SE363425B - - Google Patents

Info

Publication number
SE363425B
SE363425B SE16736/69A SE1673669A SE363425B SE 363425 B SE363425 B SE 363425B SE 16736/69 A SE16736/69 A SE 16736/69A SE 1673669 A SE1673669 A SE 1673669A SE 363425 B SE363425 B SE 363425B
Authority
SE
Sweden
Application number
SE16736/69A
Inventor
N Schink
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19681812556 external-priority patent/DE1812556C/de
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE363425B publication Critical patent/SE363425B/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/91Controlling charging state at semiconductor-insulator interface
SE16736/69A 1968-12-04 1969-12-04 SE363425B (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19681812556 DE1812556C (de) 1968-12-04 Halbleiterbauelement mit einem Überzug aus bleihaltigem Isolierstoff am pnÜbergang
DE19681816841 DE1816841A1 (de) 1968-12-04 1968-12-24 Verfahren zum Stabilisieren der Kennlinie eines Halbleiterbauelements

Publications (1)

Publication Number Publication Date
SE363425B true SE363425B (https=) 1974-01-14

Family

ID=25756537

Family Applications (1)

Application Number Title Priority Date Filing Date
SE16736/69A SE363425B (https=) 1968-12-04 1969-12-04

Country Status (7)

Country Link
US (1) US3751306A (https=)
CH (1) CH539341A (https=)
DE (1) DE1816841A1 (https=)
FR (1) FR2025208B1 (https=)
GB (2) GB1298800A (https=)
NL (1) NL6917325A (https=)
SE (1) SE363425B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4369280A (en) * 1981-08-04 1983-01-18 General Electric Company Polybutylene terephthalate molding compositions and articles molded therefrom
EP1018158A1 (de) * 1997-09-03 2000-07-12 EUPEC Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG Feuchtigkeitsschutz für boratglashalbleiterpassivierungsschichten

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL259748A (https=) * 1960-04-30
DE1182353C2 (de) * 1961-03-29 1973-01-11 Siemens Ag Verfahren zum Herstellen eines Halbleiter-bauelements, wie Halbleiterstromtor oder Flaechentransistor, mit einer hochohmigen n-Zone zwischen zwei p-Zonen im Halbleiter-koerper
FR1324553A (fr) * 1961-05-11 1963-04-19 Motorola Inc Procédé de protection des surfaces des matières semi-conductrices utilisées dansles dispositifs électroniques à conduction en phase solide, tels que les transistors et les diodes
NL131157C (https=) * 1963-08-01
FR1443304A (fr) * 1965-05-11 1966-06-24 Comp Generale Electricite Procédé d'obtention d'un dépôt vitreux
US3447975A (en) * 1965-09-13 1969-06-03 Westinghouse Electric Corp Bilayer protective coating for exposed p-n junction surfaces
US3460003A (en) * 1967-01-30 1969-08-05 Corning Glass Works Metallized semiconductor device with fired-on glaze consisting of 25-35% pbo,10-15% b2o3,5-10% al2o3,and the balance sio2
US3506502A (en) * 1967-06-05 1970-04-14 Sony Corp Method of making a glass passivated mesa semiconductor device

Also Published As

Publication number Publication date
GB1298800A (en) 1972-12-06
FR2025208B1 (https=) 1975-01-10
DE1812556B2 (de) 1971-02-18
CH539341A (de) 1973-07-15
US3751306A (en) 1973-08-07
NL6917325A (https=) 1970-06-08
GB1294889A (https=) 1972-11-01
DE1812556A1 (de) 1970-06-11
DE1816841A1 (de) 1970-07-02
FR2025208A1 (https=) 1970-09-04

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