GB2027212B - Measuring the thickness of metallic films on insulating substrates - Google Patents
Measuring the thickness of metallic films on insulating substratesInfo
- Publication number
- GB2027212B GB2027212B GB7924748A GB7924748A GB2027212B GB 2027212 B GB2027212 B GB 2027212B GB 7924748 A GB7924748 A GB 7924748A GB 7924748 A GB7924748 A GB 7924748A GB 2027212 B GB2027212 B GB 2027212B
- Authority
- GB
- United Kingdom
- Prior art keywords
- measuring
- thickness
- insulating substrates
- metallic films
- films
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US92607478A | 1978-07-19 | 1978-07-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2027212A GB2027212A (en) | 1980-02-13 |
GB2027212B true GB2027212B (en) | 1983-05-05 |
Family
ID=25452709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB7924748A Expired GB2027212B (en) | 1978-07-19 | 1979-07-16 | Measuring the thickness of metallic films on insulating substrates |
Country Status (11)
Country | Link |
---|---|
JP (1) | JPS5923363B2 (en) |
AT (1) | AT377885B (en) |
AU (1) | AU3884378A (en) |
BR (1) | BR7805509A (en) |
CH (1) | CH640343A5 (en) |
DE (1) | DE2929567C2 (en) |
FR (1) | FR2431679A1 (en) |
GB (1) | GB2027212B (en) |
IT (1) | IT7949804A0 (en) |
NL (1) | NL7904876A (en) |
SE (1) | SE448784B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5691648A (en) * | 1992-11-10 | 1997-11-25 | Cheng; David | Method and apparatus for measuring sheet resistance and thickness of thin films and substrates |
US5495178A (en) * | 1992-11-10 | 1996-02-27 | Cheng; David | Method and apparatus for measuring film thickness |
CN108712830B (en) * | 2018-05-30 | 2021-02-26 | 广东天承科技股份有限公司 | Palladium-free chemical copper plating process for circuit board |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3365663A (en) * | 1962-06-29 | 1968-01-23 | Shin Mitsubishi Jukogyo Kk | Thickness measuring instrument for electro-conductive objects and associated methods |
US4042880A (en) * | 1974-01-07 | 1977-08-16 | Unit Process Assemblies, Inc. | Electrode assembly for measuring the effective thickness of thru-hole plating circuit board workpieces |
JPS5262045A (en) * | 1975-11-17 | 1977-05-23 | Oki Electric Ind Co Ltd | Measuring thickness of non-electrolytic copper plating of through-hole substrate |
-
1978
- 1978-08-11 AU AU38843/78A patent/AU3884378A/en active Pending
- 1978-08-24 BR BR7805509A patent/BR7805509A/en unknown
- 1978-08-25 JP JP53104312A patent/JPS5923363B2/en not_active Expired
-
1979
- 1979-06-21 NL NL7904876A patent/NL7904876A/en not_active Application Discontinuation
- 1979-07-16 GB GB7924748A patent/GB2027212B/en not_active Expired
- 1979-07-16 SE SE7906144A patent/SE448784B/en not_active IP Right Cessation
- 1979-07-18 CH CH670379A patent/CH640343A5/en not_active IP Right Cessation
- 1979-07-18 AT AT0497279A patent/AT377885B/en active
- 1979-07-18 FR FR7918577A patent/FR2431679A1/en active Granted
- 1979-07-19 DE DE2929567A patent/DE2929567C2/en not_active Expired
- 1979-07-19 IT IT7949804A patent/IT7949804A0/en unknown
Also Published As
Publication number | Publication date |
---|---|
IT7949804A0 (en) | 1979-07-19 |
GB2027212A (en) | 1980-02-13 |
JPS5923363B2 (en) | 1984-06-01 |
CH640343A5 (en) | 1983-12-30 |
JPS5517489A (en) | 1980-02-06 |
NL7904876A (en) | 1980-01-22 |
BR7805509A (en) | 1980-03-11 |
DE2929567C2 (en) | 1983-10-13 |
FR2431679A1 (en) | 1980-02-15 |
AT377885B (en) | 1985-05-10 |
ATA497279A (en) | 1984-09-15 |
SE7906144L (en) | 1980-01-20 |
FR2431679B1 (en) | 1983-06-17 |
AU3884378A (en) | 1980-02-14 |
SE448784B (en) | 1987-03-16 |
DE2929567A1 (en) | 1980-01-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |