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1971-02-13 |
1977-09-02 |
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JPS4887779A
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1972-02-01 |
1973-11-17 |
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1972-09-28 |
1977-03-15 |
Dynatherm Corporation |
Cooling a heat-producing electrical or electronic component
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1972-11-02 |
1977-07-19 |
Mcdonnell Douglas Corporation |
Permafrost stabilizing heat pipe assembly
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1972-12-28 |
1976-11-02 |
Ckd Praha, Oborovy Podnik |
Semi conductor cooling system
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CS159563B1
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1972-12-28 |
1975-01-31 |
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1973-05-02 |
1974-12-03 |
Gen Electric |
Nonwicked heat-pipe cooled power semiconductor device assembly having enhanced evaporated surface heat pipes
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1973-05-02 |
1974-12-03 |
Gen Electric |
Double-sided heat-pipe cooled power semiconductor device assembly
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1973-06-18 |
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Gen Electric |
Heat-pipe cooled power semiconductor device assembly having integral semiconductor device evaporating surface unit
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1973-06-18 |
1974-12-03 |
Gen Electric |
Heat sink cooled power semiconductor device assembly having liquid metal interface
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1973-07-02 |
1974-07-30 |
Gen Electric |
Double-sided heat-pipe cooled power semiconductor device assembly using compression rods
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1974-04-22 |
1977-04-05 |
Mcdonnell Douglas Corporation |
Permafrost stabilizing heat pipe assembly
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1976-08-28 |
1978-03-02 |
Semikron Gleichrichterbau |
Halbleiteranordnung
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1977-06-13 |
1979-03-20 |
General Electric Company |
Power module with isolated substrates cooled by integral heat-energy-removal means
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1990-02-07 |
1993-07-20 |
Ngk Insulators, Ltd. |
Power semiconductor device with heat dissipating property
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Lsi Logic Corporation |
Fluid-filled and gas-filled semiconductor packages
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1997-10-20 |
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Fujitsu Ltd |
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1998-04-27 |
2000-04-04 |
Hewlett-Packard Company |
Low EMI emissions heat sink device
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1999-10-12 |
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Apparatus for cooling a heat generating component in a computer
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2000-01-13 |
2002-05-28 |
Lucent Technologies Inc. |
Top mounted cooling device using heat pipes
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2001-07-26 |
2004-01-11 |
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Heat dissipating module with a self rapid heat conduction
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2001-12-10 |
2006-10-24 |
Ncr Corp. |
Heat sink for enhanced heat dissipation
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2002-10-29 |
2004-05-11 |
Taiwan Trigem Information Co., Ltd. |
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2010-11-11 |
Neobulb Technologies Inc |
Um equipamento de iluminação com led de alta potência, dispondo de uma elevada difusibilidade térmica
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2005-08-19 |
2011-04-12 |
Neobulb Technologies, Inc. |
Light-emitting diode illuminating equipment with high power and high heat dissipation efficiency
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2006-07-05 |
2009-02-24 |
Jaffe Limited |
Heat-dissipating structure for LED lamp
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2009-02-24 |
Jaffe Limited |
Multiple-set heat-dissipating structure for LED lamp
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2008-10-29 |
2010-06-22 |
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Solid state lighting apparatus utilizing axial thermal dissipation
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三菱電機株式会社 |
半導体パワーモジュール
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