SE361232B - - Google Patents

Info

Publication number
SE361232B
SE361232B SE14522/72A SE1452272A SE361232B SE 361232 B SE361232 B SE 361232B SE 14522/72 A SE14522/72 A SE 14522/72A SE 1452272 A SE1452272 A SE 1452272A SE 361232 B SE361232 B SE 361232B
Authority
SE
Sweden
Application number
SE14522/72A
Inventor
F Bjoerklund
E Matzner
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE14522/72A priority Critical patent/SE361232B/xx
Priority to AU61638/73A priority patent/AU484835B2/en
Publication of SE361232B publication Critical patent/SE361232B/xx
Priority to US409761A priority patent/US3892596A/en
Priority to DE19732355626 priority patent/DE2355626A1/de
Priority to GB5154573A priority patent/GB1384680A/en
Priority to FR7339684A priority patent/FR2206588B1/fr
Priority to JP48125576A priority patent/JPS50786A/ja

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/06Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0641Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type
    • H01L27/0647Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. vertical bipolar transistor and bipolar lateral transistor and resistor
    • H01L27/0652Vertical bipolar transistor in combination with diodes, or capacitors, or resistors
    • H01L27/0658Vertical bipolar transistor in combination with resistors or capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/761PN junctions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8222Bipolar technology
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/037Diffusion-deposition
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/051Etching
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/085Isolated-integrated
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/106Masks, special
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/122Polycrystalline

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Bipolar Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Element Separation (AREA)
  • Bipolar Integrated Circuits (AREA)
SE14522/72A 1972-11-09 1972-11-09 SE361232B (no)

Priority Applications (7)

Application Number Priority Date Filing Date Title
SE14522/72A SE361232B (no) 1972-11-09 1972-11-09
AU61638/73A AU484835B2 (en) 1972-11-09 1973-10-22 A method for producing integrated circuits of high packing density ina single crystalline substrate
US409761A US3892596A (en) 1972-11-09 1973-10-25 Utilizing ion implantation in combination with diffusion techniques
DE19732355626 DE2355626A1 (de) 1972-11-09 1973-11-05 Verfahren zur herstellung integrierter schaltkreise mit hoher packungsdichte in einem einkristall-substrat
GB5154573A GB1384680A (en) 1972-11-09 1973-11-06 Producing an integrated circuit
FR7339684A FR2206588B1 (no) 1972-11-09 1973-11-08
JP48125576A JPS50786A (no) 1972-11-09 1973-11-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE14522/72A SE361232B (no) 1972-11-09 1972-11-09

Publications (1)

Publication Number Publication Date
SE361232B true SE361232B (no) 1973-10-22

Family

ID=20299252

Family Applications (1)

Application Number Title Priority Date Filing Date
SE14522/72A SE361232B (no) 1972-11-09 1972-11-09

Country Status (6)

Country Link
US (1) US3892596A (no)
JP (1) JPS50786A (no)
DE (1) DE2355626A1 (no)
FR (1) FR2206588B1 (no)
GB (1) GB1384680A (no)
SE (1) SE361232B (no)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3930893A (en) * 1975-03-03 1976-01-06 Honeywell Information Systems, Inc. Conductivity connected charge-coupled device fabrication process
JPS588588B2 (ja) * 1975-05-28 1983-02-16 株式会社日立製作所 半導体集積回路
US4001869A (en) * 1975-06-09 1977-01-04 Sprague Electric Company Mos-capacitor for integrated circuits
CH608324B (fr) * 1976-05-03 Tavannes Ebauches Sa Mouvement de montre a calendrier comportant un organe indicateur de date.
US4204131A (en) * 1977-10-11 1980-05-20 Mostek Corporation Depletion controlled switch
US4155778A (en) * 1977-12-30 1979-05-22 International Business Machines Corporation Forming semiconductor devices having ion implanted and diffused regions
US5504363A (en) * 1992-09-02 1996-04-02 Motorola Inc. Semiconductor device
US5702959A (en) * 1995-05-31 1997-12-30 Texas Instruments Incorporated Method for making an isolated vertical transistor
US6765290B2 (en) * 2002-04-02 2004-07-20 Intersil Americas Inc. Arrangement for back-biasing multiple integrated circuit substrates at maximum supply voltage among all circuits

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3341754A (en) * 1966-01-20 1967-09-12 Ion Physics Corp Semiconductor resistor containing interstitial and substitutional ions formed by an ion implantation method
US3448344A (en) * 1966-03-15 1969-06-03 Westinghouse Electric Corp Mosaic of semiconductor elements interconnected in an xy matrix
FR1527898A (fr) * 1967-03-16 1968-06-07 Radiotechnique Coprim Rtc Agencement de dispositifs semi-conducteurs portés par un support commun et son procédé de fabrication
US3489963A (en) * 1967-06-16 1970-01-13 Ibm Integrated differential transistor
GB1233545A (no) * 1967-08-18 1971-05-26
GB1226899A (no) * 1968-07-17 1971-03-31
US3548269A (en) * 1968-12-03 1970-12-15 Sprague Electric Co Resistive layer semiconductive device
BE759667A (fr) * 1969-12-01 1971-06-01 Philips Nv Procede permettant la fabrication d'un dispositif semiconducteur, et dispositif semiconducteur obtenu par la mise en oeuvre de ce procede
GB1307546A (en) * 1970-05-22 1973-02-21 Mullard Ltd Methods of manufacturing semiconductor devices
US3796929A (en) * 1970-12-09 1974-03-12 Philips Nv Junction isolated integrated circuit resistor with crystal damage near isolation junction
US3648125A (en) * 1971-02-02 1972-03-07 Fairchild Camera Instr Co Method of fabricating integrated circuits with oxidized isolation and the resulting structure

Also Published As

Publication number Publication date
DE2355626A1 (de) 1974-05-30
JPS50786A (no) 1975-01-07
FR2206588A1 (no) 1974-06-07
GB1384680A (en) 1975-02-19
US3892596A (en) 1975-07-01
AU6163873A (en) 1975-04-24
FR2206588B1 (no) 1977-06-03

Similar Documents

Publication Publication Date Title
AU465353B2 (no)
FR2170808B1 (no)
FR2206588B1 (no)
JPS4934405A (no)
JPS4877525A (no)
JPS4913484U (no)
JPS525944Y2 (no)
JPS5312648Y2 (no)
JPS4934431U (no)
JPS4956433U (no)
JPS4882920U (no)
FR2210485A1 (no)
CS152733B1 (no)
CS152722B1 (no)
CS152715B1 (no)
CH593545A5 (no)
CH572990A5 (no)
CH597892A5 (no)
CH597345A5 (no)
CH593961A5 (no)
CH593944A5 (no)
CH593881A5 (no)
CH654573A4 (no)
CH592084A5 (no)
CH591514A5 (no)