FR2025208B1 - - Google Patents

Info

Publication number
FR2025208B1
FR2025208B1 FR6941723A FR6941723A FR2025208B1 FR 2025208 B1 FR2025208 B1 FR 2025208B1 FR 6941723 A FR6941723 A FR 6941723A FR 6941723 A FR6941723 A FR 6941723A FR 2025208 B1 FR2025208 B1 FR 2025208B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR6941723A
Other languages
French (fr)
Other versions
FR2025208A1 (https=
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19681812556 external-priority patent/DE1812556C/de
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of FR2025208A1 publication Critical patent/FR2025208A1/fr
Application granted granted Critical
Publication of FR2025208B1 publication Critical patent/FR2025208B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/91Controlling charging state at semiconductor-insulator interface
FR6941723A 1968-12-04 1969-12-03 Expired FR2025208B1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19681812556 DE1812556C (de) 1968-12-04 Halbleiterbauelement mit einem Überzug aus bleihaltigem Isolierstoff am pnÜbergang
DE19681816841 DE1816841A1 (de) 1968-12-04 1968-12-24 Verfahren zum Stabilisieren der Kennlinie eines Halbleiterbauelements

Publications (2)

Publication Number Publication Date
FR2025208A1 FR2025208A1 (https=) 1970-09-04
FR2025208B1 true FR2025208B1 (https=) 1975-01-10

Family

ID=25756537

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6941723A Expired FR2025208B1 (https=) 1968-12-04 1969-12-03

Country Status (7)

Country Link
US (1) US3751306A (https=)
CH (1) CH539341A (https=)
DE (1) DE1816841A1 (https=)
FR (1) FR2025208B1 (https=)
GB (2) GB1298800A (https=)
NL (1) NL6917325A (https=)
SE (1) SE363425B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4369280A (en) * 1981-08-04 1983-01-18 General Electric Company Polybutylene terephthalate molding compositions and articles molded therefrom
EP1018158A1 (de) * 1997-09-03 2000-07-12 EUPEC Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG Feuchtigkeitsschutz für boratglashalbleiterpassivierungsschichten

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL259748A (https=) * 1960-04-30
DE1182353C2 (de) * 1961-03-29 1973-01-11 Siemens Ag Verfahren zum Herstellen eines Halbleiter-bauelements, wie Halbleiterstromtor oder Flaechentransistor, mit einer hochohmigen n-Zone zwischen zwei p-Zonen im Halbleiter-koerper
FR1324553A (fr) * 1961-05-11 1963-04-19 Motorola Inc Procédé de protection des surfaces des matières semi-conductrices utilisées dansles dispositifs électroniques à conduction en phase solide, tels que les transistors et les diodes
NL131157C (https=) * 1963-08-01
FR1443304A (fr) * 1965-05-11 1966-06-24 Comp Generale Electricite Procédé d'obtention d'un dépôt vitreux
US3447975A (en) * 1965-09-13 1969-06-03 Westinghouse Electric Corp Bilayer protective coating for exposed p-n junction surfaces
US3460003A (en) * 1967-01-30 1969-08-05 Corning Glass Works Metallized semiconductor device with fired-on glaze consisting of 25-35% pbo,10-15% b2o3,5-10% al2o3,and the balance sio2
US3506502A (en) * 1967-06-05 1970-04-14 Sony Corp Method of making a glass passivated mesa semiconductor device

Also Published As

Publication number Publication date
GB1298800A (en) 1972-12-06
DE1812556B2 (de) 1971-02-18
CH539341A (de) 1973-07-15
SE363425B (https=) 1974-01-14
US3751306A (en) 1973-08-07
NL6917325A (https=) 1970-06-08
GB1294889A (https=) 1972-11-01
DE1812556A1 (de) 1970-06-11
DE1816841A1 (de) 1970-07-02
FR2025208A1 (https=) 1970-09-04

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Legal Events

Date Code Title Description
ST Notification of lapse