SE351321B - - Google Patents

Info

Publication number
SE351321B
SE351321B SE11371/70A SE1137170A SE351321B SE 351321 B SE351321 B SE 351321B SE 11371/70 A SE11371/70 A SE 11371/70A SE 1137170 A SE1137170 A SE 1137170A SE 351321 B SE351321 B SE 351321B
Authority
SE
Sweden
Application number
SE11371/70A
Inventor
H Eger
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19691942455 external-priority patent/DE1942455C3/de
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE351321B publication Critical patent/SE351321B/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00Interconnections in chips, wafers or substrates
    • H10W20/40Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/942Masking
    • Y10S438/945Special, e.g. metal
SE11371/70A 1969-08-20 1970-08-20 SE351321B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691942455 DE1942455C3 (de) 1969-08-20 Verfahren zum Herstellen mehrschichtiger Leiterbahnen

Publications (1)

Publication Number Publication Date
SE351321B true SE351321B (https=) 1972-11-20

Family

ID=5743336

Family Applications (1)

Application Number Title Priority Date Filing Date
SE11371/70A SE351321B (https=) 1969-08-20 1970-08-20

Country Status (8)

Country Link
US (1) US3642548A (https=)
JP (1) JPS4910191B1 (https=)
AT (1) AT305417B (https=)
CH (1) CH508281A (https=)
FR (1) FR2060107B1 (https=)
GB (1) GB1257408A (https=)
NL (1) NL7011089A (https=)
SE (1) SE351321B (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3839108A (en) * 1970-07-22 1974-10-01 Us Navy Method of forming a precision pattern of apertures in a plate
US3740523A (en) * 1971-12-30 1973-06-19 Bell Telephone Labor Inc Encoding of read only memory by laser vaporization
US3879746A (en) * 1972-05-30 1975-04-22 Bell Telephone Labor Inc Gate metallization structure
US4057831A (en) * 1972-09-05 1977-11-08 U.S. Philips Corporation Video record disc manufactured by a process involving chemical or sputter etching
JPS5061124A (https=) * 1973-09-28 1975-05-26
US4035208A (en) * 1974-09-03 1977-07-12 Texas Instruments Incorporated Method of patterning Cr-Pt-Au metallization for silicon devices
FR2285716A1 (fr) * 1974-09-18 1976-04-16 Radiotechnique Compelec Procede pour la fabrication d'un dispositif semi-conducteur comportant une configuration de conducteurs et dispositif fabrique par ce procede
US4135998A (en) * 1978-04-26 1979-01-23 International Business Machines Corp. Method for forming pt-si schottky barrier contact
US4226932A (en) * 1979-07-05 1980-10-07 Gte Automatic Electric Laboratories Incorporated Titanium nitride as one layer of a multi-layered coating intended to be etched
US4248688A (en) * 1979-09-04 1981-02-03 International Business Machines Corporation Ion milling of thin metal films
CH648692A5 (en) * 1979-09-05 1985-03-29 Bbc Brown Boveri & Cie Contact arrangement on a semiconductor component
US6025205A (en) * 1997-01-07 2000-02-15 Tong Yang Cement Corporation Apparatus and methods of forming preferred orientation-controlled platinum films using nitrogen
JP4605554B2 (ja) * 2000-07-25 2011-01-05 独立行政法人物質・材料研究機構 ドライエッチング用マスク材
JP2005025910A (ja) * 2003-06-13 2005-01-27 Nec Corp 光学的情報記録媒体及びその製造方法
ES2685343B1 (es) 2017-03-31 2019-10-11 Dominguez Francisco Picon Dispositivo y método para el control y gestión de recursos laborales

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271286A (en) * 1964-02-25 1966-09-06 Bell Telephone Labor Inc Selective removal of material using cathodic sputtering
GB1023532A (https=) * 1964-01-07
US3442701A (en) * 1965-05-19 1969-05-06 Bell Telephone Labor Inc Method of fabricating semiconductor contacts
US3474021A (en) * 1966-01-12 1969-10-21 Ibm Method of forming openings using sequential sputtering and chemical etching
US3546010A (en) * 1968-03-06 1970-12-08 Bosch Gmbh Robert Method of producing multilayer bodies of predetermined electric conductivity

Also Published As

Publication number Publication date
CH508281A (de) 1971-05-31
JPS4910191B1 (https=) 1974-03-08
DE1942455A1 (de) 1971-02-25
US3642548A (en) 1972-02-15
NL7011089A (https=) 1971-02-23
GB1257408A (https=) 1971-12-15
AT305417B (de) 1973-02-26
FR2060107B1 (https=) 1974-10-31
DE1942455B2 (de) 1977-05-26
FR2060107A1 (https=) 1971-06-11

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