SE422645B - Diskret overkorsningschips for enskilda ledningskorsningar vid hybridkretsar och forfarande for dess framstellning - Google Patents

Diskret overkorsningschips for enskilda ledningskorsningar vid hybridkretsar och forfarande for dess framstellning

Info

Publication number
SE422645B
SE422645B SE7606716A SE7606716A SE422645B SE 422645 B SE422645 B SE 422645B SE 7606716 A SE7606716 A SE 7606716A SE 7606716 A SE7606716 A SE 7606716A SE 422645 B SE422645 B SE 422645B
Authority
SE
Sweden
Prior art keywords
circuits
procedure
manufacturing
discrete cross
cross chip
Prior art date
Application number
SE7606716A
Other languages
English (en)
Swedish (sv)
Other versions
SE7606716L (sv
Inventor
K Breuninger
D Haberland
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE7606716L publication Critical patent/SE7606716L/xx
Publication of SE422645B publication Critical patent/SE422645B/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Electric Cables (AREA)
SE7606716A 1975-06-13 1976-06-11 Diskret overkorsningschips for enskilda ledningskorsningar vid hybridkretsar och forfarande for dess framstellning SE422645B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2526554A DE2526554C3 (de) 1975-06-13 1975-06-13 Diskretes Überkreuzungschip für einzelne Leiterbahnfiberkreuzungen bei Hybridschaltungen und Verfahren zu seiner Herstellung

Publications (2)

Publication Number Publication Date
SE7606716L SE7606716L (sv) 1976-12-14
SE422645B true SE422645B (sv) 1982-03-15

Family

ID=5949068

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7606716A SE422645B (sv) 1975-06-13 1976-06-11 Diskret overkorsningschips for enskilda ledningskorsningar vid hybridkretsar och forfarande for dess framstellning

Country Status (7)

Country Link
JP (1) JPS5214870A (OSRAM)
CH (1) CH594990A5 (OSRAM)
DE (1) DE2526554C3 (OSRAM)
FR (1) FR2334210A1 (OSRAM)
GB (1) GB1545892A (OSRAM)
IT (1) IT1063983B (OSRAM)
SE (1) SE422645B (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0237805A (ja) * 1988-07-28 1990-02-07 Oki Electric Ind Co Ltd ページャー用アンテナ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5212040Y2 (OSRAM) * 1972-04-11 1977-03-16

Also Published As

Publication number Publication date
DE2526554C3 (de) 1980-03-20
SE7606716L (sv) 1976-12-14
JPS5214870A (en) 1977-02-04
FR2334210A1 (fr) 1977-07-01
DE2526554B2 (de) 1979-07-12
DE2526554A1 (de) 1976-12-16
GB1545892A (en) 1979-05-16
CH594990A5 (OSRAM) 1978-01-31
IT1063983B (it) 1985-02-18
FR2334210B1 (OSRAM) 1978-12-15

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