SE413753B - PROCEDURE FOR MANUFACTURING A SUBSTRATE MATERIAL FOR PRINTED COUPLES - Google Patents
PROCEDURE FOR MANUFACTURING A SUBSTRATE MATERIAL FOR PRINTED COUPLESInfo
- Publication number
- SE413753B SE413753B SE7309928A SE7309928A SE413753B SE 413753 B SE413753 B SE 413753B SE 7309928 A SE7309928 A SE 7309928A SE 7309928 A SE7309928 A SE 7309928A SE 413753 B SE413753 B SE 413753B
- Authority
- SE
- Sweden
- Prior art keywords
- foil
- layer
- coated
- resin
- surface layer
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
- B05D1/286—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers using a temporary backing to which the coating has been applied
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
- B05D5/067—Metallic effect
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/48—Preparation of the surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/06—Layered products comprising a layer of paper or cardboard specially treated, e.g. surfaced, parchmentised
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/16—Tin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2317/00—Animal or vegetable based
- B32B2317/12—Paper, e.g. cardboard
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2327/00—Polyvinylhalogenides
- B32B2327/06—PVC, i.e. polyvinylchloride
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2327/00—Polyvinylhalogenides
- B32B2327/12—Polyvinylhalogenides containing fluorine
- B32B2327/18—PTFE, i.e. polytetrafluoroethylene
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Description
É 7309928-s Å is 2 10 15 20 25 30 35 H0 när det gäller att få perfekta. släta och jämntjocka ytskikt, på vilka efterföljande behandlingssteg kan utföras med förutsägligt resultat. Lackering är ej heller lämplig när man vill få harts- rika ytskikt av den tjocklek som erfordras för framställning av tryckta kopplingar. É 7309928-s Å is 2 10 15 20 25 30 35 H0 when it comes to getting perfect. smooth and evenly thick surface layers, on which subsequent treatment steps can be performed with predictable results. Varnishing is also not suitable when you want to get resin-rich surface layers of the thickness required for the production of printed couplings.
I Det är också känt att anbringa ett hartsrikt ytskikt på papper eller andra material genom att laminera eller limma en lämplig plastfolie på materialets yta. En väsentlig olägenhet med. denna metod är att folien kan delamineras under användning eller under inverkan av värme.It is also known to apply a resinous surface layer to paper or other materials by laminating or gluing a suitable plastic film to the surface of the material. A significant inconvenience with. this method is that the foil can be delaminated during use or under the influence of heat.
Additiva förfaranden för framställning av tryckta kopplingar kräver ett jämnt hartsrikt ytskikt av minst 20 um för att ge en stark och jämn vidhäftning av på strömlös väg bildade metallbeläggningar och ge släta ytor för kopiering. Hittills har laminat av arkstorlek, som skurits till plattor (t.ex. 100 X 200 mm), belagts vart för sig med flera metoder, inklusive valsning, dopp- ning och sprutning. Dessa metoder ger dålig reglering av tjock- leken och medför produktionstekniska svårigheter, enär man måste hantera ett stort antal plattor.Additive processes for making printed couplings require a uniform resinous surface layer of at least 20 microns to provide strong and even adhesion of electrolessly formed metal coatings and to provide smooth surfaces for copying. To date, sheet size laminates, which have been cut into slabs (eg 100 X 200 mm), have been coated separately by several methods, including rolling, dipping and spraying. These methods give poor regulation of the thickness and cause production technical difficulties, since you have to handle a large number of plates.
Dessa och andra olägenheter med kända metoder övervinnes med föreliggande uppfinning.These and other disadvantages of known methods are overcome by the present invention.
Fig. 1 visar en apparat för beläggning av ett överförings- material med ett skikt av härdbart harts. 7 Pig. 2, 3 och H visar tvärsnill av ett hartnnndurlag belagt med ett härdat hartsskikt och ett övcrföringsmatcrial, av underlaget med överföringsmaterialet borttaget och av underlaget med den frilagda härdade hartsrika ytan aktiverad för mottagning av metall..Fig. 1 shows an apparatus for coating a transfer material with a layer of curable resin. 7 Pig. 2, 3 and H show transversely of a resin substrate coated with a cured resin layer and a transfer material, of the substrate with the transfer material removed and of the substrate with the exposed cured resin-rich surface activated for receiving metal.
Uppfinningen avser ett förfarande för framställning av ett underlagsmaterial för tryckta kopplingar, vilket har ett harts- rikt ytskikt av reglerad tjocklek och förutbestämda mekaniska, kemiska, elektriska och optiska egenskaper. Förfarandet består i att belägga en folie av ett överföringsmaterial med ett skikt av en viskös flytande opolymeriscrad komposition, som är hürdhar genom polymerisation eller förnätning, varvid övcriövíngsmaLerialet inte häftar vid beläggningsskiktet i härdat tillstånd, aLt partiellt härda kompositionen i sådan utsträckning, att närliggande belagda ytor inte häftar vid varandra, att därefter bringa foliens parti- ellt härdade belagda yta i intim kontakt med ett permanent under- lag, vilket häftar vid beläggningsskiktet i dess härdade tillstånd, 10 15 20 25 30 35 H0 7309928-si att fullborda härdningen av beläggningsskiktet genom polymerisation eller förnätning samt att sedan dra av folien, såsom närmare anges i kravet 1.The invention relates to a process for producing a substrate material for printed couplings, which has a resin-rich surface layer of controlled thickness and predetermined mechanical, chemical, electrical and optical properties. The process consists in coating a film of a transfer material with a layer of a viscous liquid polymeric composition which is cured by polymerization or crosslinking, the overcoat material not adhering to the coating layer in the cured state, or partially curing the composition to such an extent that do not adhere to each other, to subsequently bring the partially cured coated surface of the film into intimate contact with a permanent substrate, which adheres to the coating layer in its cured state, to complete the curing of the coating layer by polymerization or crosslinking and then peeling off the film, as further specified in claim 1.
Beläggningskomposítionen påläggs helst utan eller i huvudsak utan lösningsmedel och är opolymeriserad. Det är av vikt att sedan partiellt härda det, d.v.s. till "B-stadiet", för att få en oklibbig och inte helt härdad yta. Detta gör det möjligt att linda den belagda överföringsmnlurialfolivn till en rulle utan risk för att den bildar ett stelt block, som inte kan rullas upp. Dess- utom undvikes risken för att hartset skall slå genom ytskiktet, och vidare förenklas tillverkningen av permanenta underlag, som har olika ytskikt av hartskompositioner, såsom epoxihartser, bindemedel m.m., genom att blandning förebryggs. Överförïngsfolien kan exempelvis utgöras av plast- eller metallbelagt papper, såsom sílikonbelugt papper, polyetenbelagt papper eller aluminiserat papper, plastfilmer, såsom polyeten, poly- vinylklorid, polyvinylfluorid och polyestrar, t.ex. polyalkylen- tereftalat, samt metallfolie, såsom aluminium, tenn eller koppar.The coating composition is preferably applied without or substantially without solvent and is unpolymerized. It is important to then partially cure it, i.e. to the "B-stage", to get a non-sticky and not completely hardened surface. This makes it possible to wrap the coated transfer mineral foil into a roll without the risk of it forming a rigid block which cannot be rolled up. In addition, the risk of the resin penetrating the surface layer is avoided, and the production of permanent substrates having different surface layers of resin compositions, such as epoxy resins, binders, etc., is simplified by pre-mixing. The transfer film may be, for example, plastic or metal-coated paper, such as silicone-coated paper, polyethylene-coated paper or aluminized paper, plastic films, such as polyethylene, polyvinyl chloride, polyvinyl fluoride and polyesters, e.g. polyalkylene terephthalate, and metal foil, such as aluminum, tin or copper.
I vissa fall kan det vara tillrâdligt att använda ett släppmedel, t.ex. ett vax eller en silikon, för att underlätta avdrag- ningen av överföringsfolien sedan beläggningen har härdats. ï föredragna utföringsformer är det permanenta under- lagets yta (efter avdragning av överföringsfolien) lämpad att motta vidhäftande metallavsättningar. Den är ett bindemedel.In some cases it may be advisable to use a release agent, e.g. a wax or a silicone, to facilitate the peeling off of the transfer foil after the coating has hardened. In preferred embodiments, the surface of the permanent substrate (after peeling off the transfer foil) is suitable for receiving adhesive metal deposits. It is a binder.
I andra utföringsformer kan man efterbehandla det harts- rika ytskikten, som eventuellt kan vara ett bindemedelsskikt, på känt sätt för att göra det permanent polariserat och mikroporöst.In other embodiments, the resin-rich surface layer, which may be an adhesive layer, can be post-treated in a known manner to make it permanently polarized and microporous.
Detta ger ett aktiverat underlag för metallísering med_förbättrad förbandsstyrka. Polarisering och vütbarhet framkallas exempelvis genom behandling av den härdade hartsytan först med ett förakti- veringsmedel, t.ex. dimetylformamid, dimetylsulfoxíd eller en blandning av toluen och vatten, beroende på det härdade hartsets beskaffenhet, sedan med en aktivator, såsom en blandning av krom- syra och svavelsyra, och sedan med ett reduktionsmedel, såsom natriumsulfit. Resultatet av denna behandling är en permanent pola- riserad vätbar yta. _ Sådana metoder, inklusive metoder för strömlös metalli- sering, beskrivs närmare i svenska patentansökan 7302091~9.This provides an activated substrate for metallization with_improved joint strength. Polarization and wettability are induced, for example, by treating the cured resin surface first with a pre-activating agent, e.g. dimethylformamide, dimethylsulfoxide or a mixture of toluene and water, depending on the nature of the cured resin, then with an activator such as a mixture of chromic acid and sulfuric acid, and then with a reducing agent such as sodium sulfite. The result of this treatment is a permanently polarized wettable surface. Such methods, including methods for electroless metallization, are described in more detail in Swedish patent application 7302091 ~ 9.
Den härdbara kompositionen kan även vara delvis ned- brytbar eller innehålla nedbrytbara partiklar, såsom hartspartiklar POOR QUALITY 10 15 20 25 30 35 H0 73019928-5 med reaktiva ställen, och göras mikrporös och sålunda aktiveras för mottagning av häftande metallbeläggningar genom behandling med lämpliga medel, såsom kromsyra eller permanganat. Sådana kompo- Å isitioner och metoder, inklusive den strömlösa metalliseringen, be- skrivs närmare i amerikanska patentskriften 3 625 758. >Gruppen av lämpliga beläggningsmaterial är inte be- q gränsad till de ovannämnda. Materialet kan vara en monomerkombina- tion, en katalyserad monomer, en katalyserad blandning av monomer och polymer eller att tvåkomponentsmaterial. Föredragna hartser är fenolhartser, polyepoxider, melaminhartser, polyakrylat, polyestrar, nitrilgummin, härdbara styrenhartser och blandningar av dem.The curable composition may also be partially degradable or contain degradable particles, such as resin particles with reactive sites, and be rendered microporous and thus activated to receive adhesive metal coatings by treatment with suitable means. such as chromic acid or permanganate. Such compositions and methods, including electroless metallization, are further described in U.S. Pat. No. 3,625,758. The group of suitable coating materials is not limited to the foregoing. The material may be a monomer combination, a catalyzed monomer, a catalyzed mixture of monomer and polymer or a two component material. Preferred resins are phenolic resins, polyepoxides, melamine resins, polyacrylates, polyesters, nitrile rubbers, curable styrene resins and mixtures thereof.
A I en föredragen utföringsform av uppfinningen är det permanenta underlagsmaterialet självt härdbart genom polymerisa- tion eller förnätning och härdas beläggningsskiktet och underlags- materialet samtidigt före avdragning av överföringsfolien.In a preferred embodiment of the invention, the permanent substrate material itself is curable by polymerization or crosslinking and the coating layer and the substrate material are cured simultaneously before peeling off the transfer foil.
I I andra föredragna utföringsformer är beläggningen eller den hartsrika ytan, som har härdats samtidigt med underlaget, genom- gående katalytisk för avsättning av metall ur strömlöst arbetande metallavsättningslösningar. Sådana ytor behöver inte behandlas med sensibiliseringsbad för att bli katalytiska, vilket förenklar till- verkningen och underlättar framställningen av tryckta kopplingar, K enär borrhål i sådana material får katalytiska väggar, varpå led- ande metallskikt kan avsättas vid doppning i strömlöst arbetande bad.In other preferred embodiments, the coating or resin-rich surface, which has been cured simultaneously with the substrate, is consistently catalytic for deposition of metal from electroless metal deposition solutions. Such surfaces do not need to be treated with sensitization baths to become catalytic, which simplifies the manufacture and facilitates the production of printed couplings, since boreholes in such materials have catalytic walls, whereupon conductive metal layers can be deposited by immersion in electroless baths.
Man kan också tänka sig att använda material, som är genomgående katalytiska för strömlös avsättning av metall, såsom permanenta underlag. _ ' Man kan exempelvis använda en härdbar katalytisk massa av det slag, som anges i amerikanska patentskriften 3 226 256 och kanadensiska patentskriften 895 590. Väsentligen innehåller massan en dispersion i ett hartsbindemedel av fina partiklar av ett medel, ; som är mottagligt för strömlös metallavsättning, t.ex. en metall, 1, såsom titan, aluminium, koppar, järn, kobolt, zink eller blandningar, av dessa eller någon annan metall i grupp IB, IV eller VIII, eller ett salt, ett komplex eller en oxid därav, såsom en klorid, en bromid, en fluorid, ett etylacetoacetat, ett fluoroborat, en jodid, ett nitrat, ett sulfat, ett acetat eller en oxid av en sådan metall.It is also conceivable to use materials which are consistently catalytic for electroless deposition of metal, as permanent substrates. For example, a curable catalytic pulp of the type disclosed in U.S. Pat. No. 3,226,256 and Canadian Pat. No. 895,590 may be used. Essentially, the pulp contains a dispersion in a resin binder of fine particles of an agent; which is susceptible to electroless metal deposition, e.g. a metal, 1, such as titanium, aluminum, copper, iron, cobalt, zinc or mixtures, of these or any other metal in group IB, IV or VIII, or a salt, a complex or an oxide thereof, such as a chloride, a bromide, a fluoride, an ethyl acetoacetate, a fluoroborate, an iodide, a nitrate, a sulphate, an acetate or an oxide of such a metal.
Särskilt användbara är palladium, guld, platina, koppar, palladium- klorid, guldklorid, platinaklorid, kopparoxid och stannoklorid. Halten katalytisk förening i den härdade beläggningen eller det hartsrika skik- tet är vanligen mellan 0,001 och 25 vik -%. Företrädesvis är halten katalytisk förening under 10 vikt-%.i 10 15 20 25 30 35 H0 7309928-5 Enligt figur 1 genomföres förfarandet i stor skala genom att överföringsfolien 2 beläggs med det hartsrika skiktet U mellan valsar 6 och 8 och den belagda folien lindas till en rulle 10 sedan hartsskiktet har partiellt härdats till B-stadiet genom värmning med lampor 16. Sedan avskärs stycken av erforderlig storlek (t.ex. 900 x 1200 mm), vilka kombineras med ämnen av underlagsmaterial och förenas med dem medelst värme och tryck i en lamineringspress.Particularly useful are palladium, gold, platinum, copper, palladium chloride, gold chloride, platinum chloride, copper oxide and stannous chloride. The content of catalytic compound in the cured coating or the resin-rich layer is usually between 0.001 and 25% by weight. Preferably, the content of catalytic compound is below 10% by weight. According to Figure 1, the process is carried out on a large scale by coating the transfer foil 2 with the resin-rich layer U between rollers 6 and 8 and wrapping the coated foil. to a roll 10 after the resin layer has been partially cured to the B stage by heating with lamps 16. Then pieces of the required size (eg 900 x 1200 mm) are cut off, which are combined with blanks of substrate material and joined to them by heat and pressure in a lamination press.
Det ur pressen uttagna föremålet ser ut så som visas i tvärsnitt i figur 2 och innefattar överföringsfolien 2, det per- manenta underlaget 12 och det härdade beläggningsskiktet H. Figur 3 visar det belagda underlaget sedan överföringsfolien har dragits av.The article removed from the press looks as shown in cross section in Figure 2 and comprises the transfer foil 2, the permanent substrate 12 and the cured coating layer H. Figure 3 shows the coated substrate after the transfer foil has been peeled off.
Figur U visar ett föredraget utförande där mikroporer 1H är upptagna i ytskiktet. Dessa fylls med metall under den senare eventuella metalliseringnn och underlättar metallens häftunde vid den harts- rika ytan. Överföringsfolien kan användas både som medel för på- läggning av det härdbara hartset på plattämnet och som släppmedel i pressen.Figure U shows a preferred embodiment where micropores 1H are accommodated in the surface layer. These are filled with metal during the later possible metallization and facilitate the adhesion of the metal to the resin-rich surface. The transfer foil can be used both as a means for applying the curable resin to the blank and as a release agent in the press.
Vid laminattillverkning erbjuder förfarandet följande fördelar. Kravet på liten tjocklek hos det hartsrika skiktet kan lätt uppfyllas genom svag överdosering av den våta filmens tjocklek, vilket undviker problemet med lösningsbeläggning av enskilda plattor.In laminate manufacturing, the process offers the following advantages. The small thickness requirement of the resinous layer can be easily met by slight overdose of the wet film thickness, which avoids the problem of solution coating of individual plates.
Beläggning i stor skala på en löpande bana går mycket snabbare och är mera ekonomisk än beläggning av enskilda små stycken. Bearbet- ningen går lätt att inpassa i existerande processer och apparater för lamínattillvorkning. Man får ett tätare och jämnare ytskikt, som är mera fritt från fina hål, tål hantering bättre, har bättre upplösning vid kopieringsprocesser och ger högre avskalningshåll- fasthet hos senare pålagda metallskikt än beläggningar erhållna ur lösning. Överföringsprocessen möjliggör användning av ett annat harts i ytskiktet än inom laminatet. Tidigare försök att belägga fenolhartsämnen med hartsytskikt har medfört genomslag och blandning av hartset i ämnet med ytskiktshartset. Enär hartset i ämnet inte aktiveras för vidhäftning på det för det pålagda ytskiktet före- skrivna sättet, har oförutsägliga och låga värden på avskalnings- styrkan ofta erhållits efter metallisering. Tillverkare av eldbe- ständiga laminat med hartsrika ytor kan med fördel tillämpa före- liggande förfarande. De för närvarande tillämpade åtgärderna inne- bär dubbel eller trefaldig doppning av glasväven, som har dålig upptagning, användning av finmaskig väv, som har bättre upptagning, tillsats av expanderad silika för att öka hartsupptagningen samt 10 15 20 25 30 äs H0 'silika samt tillräckligt med metyletylketon, cellosolvacetat och -7309928-5 noggrann reglering av flödet medelst besvärliga och dyra inställningar K = av torkningsbetingelser och katalysatorer. Överföringsfoliematerialet kan avsiktligt väljas så, att 5 det häftar vid det pålagda hartsytskiktet för att bilda mellanlägg vid stapling såväl som ge skydd under stansning av plattor, hål- Q slagning och borrning. Om det icke är avdragbart för hand, kan ' överföringsunderlaget vara kemiskt avtagbart, såsom är fallet med aluminiumfolie. ' Följande exempel åskådliggör uppfinningen.Large-scale paving on a running track is much faster and is more economical than paving individual small pieces. The processing can easily be integrated into existing processes and devices for laminate production. You get a denser and smoother surface layer, which is more free of fine holes, withstands handling better, has better resolution in copying processes and gives higher peel strength of later applied metal layers than coatings obtained from solution. The transfer process enables the use of a different resin in the surface layer than within the laminate. Previous attempts to coat phenolic resin blanks with resin surface layers have resulted in penetration and mixing of the resin in the substance with the surface layer resin. Since the resin in the blank is not activated for adhesion in the manner prescribed for the applied surface layer, unpredictable and low values of the peel strength have often been obtained after metallization. Manufacturers of refractory laminates with resin-rich surfaces can advantageously apply the present method. The measures currently applied involve double or triple dipping of the glass fabric, which has poor uptake, use of fine mesh fabric, which has better uptake, addition of expanded silica to increase the resin uptake and 10 15 20 25 30 ace H0 'silica and sufficient with methyl ethyl ketone, cellosol acetate and precise control of the flow by difficult and expensive settings K = of drying conditions and catalysts. The transfer foil material can be intentionally selected so that it adheres to the applied resin surface layer to form spacers during stacking as well as provide protection during punching of plates, perforation and drilling. If it is not removable by hand, the transfer pad may be chemically removable, as is the case with aluminum foil. The following examples illustrate the invention.
Exempel 1 ' _ En överföringsfolie i form av polyetenbelagt papper belägges med ett skikt av en härdbar gummimassa och torkas. Behand- lingen och torkningen sker under avdragning av papperet från en lrulle och upplindning av det torkade papperet på en annan rulle.Example 1 A transfer film in the form of polyethylene coated paper is coated with a layer of a curable rubber mass and dried. The treatment and drying takes place while peeling the paper from one roll and winding the dried paper on another roll.
Gummimassan framställes av 350 g flytande nitrilgummi, 590 g _ É nitrilgummi i klumpform, 350 g härdbart oljelösligt fenolharts, H00 g epoxiharts (epiklorohydrinderivat), 300 g pyrogen kolloidal butylkarbitol i viktförhållandet 1:5,7:H,H för att ge en viskositet av ca 12 000fcP. Ark om 900 X 1200 mm skärs av från pappersbanan och anordnas i en stapel ned flera ämnen av fenolhartsimpregnerat papper eller glasfiberarmerat epoxiharts, så att hartsskiktet ligger emot ämnet. Stapeln lamineras under vanliga betingelser (fenolharts ~70 - 105 kp/cmz vid 17000 under 45 min, epoxiharts 1H - 19 kp/cmz vid 170°C under 15 - 30 min). Plattor utskurna ur laminaten med hartsrikt ytskikt bearbetas till tryckta kopplingsplattor på följ- ande sätt. Först upptas erforderliga hål, varpå överföringsfolien tas bort, t.ex. skalas av. Ytan aktiveras under 30 min vid 23 - 27°C li en blandning av 37 g kaliumbikromat, 500 ml svavelsyra och 500 ml "vatten. Ytan sensibiliseras genom behandling med en lösning av 100 g tennklorid, 55 ml koncentrerad saltsyra och 1000 ml vatten, sköljs och behandlas i ett bad av 1 g palladiumdiklorid, H0 ml koncen- trerad saltsyra och 1000 ml vatten. Plattan torkas, och en kon- ventionell maskering påläggs. Koppar avsätts ur ett konventionellt strömlöst arbetande bad (t.ex. enligt amerikanska patentskriften 3 625 758, exempel 5) till önskad tjocklek, så att det önskade led- ningsmönstret erhålls. Maskeringen dras av, och den färdiga kopp- lingsplattan efterhärdas under 30 min vid 1B0OC.The rubber mass is made from 350 g of liquid nitrile rubber, 590 g of lump nitrile rubber, 350 g of curable oil-soluble phenolic resin, 100 g of epoxy resin (epichlorohydrin derivative), 300 g of fumed colloidal butyl carbitol in a weight ratio of 1: 5.7: H, H to give of about 12,000fcP. 900 X 1200 mm sheets are cut from the paper web and arranged in a stack down several blanks of phenolic resin impregnated paper or glass fiber reinforced epoxy resin, so that the resin layer abuts the blank. The stack is laminated under normal conditions (phenolic resin ~ 70 - 105 kp / cm 2 at 17,000 for 45 minutes, epoxy resin 1H - 19 kp / cm 2 at 170 ° C for 15-30 minutes). Plates cut out of the laminates with a resin-rich surface layer are processed into printed coupling plates in the following way. First, the required holes are taken up, after which the transfer foil is removed, e.g. peeled off. The surface is activated for 30 minutes at 23-27 ° C in a mixture of 37 g of potassium bichromate, 500 ml of sulfuric acid and 500 ml of water. The surface is sensitized by treatment with a solution of 100 g of tin chloride, 55 ml of concentrated hydrochloric acid and 1000 ml of water. and treated in a bath of 1 g of palladium dichloride, H0 ml of concentrated hydrochloric acid and 1000 ml of water.The plate is dried, and a conventional mask is applied.Copper is deposited from a conventional electroless working bath (e.g. according to U.S. Pat. No. 3,625). 758, Example 5) to the desired thickness, so that the desired line pattern is obtained.The mask is peeled off, and the finished coupling plate is post-cured for 30 minutes at 1BOOC.
Exempel 2 I I stället för den i exempel 1 använda gummibeläggningen 10 15 20 25 30 7 -7309928-5 anbringas en beläggning av epoxiharts (t.ex. harts av epíklorhydrin och bisfenol A, katalyserat med díetylcnlrïamín) medelst överförings- processen. Efter härdning, upptagning av hål och avdranníng av övcr~ föringsfolien göres ytskiktet permanent polarisvrnl och vätbart genom doppning i dimetylformamid vid 27OC under 2 - 5 min, sköljning med vatten, doppníng i en vattenlösning av 100 g/l kromtrioxíd och 250 ml/l koncentrerad svavelsyra under ca 1 min, doppning i en 5-pro- centig lösning av natriumvätesulfit under 2 min, sköljning_i kallt vatten och i varmt (70°C) vatten samt torkning i luft eller tork- skåp. Sedan sensibiliseras det aktiverade underlaget, t.ex. med en lösl is Peakf ioflspfodukf av palla: iumaiklør ia och tema iklorid (se svenska patentansökan 1193/71) och maskeras. Ett strömlöst avsatt kopparledningsmönster byggs upp till önskad tjocklek, masken dras av, och den tryckta kopplingsplattan efterhärdas på ovan angivet sätt.g I Exemgel 3 Ett alltigenom katalytiskt hartsrikt ytskikt påföres med förfarandet enligt exempel 1 under användning av en härdbar kompo- sition av 15 g epoxiharts, 15 g butadien-akrylnitrilgummi, 50 g diacetonalkohol, 50 g toluen, 11 g oljelösligt fenolformaldehyd- harts och 60 g kuprooxid (katalysator). Som epoxiharts används en reaktionsprodukt av epiklorohydrin och bisfenol A med epoxiekvi-_ valent 173 - 179, medelmolekylvikt 300 - 350 och viskositet 3600 - euoo CP vid 2s°c.Example 2 Instead of the rubber coating used in Example 1, a coating of epoxy resin (eg resin of epichlorohydrin and bisphenol A, catalyzed with diethylcrylamine) is applied by the transfer process. After curing, punching and stripping the transfer foil, the surface layer is made permanently polarized and wettable by dipping in dimethylformamide at 27 DEG C. for 2 to 5 minutes, rinsing with water, dipping in an aqueous solution of 100 g / l chromium trioxide and 250 ml / l concentrated sulfuric acid for about 1 minute, dipping in a 5% solution of sodium hydrogen sulphite for 2 minutes, rinsing in cold water and in warm (70 ° C) water and drying in air or drying cabinets. Then the activated substrate is sensitized, e.g. with a loose ice Peakf io fl spfodukf of palla: iumaiklør ia and theme in chloride (see Swedish patent application 1193/71) and masked. An electrolessly deposited copper conductor pattern is built up to the desired thickness, the mask is peeled off, and the printed coupling plate is post-cured in the manner indicated above. In Example 3 epoxy resin, 15 g butadiene-acrylonitrile rubber, 50 g diacetone alcohol, 50 g toluene, 11 g oil-soluble phenol formaldehyde resin and 60 g cuprous oxide (catalyst). The epoxy resin used is a reaction product of epichlorohydrin and bisphenol A with epoxy equivalents 173 - 179, average molecular weight 300 - 350 and viscosity 3600 - euoo CP at 2 ° C.
I stället för kopparbad kan man använda andra ström- löst arbetande bad av metaller i grupp IB och VIII, tlex. de nickelbad, som beskrivs i Brenner, Metal Fínishing, nov. 1960, sid. 68 - 76, eller de guldbad, som beskrivs i amerikanska patent- skriften 2 970 181. Líkaleden kan bad av kobolt, silver eller andra metallnr, vilka är välkända för Fackmanncn, användas.Instead of copper baths, you can use other electrolessly operating baths of metals in groups IB and VIII, tlex. the nickel baths, described in Brenner, Metal Finishing, nov. 1960, p. 68-76, or the gold baths described in U.S. Pat. No. 2,970,181. Similarly, baths of cobalt, silver or other metal numbers well known to those skilled in the art may be used.
Poon QuAuTvPoon QuAuTv
Claims (4)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US27066072A | 1972-07-11 | 1972-07-11 | |
DE2337032A DE2337032B2 (en) | 1972-07-11 | 1973-07-19 | Method of manufacturing a base material |
CH1078473A CH588940A5 (en) | 1972-07-11 | 1973-07-24 |
Publications (1)
Publication Number | Publication Date |
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SE413753B true SE413753B (en) | 1980-06-23 |
Family
ID=27176502
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE7309928A SE413753B (en) | 1972-07-11 | 1973-07-16 | PROCEDURE FOR MANUFACTURING A SUBSTRATE MATERIAL FOR PRINTED COUPLES |
Country Status (8)
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JP (1) | JPS5748874B2 (en) |
CA (1) | CA1018410A (en) |
CH (1) | CH588940A5 (en) |
DE (1) | DE2337032B2 (en) |
FR (1) | FR2191991B1 (en) |
GB (1) | GB1427579A (en) |
NL (1) | NL180897C (en) |
SE (1) | SE413753B (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS4989857A (en) * | 1972-12-29 | 1974-08-28 | ||
JPS5127463A (en) * | 1974-08-29 | 1976-03-08 | Hirotoshi Nomura | Purintokairoyokiban no seizoho |
JPS5342370A (en) * | 1976-09-29 | 1978-04-17 | Hitachi Chemical Co Ltd | Method of producing chemically plated printed circuit board stacking board |
DE2832024A1 (en) * | 1977-07-29 | 1979-02-15 | Uop Inc | METHOD OF MANUFACTURING A LAMINATE WITH ADHESIVE COVER |
JPS56148580A (en) * | 1980-04-22 | 1981-11-18 | Nissha Printing Co Ltd | Transfer printing method |
US4339303A (en) * | 1981-01-12 | 1982-07-13 | Kollmorgen Technologies Corporation | Radiation stress relieving of sulfone polymer articles |
DE3110415C2 (en) * | 1981-03-18 | 1983-08-18 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Process for the manufacture of printed circuit boards |
DE4013319A1 (en) * | 1990-04-26 | 1991-10-31 | Pagendarm Gmbh | DEVICE FOR APPLYING A LAYER TO A SUBSTRATE |
CN103434233B (en) * | 2013-07-31 | 2015-11-18 | 东莞市施乐威尔光电科技有限公司 | Anti-scratch transfer membrane of a kind of super minute surface and preparation method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3551241A (en) * | 1967-08-23 | 1970-12-29 | Formica Corp | Process for producing a decorative laminate comprising transferring a film of a transparent noble thermosetting resin to a decorative sheet from a flexible release transfer sheet and removing the flexible release sheet after the heat and pressure consolidation step |
DE1917223A1 (en) * | 1969-04-03 | 1970-10-15 | Kalle Ag | Process for the continuous production of a layer of polymeric material on the surface of a web-shaped multilayer material |
US3657003A (en) * | 1970-02-02 | 1972-04-18 | Western Electric Co | Method of rendering a non-wettable surface wettable |
DE2055867B2 (en) * | 1970-11-13 | 1974-01-31 | Rolf 8502 Zirndorf Schnause | Method and device for the continuous application of thin plastic films to carrier materials in web form |
-
1973
- 1973-07-03 JP JP48075589A patent/JPS5748874B2/ja not_active Expired
- 1973-07-04 CA CA175,615A patent/CA1018410A/en not_active Expired
- 1973-07-12 GB GB3323173A patent/GB1427579A/en not_active Expired
- 1973-07-12 FR FR7325546A patent/FR2191991B1/fr not_active Expired
- 1973-07-16 SE SE7309928A patent/SE413753B/en unknown
- 1973-07-19 NL NLAANVRAGE7310037,A patent/NL180897C/en not_active IP Right Cessation
- 1973-07-19 DE DE2337032A patent/DE2337032B2/en not_active Ceased
- 1973-07-24 CH CH1078473A patent/CH588940A5/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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JPS5748874B2 (en) | 1982-10-19 |
JPS4959141A (en) | 1974-06-08 |
AU5673173A (en) | 1974-12-12 |
GB1427579A (en) | 1976-03-10 |
DE2337032B2 (en) | 1978-09-28 |
FR2191991A1 (en) | 1974-02-08 |
CH588940A5 (en) | 1977-06-30 |
DE2337032A1 (en) | 1975-02-06 |
CA1018410A (en) | 1977-10-04 |
NL180897C (en) | 1987-05-04 |
NL180897B (en) | 1986-12-01 |
NL7310037A (en) | 1974-01-22 |
FR2191991B1 (en) | 1976-05-07 |
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