FR2614469B1 - Dispositif de refroidissement, en particulier pour semi-conducteur de puissance - Google Patents

Dispositif de refroidissement, en particulier pour semi-conducteur de puissance

Info

Publication number
FR2614469B1
FR2614469B1 FR8705816A FR8705816A FR2614469B1 FR 2614469 B1 FR2614469 B1 FR 2614469B1 FR 8705816 A FR8705816 A FR 8705816A FR 8705816 A FR8705816 A FR 8705816A FR 2614469 B1 FR2614469 B1 FR 2614469B1
Authority
FR
France
Prior art keywords
cooling device
power semiconductor
semiconductor
power
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8705816A
Other languages
English (en)
Other versions
FR2614469A1 (fr
Inventor
Gerard Coquery
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CELDUC
Institut National de Recherche sur les Transports et leur Securite INRETS
Alstom SA
Original Assignee
CELDUC
Institut National de Recherche sur les Transports et leur Securite INRETS
Alstom SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CELDUC, Institut National de Recherche sur les Transports et leur Securite INRETS, Alstom SA filed Critical CELDUC
Priority to FR8705816A priority Critical patent/FR2614469B1/fr
Publication of FR2614469A1 publication Critical patent/FR2614469A1/fr
Application granted granted Critical
Publication of FR2614469B1 publication Critical patent/FR2614469B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8705816A 1987-04-24 1987-04-24 Dispositif de refroidissement, en particulier pour semi-conducteur de puissance Expired FR2614469B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8705816A FR2614469B1 (fr) 1987-04-24 1987-04-24 Dispositif de refroidissement, en particulier pour semi-conducteur de puissance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8705816A FR2614469B1 (fr) 1987-04-24 1987-04-24 Dispositif de refroidissement, en particulier pour semi-conducteur de puissance

Publications (2)

Publication Number Publication Date
FR2614469A1 FR2614469A1 (fr) 1988-10-28
FR2614469B1 true FR2614469B1 (fr) 1989-07-21

Family

ID=9350440

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8705816A Expired FR2614469B1 (fr) 1987-04-24 1987-04-24 Dispositif de refroidissement, en particulier pour semi-conducteur de puissance

Country Status (1)

Country Link
FR (1) FR2614469B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5168425A (en) * 1991-10-16 1992-12-01 General Electric Company Mounting arrangements for high voltage/high power semiconductors
DE19711965C2 (de) * 1997-03-21 1999-01-14 Siemens Ag Vorrichtung zur niederinduktiven Anbindung eines abschaltbaren Thyristors an seine Ansteuereinrichtung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH526857A (de) * 1970-09-29 1972-08-15 Bbc Brown Boveri & Cie Halbleitereinheit und Verfahren zur Herstellung derselben
DE2638909A1 (de) * 1976-08-28 1978-03-02 Semikron Gleichrichterbau Halbleiteranordnung
US4266267A (en) * 1979-11-19 1981-05-05 General Electric Company Mounting arrangement for transistors and the like
DE3005313C2 (de) * 1980-02-13 1986-05-28 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiteranordnung
EP0100626A3 (fr) * 1982-07-29 1985-11-06 LUCAS INDUSTRIES public limited company Assemblage à semi-conducteur
US4646203A (en) * 1985-02-06 1987-02-24 Lutron Electronics Co., Inc. Mounting structure for semiconductor devices
US4602125A (en) * 1985-05-10 1986-07-22 The Bergquist Company Mounting pad with tubular projections for solid-state devices

Also Published As

Publication number Publication date
FR2614469A1 (fr) 1988-10-28

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Legal Events

Date Code Title Description
ST Notification of lapse