SE437444B - Halvledaranordning med minst en halvledarkomponent och med en kylkropp - Google Patents

Halvledaranordning med minst en halvledarkomponent och med en kylkropp

Info

Publication number
SE437444B
SE437444B SE7709019A SE7709019A SE437444B SE 437444 B SE437444 B SE 437444B SE 7709019 A SE7709019 A SE 7709019A SE 7709019 A SE7709019 A SE 7709019A SE 437444 B SE437444 B SE 437444B
Authority
SE
Sweden
Prior art keywords
cooling body
semiconductor
semiconductor device
component
semiconductor component
Prior art date
Application number
SE7709019A
Other languages
English (en)
Swedish (sv)
Other versions
SE7709019L (sv
Inventor
W Schierz
C Butenschon
Original Assignee
Semikron Gleichrichterbau
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Gleichrichterbau filed Critical Semikron Gleichrichterbau
Publication of SE7709019L publication Critical patent/SE7709019L/xx
Publication of SE437444B publication Critical patent/SE437444B/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
SE7709019A 1976-08-28 1977-08-09 Halvledaranordning med minst en halvledarkomponent och med en kylkropp SE437444B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762638909 DE2638909A1 (de) 1976-08-28 1976-08-28 Halbleiteranordnung

Publications (2)

Publication Number Publication Date
SE7709019L SE7709019L (sv) 1978-03-01
SE437444B true SE437444B (sv) 1985-02-25

Family

ID=5986646

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7709019A SE437444B (sv) 1976-08-28 1977-08-09 Halvledaranordning med minst en halvledarkomponent och med en kylkropp

Country Status (9)

Country Link
US (1) US4209799A (enExample)
JP (1) JPS5329078A (enExample)
BR (1) BR7704944A (enExample)
CH (1) CH617535A5 (enExample)
DE (1) DE2638909A1 (enExample)
FR (1) FR2363194A1 (enExample)
GB (1) GB1594141A (enExample)
IT (1) IT1081539B (enExample)
SE (1) SE437444B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4404739A (en) * 1980-04-21 1983-09-20 Thermal Associates, Inc. Method for mounting, electrically isolating and maintaining constant pressure on a semiconductor element
FR2495846A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de connexion electrique a haute densite de contacts
FR2495838A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de refroidissement amovible pour supports de circuits integres
JP2569003B2 (ja) * 1986-03-20 1997-01-08 株式会社日立製作所 熱伝導装置
FR2614469B1 (fr) * 1987-04-24 1989-07-21 Inrets Dispositif de refroidissement, en particulier pour semi-conducteur de puissance
US4783428A (en) * 1987-11-23 1988-11-08 Motorola Inc. Method of producing a thermogenetic semiconductor device
US5058660A (en) * 1990-03-09 1991-10-22 Kohler Co. Shared coolant system for marine generator
US4987953A (en) * 1990-03-09 1991-01-29 Kohler Company Shared coolant system for marine generator
JPH06325708A (ja) * 1993-05-18 1994-11-25 Hamamatsu Photonics Kk Ｘ線発生装置
US5594355A (en) * 1994-07-19 1997-01-14 Delta Design, Inc. Electrical contactor apparatus for testing integrated circuit devices
US5792677A (en) * 1997-01-16 1998-08-11 Ford Motor Company Embedded metal planes for thermal management

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE527420A (enExample) * 1953-03-20
NL193055A (enExample) * 1954-01-14 1900-01-01
US2862159A (en) * 1954-10-29 1958-11-25 Raytheon Mfg Co Conduction cooled rectifiers
DE1042762B (de) * 1955-02-26 1958-11-06 Siemens Ag Flaechengleichrichter bzw. -transistor, welcher mit mindestens einer seiner Elektroden flaechenhaft mit einem die Verlustwaerme abfuehrenden Koerper in Kontakt steht
JPS4213216Y1 (enExample) * 1966-04-18 1967-07-27
US3396361A (en) * 1966-12-05 1968-08-06 Solitron Devices Combined mounting support, heat sink, and electrical terminal connection assembly
DE1614012A1 (de) * 1967-06-16 1970-03-26 Theodor Kiepe Elektrotechn Fab Anordnung zur Abfuehrung der in Halbleiterelementen,wie Dioden,Thyristoren u.dgl.erzeugten Waerme
US3483444A (en) * 1967-12-06 1969-12-09 Int Rectifier Corp Common housing for independent semiconductor devices
SE354943B (enExample) * 1970-02-24 1973-03-26 Asea Ab
SE382282B (sv) * 1971-02-13 1976-01-19 Bbc Brown Boveri & Cie For minst en halvledarskivcell avsett tryckfeste med kylanordning, innefattande vermeror med inre kapillerstruktur.
BE791418A (enExample) * 1971-11-16 1973-05-16 Int Standard Electric Corp
US3768548A (en) * 1972-03-02 1973-10-30 Motor Co Cooling apparatus for semiconductor devices
DE2337694C2 (de) * 1973-07-25 1984-10-25 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichteranordnung hoher Strombelastbarkeit
JPS5512740B2 (enExample) * 1974-03-15 1980-04-03
JPS5241149B2 (enExample) * 1974-03-16 1977-10-17
DE7512573U (de) * 1975-04-19 1975-09-04 Semikron Gesellschaft Fuer Gleichri Halbleitergleichrichteranordnung

Also Published As

Publication number Publication date
US4209799A (en) 1980-06-24
IT1081539B (it) 1985-05-21
FR2363194A1 (fr) 1978-03-24
JPS5329078A (en) 1978-03-17
DE2638909A1 (de) 1978-03-02
BR7704944A (pt) 1978-04-25
FR2363194B1 (enExample) 1985-02-22
GB1594141A (en) 1981-07-30
SE7709019L (sv) 1978-03-01
CH617535A5 (enExample) 1980-05-30

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