SE356635B - - Google Patents
Info
- Publication number
- SE356635B SE356635B SE07631/67*A SE763167A SE356635B SE 356635 B SE356635 B SE 356635B SE 763167 A SE763167 A SE 763167A SE 356635 B SE356635 B SE 356635B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US55456466A | 1966-06-01 | 1966-06-01 | |
| US79538868A | 1968-12-31 | 1968-12-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE356635B true SE356635B (es) | 1973-05-28 |
Family
ID=27070615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE07631/67*A SE356635B (es) | 1966-06-01 | 1967-05-31 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3478420A (es) |
| DE (1) | DE1614364C3 (es) |
| ES (2) | ES341150A1 (es) |
| GB (1) | GB1173443A (es) |
| NL (1) | NL152116B (es) |
| SE (1) | SE356635B (es) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3559002A (en) * | 1968-12-09 | 1971-01-26 | Gen Electric | Semiconductor device with multiple shock absorbing and passivation layers |
| US3797103A (en) * | 1970-05-04 | 1974-03-19 | Gen Electric | Machine and process for semiconductor device assembly |
| US3659164A (en) * | 1970-11-23 | 1972-04-25 | Rca Corp | Internal construction for plastic semiconductor packages |
| US3742599A (en) * | 1970-12-14 | 1973-07-03 | Gen Electric | Processes for the fabrication of protected semiconductor devices |
| US3778887A (en) * | 1970-12-23 | 1973-12-18 | Hitachi Ltd | Electronic devices and method for manufacturing the same |
| US3868725A (en) * | 1971-10-14 | 1975-02-25 | Philips Corp | Integrated circuit lead structure |
| US3735214A (en) * | 1972-01-27 | 1973-05-22 | Coilcraft Inc | A header for mounting circuit elements for incorporation in an electric circuit |
| US4125740A (en) * | 1973-09-26 | 1978-11-14 | Sgs-Ates Componenti Elettronici S.P.A. | Resin-encased microelectronic module |
| IT993429B (it) * | 1973-09-26 | 1975-09-30 | Sgs Ates Componenti | Perfezionamento di una cassa per dispositivo a semiconduttori |
| US3902189A (en) * | 1974-04-10 | 1975-08-26 | Hunt Electronics | Prefabricated article and methods of maintaining the orientation of parts being bonded thereto |
| US3978578A (en) * | 1974-08-29 | 1976-09-07 | Fairchild Camera And Instrument Corporation | Method for packaging semiconductor devices |
| US4210926A (en) * | 1977-12-07 | 1980-07-01 | Siemens Aktiengesellschaft | Intermediate member for mounting and contacting a semiconductor body |
| JPS5479563A (en) * | 1977-12-07 | 1979-06-25 | Kyushu Nippon Electric | Lead frame for semiconductor |
| FR2503932A1 (fr) * | 1981-04-08 | 1982-10-15 | Thomson Csf | Boitiers a cosses plates pour composants semi-conducteurs de moyenne puissance et procede de fabrication |
| FR2570877B1 (fr) * | 1984-09-21 | 1987-05-22 | Silicium Semiconducteur Ssc | Composant semi-conducteur monte en boitier plastique et procede de montage correspondant |
| US5026667A (en) * | 1987-12-29 | 1991-06-25 | Analog Devices, Incorporated | Producing integrated circuit chips with reduced stress effects |
| US4935803A (en) * | 1988-09-09 | 1990-06-19 | Motorola, Inc. | Self-centering electrode for power devices |
| US5001545A (en) * | 1988-09-09 | 1991-03-19 | Motorola, Inc. | Formed top contact for non-flat semiconductor devices |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3066249A (en) * | 1953-04-07 | 1962-11-27 | Sylvania Electric Prod | Junction type semiconductor triode |
| NL212855A (es) * | 1955-03-10 | |||
| NL111799C (es) * | 1957-03-01 | 1900-01-01 | ||
| NL109587C (es) * | 1957-11-05 | |||
| US3030557A (en) * | 1960-11-01 | 1962-04-17 | Gen Telephone & Elect | High frequency tunnel diode |
| NL280224A (es) * | 1961-06-28 | |||
| US3281620A (en) * | 1962-05-16 | 1966-10-25 | Miller Robert Keith | Adjustably positionable reflector lamp |
| US3264712A (en) * | 1962-06-04 | 1966-08-09 | Nippon Electric Co | Semiconductor devices |
| NL302444A (es) * | 1963-08-05 | 1900-01-01 | Semikron Gleichrichterbau | |
| US3414969A (en) * | 1965-02-25 | 1968-12-10 | Solitron Devices | Connection arrangement for three-element component to a micro-electronics circuit |
-
1967
- 1967-05-22 DE DE1614364A patent/DE1614364C3/de not_active Expired
- 1967-05-25 GB GB24471/67A patent/GB1173443A/en not_active Expired
- 1967-05-30 ES ES341150A patent/ES341150A1/es not_active Expired
- 1967-05-31 SE SE07631/67*A patent/SE356635B/xx unknown
- 1967-05-31 NL NL676707547A patent/NL152116B/xx unknown
-
1968
- 1968-05-02 ES ES353405A patent/ES353405A1/es not_active Expired
- 1968-12-31 US US795388*A patent/US3478420A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| GB1173443A (en) | 1969-12-10 |
| NL6707547A (es) | 1967-12-04 |
| DE1614364B2 (de) | 1972-11-30 |
| DE1614364C3 (de) | 1979-04-05 |
| DE1614364A1 (de) | 1970-08-13 |
| ES353405A1 (es) | 1969-10-01 |
| NL152116B (nl) | 1977-01-17 |
| US3478420A (en) | 1969-11-18 |
| ES341150A1 (es) | 1968-10-16 |