AT377885B - METHOD AND DEVICE FOR DETERMINING THE LAYER THICKNESS - Google Patents

METHOD AND DEVICE FOR DETERMINING THE LAYER THICKNESS

Info

Publication number
AT377885B
AT377885B AT0497279A AT497279A AT377885B AT 377885 B AT377885 B AT 377885B AT 0497279 A AT0497279 A AT 0497279A AT 497279 A AT497279 A AT 497279A AT 377885 B AT377885 B AT 377885B
Authority
AT
Austria
Prior art keywords
determining
layer thickness
thickness
layer
Prior art date
Application number
AT0497279A
Other languages
German (de)
Other versions
ATA497279A (en
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of ATA497279A publication Critical patent/ATA497279A/en
Application granted granted Critical
Publication of AT377885B publication Critical patent/AT377885B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Length Measuring Devices By Optical Means (AREA)
AT0497279A 1978-07-19 1979-07-18 METHOD AND DEVICE FOR DETERMINING THE LAYER THICKNESS AT377885B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US92607478A 1978-07-19 1978-07-19

Publications (2)

Publication Number Publication Date
ATA497279A ATA497279A (en) 1984-09-15
AT377885B true AT377885B (en) 1985-05-10

Family

ID=25452709

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0497279A AT377885B (en) 1978-07-19 1979-07-18 METHOD AND DEVICE FOR DETERMINING THE LAYER THICKNESS

Country Status (11)

Country Link
JP (1) JPS5923363B2 (en)
AT (1) AT377885B (en)
AU (1) AU3884378A (en)
BR (1) BR7805509A (en)
CH (1) CH640343A5 (en)
DE (1) DE2929567C2 (en)
FR (1) FR2431679A1 (en)
GB (1) GB2027212B (en)
IT (1) IT7949804A0 (en)
NL (1) NL7904876A (en)
SE (1) SE448784B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5495178A (en) * 1992-11-10 1996-02-27 Cheng; David Method and apparatus for measuring film thickness
US5691648A (en) * 1992-11-10 1997-11-25 Cheng; David Method and apparatus for measuring sheet resistance and thickness of thin films and substrates
CN108712830B (en) * 2018-05-30 2021-02-26 广东天承科技股份有限公司 Palladium-free chemical copper plating process for circuit board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3365663A (en) * 1962-06-29 1968-01-23 Shin Mitsubishi Jukogyo Kk Thickness measuring instrument for electro-conductive objects and associated methods
US4042880A (en) * 1974-01-07 1977-08-16 Unit Process Assemblies, Inc. Electrode assembly for measuring the effective thickness of thru-hole plating circuit board workpieces
JPS5262045A (en) * 1975-11-17 1977-05-23 Oki Electric Ind Co Ltd Measuring thickness of non-electrolytic copper plating of through-hole substrate

Also Published As

Publication number Publication date
AU3884378A (en) 1980-02-14
FR2431679B1 (en) 1983-06-17
DE2929567A1 (en) 1980-01-31
SE448784B (en) 1987-03-16
BR7805509A (en) 1980-03-11
JPS5923363B2 (en) 1984-06-01
DE2929567C2 (en) 1983-10-13
SE7906144L (en) 1980-01-20
GB2027212A (en) 1980-02-13
IT7949804A0 (en) 1979-07-19
NL7904876A (en) 1980-01-22
GB2027212B (en) 1983-05-05
FR2431679A1 (en) 1980-02-15
ATA497279A (en) 1984-09-15
JPS5517489A (en) 1980-02-06
CH640343A5 (en) 1983-12-30

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