languages
English (en)
Swedish (sv)
Other versions
SE7906144L (sv
Inventor
R Zeblisky
R J Thompson
W Tucker
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of SE7906144L publication Critical patent/SE7906144L/
Publication of SE448784B publication Critical patent/SE448784B/sv

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/422Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
SE7906144A 1978-07-19 1979-07-16 Anordning for automatiskt tjockleksmetning av en metallfilm SE448784B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US92607478A 1978-07-19 1978-07-19

Publications (2)

Publication Number Publication Date
SE7906144L SE7906144L (sv) 1980-01-20
SE448784B true SE448784B (sv) 1987-03-16

Family

ID=25452709

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7906144A SE448784B (sv) 1978-07-19 1979-07-16 Anordning for automatiskt tjockleksmetning av en metallfilm

Country Status (11)

Country Link
JP (1) JPS5923363B2 (de)
AT (1) AT377885B (de)
AU (1) AU3884378A (de)
BR (1) BR7805509A (de)
CH (1) CH640343A5 (de)
DE (1) DE2929567C2 (de)
FR (1) FR2431679A1 (de)
GB (1) GB2027212B (de)
IT (1) IT7949804A0 (de)
NL (1) NL7904876A (de)
SE (1) SE448784B (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5495178A (en) * 1992-11-10 1996-02-27 Cheng; David Method and apparatus for measuring film thickness
US5691648A (en) * 1992-11-10 1997-11-25 Cheng; David Method and apparatus for measuring sheet resistance and thickness of thin films and substrates
CN108712830B (zh) * 2018-05-30 2021-02-26 广东天承科技股份有限公司 一种电路板的无钯化学镀铜工艺

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3365663A (en) * 1962-06-29 1968-01-23 Shin Mitsubishi Jukogyo Kk Thickness measuring instrument for electro-conductive objects and associated methods
US4042880A (en) * 1974-01-07 1977-08-16 Unit Process Assemblies, Inc. Electrode assembly for measuring the effective thickness of thru-hole plating circuit board workpieces
JPS5262045A (en) * 1975-11-17 1977-05-23 Oki Electric Ind Co Ltd Measuring thickness of non-electrolytic copper plating of through-hole substrate

Also Published As

Publication number Publication date
DE2929567C2 (de) 1983-10-13
ATA497279A (de) 1984-09-15
JPS5517489A (en) 1980-02-06
SE7906144L (sv) 1980-01-20
GB2027212A (en) 1980-02-13
FR2431679B1 (de) 1983-06-17
NL7904876A (nl) 1980-01-22
AT377885B (de) 1985-05-10
FR2431679A1 (fr) 1980-02-15
IT7949804A0 (it) 1979-07-19
BR7805509A (pt) 1980-03-11
CH640343A5 (de) 1983-12-30
JPS5923363B2 (ja) 1984-06-01
AU3884378A (en) 1980-02-14
DE2929567A1 (de) 1980-01-31
GB2027212B (en) 1983-05-05

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