SE392737B - Vattenhaltigt alkaliskt kopparbad for stromlos forkoppring, vilket bl a innehaller ett komplexbildningsmedel for koppar(ii)joner innefattande atminstone en organisk forening, vilken innehaller atminstone tva ... - Google Patents

Vattenhaltigt alkaliskt kopparbad for stromlos forkoppring, vilket bl a innehaller ett komplexbildningsmedel for koppar(ii)joner innefattande atminstone en organisk forening, vilken innehaller atminstone tva ...

Info

Publication number
SE392737B
SE392737B SE7404432A SE7404432A SE392737B SE 392737 B SE392737 B SE 392737B SE 7404432 A SE7404432 A SE 7404432A SE 7404432 A SE7404432 A SE 7404432A SE 392737 B SE392737 B SE 392737B
Authority
SE
Sweden
Prior art keywords
copper
stromless
atminstone
aquatic
coupling
Prior art date
Application number
SE7404432A
Other languages
English (en)
Swedish (sv)
Inventor
A Molenaar
J Boven
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of SE392737B publication Critical patent/SE392737B/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
SE7404432A 1973-04-04 1974-04-02 Vattenhaltigt alkaliskt kopparbad for stromlos forkoppring, vilket bl a innehaller ett komplexbildningsmedel for koppar(ii)joner innefattande atminstone en organisk forening, vilken innehaller atminstone tva ... SE392737B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7304650A NL7304650A (en, 2012) 1973-04-04 1973-04-04

Publications (1)

Publication Number Publication Date
SE392737B true SE392737B (sv) 1977-04-18

Family

ID=19818567

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7404432A SE392737B (sv) 1973-04-04 1974-04-02 Vattenhaltigt alkaliskt kopparbad for stromlos forkoppring, vilket bl a innehaller ett komplexbildningsmedel for koppar(ii)joner innefattande atminstone en organisk forening, vilken innehaller atminstone tva ...

Country Status (11)

Country Link
JP (1) JPS5334102B2 (en, 2012)
AT (1) AT326970B (en, 2012)
BE (1) BE813195A (en, 2012)
CA (1) CA1021103A (en, 2012)
CH (1) CH606473A5 (en, 2012)
DE (1) DE2414650C3 (en, 2012)
FR (1) FR2224555B1 (en, 2012)
GB (1) GB1425298A (en, 2012)
IT (1) IT1010903B (en, 2012)
NL (1) NL7304650A (en, 2012)
SE (1) SE392737B (en, 2012)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7402423A (nl) * 1974-02-22 1975-08-26 Philips Nv Universele verkoperingsoplossing.
US4209331A (en) * 1978-05-25 1980-06-24 Macdermid Incorporated Electroless copper composition solution using a hypophosphite reducing agent
CA1144304A (en) * 1978-10-23 1983-04-12 Glenn O. Mallory, Jr. Electroless deposition of copper
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
DE10214859B4 (de) * 2002-04-04 2004-04-08 Chemetall Gmbh Verfahren zum Verkupfern oder Verbronzen eines Gegenstandes und flüssige Gemische hierfür
JP6030848B2 (ja) * 2012-05-07 2016-11-24 上村工業株式会社 無電解銅めっき浴及び無電解銅めっき方法

Also Published As

Publication number Publication date
DE2414650B2 (de) 1978-03-16
FR2224555A1 (en, 2012) 1974-10-31
FR2224555B1 (en, 2012) 1976-12-17
BE813195A (fr) 1974-10-02
DE2414650A1 (de) 1974-10-17
NL7304650A (en, 2012) 1974-10-08
DE2414650C3 (de) 1978-11-16
ATA266674A (de) 1975-03-15
CH606473A5 (en, 2012) 1978-10-31
JPS49129638A (en, 2012) 1974-12-12
GB1425298A (en) 1976-02-18
IT1010903B (it) 1977-01-20
AT326970B (de) 1976-01-12
JPS5334102B2 (en, 2012) 1978-09-19
CA1021103A (en) 1977-11-22

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