FR2431679A1 - AUTOMATIC THICKNESS ANALYZER FOR MEASURING THE THICKNESS OF A METAL FILM LAYED ON AN INSULATING SUPPORT - Google Patents

AUTOMATIC THICKNESS ANALYZER FOR MEASURING THE THICKNESS OF A METAL FILM LAYED ON AN INSULATING SUPPORT

Info

Publication number
FR2431679A1
FR2431679A1 FR7918577A FR7918577A FR2431679A1 FR 2431679 A1 FR2431679 A1 FR 2431679A1 FR 7918577 A FR7918577 A FR 7918577A FR 7918577 A FR7918577 A FR 7918577A FR 2431679 A1 FR2431679 A1 FR 2431679A1
Authority
FR
France
Prior art keywords
thickness
analyzer
metal film
insulating support
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7918577A
Other languages
French (fr)
Other versions
FR2431679B1 (en
Inventor
Rudolph Zeblisky
J Rudy Thompson
William B Tucker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of FR2431679A1 publication Critical patent/FR2431679A1/en
Application granted granted Critical
Publication of FR2431679B1 publication Critical patent/FR2431679B1/fr
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Abstract

Analyseur permettant de mesurer automatiquement l'épaisseur d'une couche métallique mince déposée sur un support isolant On applique sur un échantillon d'essai un courant continu croissant à un taux constant. Si l'échantillon grille ou << claque >> avant que le courant maximum de sortie de l'analyseur soit atteint, la valeur du courant correspondant au courant de claquage est détectée et maintenue à l'aide d'un dispositif d'affichage jusqu'à ce que l'on effectue une remise à zéro. Une relation expérimentale permet de convertir automatiquement le courant de claquage en épaisseur correspondante du film métallique. Applications notamment à la mesure automatique de l'épaisseur de minces dépôts de bains de placage non-électrolytique.Analyzer for automatically measuring the thickness of a thin metal layer deposited on an insulating support. A continuous current increasing at a constant rate is applied to a test sample. If the sample burns or "snaps" before the maximum analyzer output current is reached, the current value corresponding to the breakdown current is detected and held using a display device until 'to perform a reset. An experimental relationship automatically converts the breakdown current to the corresponding thickness of the metal film. Applications in particular to the automatic measurement of the thickness of thin deposits of non-electrolytic plating baths.

FR7918577A 1978-07-19 1979-07-18 AUTOMATIC THICKNESS ANALYZER FOR MEASURING THE THICKNESS OF A METAL FILM LAYED ON AN INSULATING SUPPORT Granted FR2431679A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US92607478A 1978-07-19 1978-07-19

Publications (2)

Publication Number Publication Date
FR2431679A1 true FR2431679A1 (en) 1980-02-15
FR2431679B1 FR2431679B1 (en) 1983-06-17

Family

ID=25452709

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7918577A Granted FR2431679A1 (en) 1978-07-19 1979-07-18 AUTOMATIC THICKNESS ANALYZER FOR MEASURING THE THICKNESS OF A METAL FILM LAYED ON AN INSULATING SUPPORT

Country Status (11)

Country Link
JP (1) JPS5923363B2 (en)
AT (1) AT377885B (en)
AU (1) AU3884378A (en)
BR (1) BR7805509A (en)
CH (1) CH640343A5 (en)
DE (1) DE2929567C2 (en)
FR (1) FR2431679A1 (en)
GB (1) GB2027212B (en)
IT (1) IT7949804A0 (en)
NL (1) NL7904876A (en)
SE (1) SE448784B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5691648A (en) * 1992-11-10 1997-11-25 Cheng; David Method and apparatus for measuring sheet resistance and thickness of thin films and substrates
US5495178A (en) * 1992-11-10 1996-02-27 Cheng; David Method and apparatus for measuring film thickness
CN108712830B (en) * 2018-05-30 2021-02-26 广东天承科技股份有限公司 Palladium-free chemical copper plating process for circuit board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3365663A (en) * 1962-06-29 1968-01-23 Shin Mitsubishi Jukogyo Kk Thickness measuring instrument for electro-conductive objects and associated methods
US4042880A (en) * 1974-01-07 1977-08-16 Unit Process Assemblies, Inc. Electrode assembly for measuring the effective thickness of thru-hole plating circuit board workpieces

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5262045A (en) * 1975-11-17 1977-05-23 Oki Electric Ind Co Ltd Measuring thickness of non-electrolytic copper plating of through-hole substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3365663A (en) * 1962-06-29 1968-01-23 Shin Mitsubishi Jukogyo Kk Thickness measuring instrument for electro-conductive objects and associated methods
US4042880A (en) * 1974-01-07 1977-08-16 Unit Process Assemblies, Inc. Electrode assembly for measuring the effective thickness of thru-hole plating circuit board workpieces

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/70 *

Also Published As

Publication number Publication date
FR2431679B1 (en) 1983-06-17
JPS5517489A (en) 1980-02-06
AT377885B (en) 1985-05-10
IT7949804A0 (en) 1979-07-19
SE448784B (en) 1987-03-16
CH640343A5 (en) 1983-12-30
SE7906144L (en) 1980-01-20
ATA497279A (en) 1984-09-15
GB2027212B (en) 1983-05-05
JPS5923363B2 (en) 1984-06-01
NL7904876A (en) 1980-01-22
BR7805509A (en) 1980-03-11
DE2929567C2 (en) 1983-10-13
AU3884378A (en) 1980-02-14
DE2929567A1 (en) 1980-01-31
GB2027212A (en) 1980-02-13

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Legal Events

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