SE374479B - - Google Patents

Info

Publication number
SE374479B
SE374479B SE7204416A SE441672A SE374479B SE 374479 B SE374479 B SE 374479B SE 7204416 A SE7204416 A SE 7204416A SE 441672 A SE441672 A SE 441672A SE 374479 B SE374479 B SE 374479B
Authority
SE
Sweden
Application number
SE7204416A
Inventor
Rijswijk H C H Van
L Megens
G H Oskam
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of SE374479B publication Critical patent/SE374479B/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10454—Vertically mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0173—Template for holding a PCB having mounted components thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53265—Means to assemble electrical device with work-holder for assembly

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Details Of Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
SE7204416A 1971-04-09 1972-04-06 SE374479B (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7104836.A NL165906C (nl) 1971-04-09 1971-04-09 Werkwijze voor het monteren van een aantal elektrische onderdelen op een montagepaneel, alsmede elektrisch on- derdeel geschikt voor het uitvoeren van de werkwijze.

Publications (1)

Publication Number Publication Date
SE374479B true SE374479B (xx) 1975-03-03

Family

ID=19812892

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7204416A SE374479B (xx) 1971-04-09 1972-04-06

Country Status (12)

Country Link
US (1) US3793720A (xx)
JP (2) JPS579240B1 (xx)
AT (1) AT332925B (xx)
BE (1) BE781852A (xx)
CA (1) CA977528A (xx)
CH (1) CH550530A (xx)
DE (1) DE2213823C3 (xx)
FR (1) FR2132815B1 (xx)
GB (1) GB1355292A (xx)
IT (1) IT960872B (xx)
NL (1) NL165906C (xx)
SE (1) SE374479B (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6010920A (en) * 1996-11-26 2000-01-04 Telefonaktiebolaget Lm Ericsson Method and an arrangement for mounting a component on a carrier

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2536957C2 (de) * 1975-08-20 1983-05-11 Philips Patentverwaltung Gmbh, 2000 Hamburg Elektronisches Bauelement
EP0007183B1 (en) * 1978-07-17 1981-04-29 AMP INCORPORATED (a New Jersey corporation) An electrical connector assembly and apparatus for, and a method of, manufacturing the assembly
DE2930089C2 (de) * 1979-07-25 1984-02-09 Stettner & Co, 8560 Lauf Vorrichtung zum Einsetzen von Bauelementen in Öffnungen von gedruckten Schaltungsplatten
JPS5694800A (en) * 1979-12-28 1981-07-31 Taiyo Yuden Kk Method and device for mounting electronic part
US4469387A (en) * 1982-08-23 1984-09-04 Amp Incorporated Printed circuit board connector
JPS59227198A (ja) * 1983-06-07 1984-12-20 松下電器産業株式会社 電子部品の自動插入装置
US4753601A (en) * 1983-10-14 1988-06-28 Amp Incorporated Circuit board thickness compensator
US4606120A (en) * 1983-10-26 1986-08-19 General Electric Company Process for mounting components on a printed circuit board
US4646419A (en) * 1986-04-14 1987-03-03 At&T Method for engaging a substrate
JPH0537435Y2 (xx) * 1988-01-27 1993-09-21
US4975763A (en) * 1988-03-14 1990-12-04 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
US5260601A (en) * 1988-03-14 1993-11-09 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
JPH05327283A (ja) * 1992-02-18 1993-12-10 Samsung Electron Co Ltd 半導体パッケージの垂直実装装置及びその実装方法
CA2104438C (en) * 1992-11-02 1996-07-02 James Stephen Chapman Method and apparatus for mounting connectors
US7029313B1 (en) * 2005-05-19 2006-04-18 Delta Electronics, Inc. Auxiliary device for assisting electrical connection
US8408923B2 (en) * 2010-08-26 2013-04-02 J. S. T. Corporation Dielectric part and an electrical connector assembly incorporating the same
DE102018203715A1 (de) * 2018-03-12 2019-09-12 Jumatech Gmbh Verfahren zur Herstellung einer Leiterplatte unter Verwendung einer Form für Leiterelemente
CN112752497A (zh) * 2020-11-30 2021-05-04 广州兴锐网络科技有限公司 一种基于智能制造的音箱电路板用免拆卸装配装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2871549A (en) * 1955-06-29 1959-02-03 Jr Albert E Arnold Method of assembling electrical components
US3058440A (en) * 1959-08-03 1962-10-16 Hughes Aircraft Co Circuit module reworking fixture
US3122679A (en) * 1959-10-05 1964-02-25 Hubert H Hoeltje Jr Transistor mounting pad
US3184536A (en) * 1962-12-26 1965-05-18 Douglas Aircraft Co Inc Electrical component mounting pad for printed circuit boards
NL6408087A (xx) * 1964-07-16 1966-01-17
JPS4313576Y1 (xx) * 1964-12-26 1968-06-10
US3388464A (en) * 1965-12-09 1968-06-18 Gen Precision Systems Inc Circuit board
GB1181111A (en) * 1966-02-16 1970-02-11 Hitachi Ltd A Method for Connecting an Electric Circuit Member to a Female Member and Means for Performing the Method
US3451131A (en) * 1966-06-27 1969-06-24 Lockheed Aircraft Corp Method for making an encapsulated electrical circuit module assembly
US3516155A (en) * 1967-02-02 1970-06-23 Bunker Ramo Method and apparatus for assembling electrical components
US3512255A (en) * 1967-12-29 1970-05-19 Westinghouse Electric Corp Flat-pack circuit modules packaging

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6010920A (en) * 1996-11-26 2000-01-04 Telefonaktiebolaget Lm Ericsson Method and an arrangement for mounting a component on a carrier
US6268651B1 (en) 1996-11-26 2001-07-31 Telefonaktiebolaget Lm Ericsson (Publ) Arrangement for mounting a component upstanding on a carrier with surface mounted leads

Also Published As

Publication number Publication date
GB1355292A (en) 1974-06-05
FR2132815A1 (xx) 1972-11-24
JPS56162826A (en) 1981-12-15
US3793720A (en) 1974-02-26
JPS6226567B2 (xx) 1987-06-09
NL7104836A (xx) 1972-10-11
BE781852A (fr) 1972-10-09
IT960872B (it) 1973-11-30
DE2213823B2 (de) 1981-06-25
DE2213823A1 (de) 1972-10-19
CA977528A (en) 1975-11-11
NL165906C (nl) 1981-05-15
FR2132815B1 (xx) 1979-04-13
ATA295972A (de) 1976-02-15
AT332925B (de) 1976-10-25
JPS579240B1 (xx) 1982-02-20
DE2213823C3 (de) 1982-03-18
CH550530A (de) 1974-06-14

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