SE385421B - Mikrokretshallare - Google Patents

Mikrokretshallare

Info

Publication number
SE385421B
SE385421B SE7208242A SE824272A SE385421B SE 385421 B SE385421 B SE 385421B SE 7208242 A SE7208242 A SE 7208242A SE 824272 A SE824272 A SE 824272A SE 385421 B SE385421 B SE 385421B
Authority
SE
Sweden
Prior art keywords
microcrete
holders
microcrete holders
Prior art date
Application number
SE7208242A
Other languages
English (en)
Swedish (sv)
Inventor
D E Michel
R R Komatinsky
Original Assignee
Bendix Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bendix Corp filed Critical Bendix Corp
Publication of SE385421B publication Critical patent/SE385421B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
SE7208242A 1971-06-25 1972-06-21 Mikrokretshallare SE385421B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US15664171A 1971-06-25 1971-06-25

Publications (1)

Publication Number Publication Date
SE385421B true SE385421B (sv) 1976-06-28

Family

ID=22560414

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7208242A SE385421B (sv) 1971-06-25 1972-06-21 Mikrokretshallare

Country Status (8)

Country Link
US (1) US3715635A (enExample)
CA (1) CA948788A (enExample)
DE (1) DE2229238A1 (enExample)
FR (1) FR2143351B1 (enExample)
GB (1) GB1381555A (enExample)
IL (1) IL39586A (enExample)
IT (1) IT959959B (enExample)
SE (1) SE385421B (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3801881A (en) * 1971-10-30 1974-04-02 Nippon Electric Co Packaged semiconductor device including a housing in the form of a rectangular parallelepiped and ceramic rectangular base member
US3899720A (en) * 1973-09-14 1975-08-12 Westinghouse Electric Corp Package for microwave integrated circuits
US3908185A (en) * 1974-03-06 1975-09-23 Rca Corp High frequency semiconductor device having improved metallized patterns
JPS521463A (en) * 1975-06-24 1977-01-07 Hitachi Ltd Module composed electronic circuit
US4259684A (en) * 1978-10-13 1981-03-31 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Packages for microwave integrated circuits
US4453142A (en) * 1981-11-02 1984-06-05 Motorola Inc. Microstrip to waveguide transition
JPS5874399U (ja) * 1981-11-13 1983-05-19 アルプス電気株式会社 電気部品の取付構造
JPS58121651A (ja) * 1982-01-13 1983-07-20 Nippon Telegr & Teleph Corp <Ntt> 集積回路用パツケ−ジ
JPH0812887B2 (ja) * 1985-04-13 1996-02-07 富士通株式会社 高速集積回路パツケ−ジ
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing
US5063432A (en) * 1989-05-22 1991-11-05 Advanced Micro Devices, Inc. Integrated circuit lead assembly structure with first and second lead patterns spaced apart in parallel planes with a part of each lead in one lead pattern perpendicular to a part of each lead in the other lead pattern
US4953006A (en) * 1989-07-27 1990-08-28 Northern Telecom Limited Packaging method and package for edge-coupled optoelectronic device
JP2863322B2 (ja) * 1990-12-07 1999-03-03 三井化学株式会社 ジメチルアミンボランの造粒方法
JP2755239B2 (ja) * 1995-11-25 1998-05-20 日本電気株式会社 半導体装置用パッケージ
US6441697B1 (en) * 1999-01-27 2002-08-27 Kyocera America, Inc. Ultra-low-loss feedthrough for microwave circuit package
US6077766A (en) * 1999-06-25 2000-06-20 International Business Machines Corporation Variable thickness pads on a substrate surface
US20030095014A1 (en) * 2001-11-21 2003-05-22 Lao Binneg Y. Connection package for high-speed integrated circuit
US6803252B2 (en) 2001-11-21 2004-10-12 Sierra Monolithics, Inc. Single and multiple layer packaging of high-speed/high-density ICs
US7471520B2 (en) * 2005-03-10 2008-12-30 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Impedance matching external component connections with uncompensated leads
JP4575261B2 (ja) * 2005-09-14 2010-11-04 株式会社東芝 高周波用パッケージ
KR20120047596A (ko) * 2010-11-04 2012-05-14 삼성전자주식회사 반도체 소자의 배선 구조
US20170245361A1 (en) * 2016-01-06 2017-08-24 Nokomis, Inc. Electronic device and methods to customize electronic device electromagnetic emissions

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL73887C (enExample) * 1942-07-30
US2576186A (en) * 1946-10-22 1951-11-27 Rca Corp Ultrahigh-frequency coupling device
US3008089A (en) * 1958-02-20 1961-11-07 Bell Telephone Labor Inc Semiconductive device comprising p-i-n conductivity layers
US3387190A (en) * 1965-08-19 1968-06-04 Itt High frequency power transistor having electrodes forming transmission lines
US3489956A (en) * 1966-09-30 1970-01-13 Nippon Electric Co Semiconductor device container
GB1181459A (en) * 1966-09-30 1970-02-18 Nippon Electric Co Improvements in Semiconductor Structures
JPS4826069B1 (enExample) * 1968-03-04 1973-08-04
US3478161A (en) * 1968-03-13 1969-11-11 Rca Corp Strip-line power transistor package
US3546543A (en) * 1968-08-30 1970-12-08 Nat Beryllia Corp Hermetically sealed electronic package for semiconductor devices with high current carrying conductors
US3577181A (en) * 1969-02-13 1971-05-04 Rca Corp Transistor package for microwave stripline circuits

Also Published As

Publication number Publication date
FR2143351B1 (enExample) 1977-12-23
IL39586A (en) 1974-12-31
US3715635A (en) 1973-02-06
FR2143351A1 (enExample) 1973-02-02
GB1381555A (en) 1975-01-22
DE2229238A1 (de) 1972-12-28
CA948788A (en) 1974-06-04
IT959959B (it) 1973-11-10
IL39586A0 (en) 1972-08-30

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