SE345764B - - Google Patents

Info

Publication number
SE345764B
SE345764B SE1127669A SE1127669A SE345764B SE 345764 B SE345764 B SE 345764B SE 1127669 A SE1127669 A SE 1127669A SE 1127669 A SE1127669 A SE 1127669A SE 345764 B SE345764 B SE 345764B
Authority
SE
Sweden
Application number
SE1127669A
Inventor
H Heissing
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of SE345764B publication Critical patent/SE345764B/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Junction Field-Effect Transistors (AREA)
SE1127669A 1968-08-13 1969-08-13 SE345764B (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681764824 DE1764824A1 (de) 1968-08-13 1968-08-13 Feldeffekttransistor

Publications (1)

Publication Number Publication Date
SE345764B true SE345764B (xx) 1972-06-05

Family

ID=5698149

Family Applications (1)

Application Number Title Priority Date Filing Date
SE1127669A SE345764B (xx) 1968-08-13 1969-08-13

Country Status (7)

Country Link
AT (1) AT305374B (xx)
CH (1) CH495632A (xx)
DE (1) DE1764824A1 (xx)
FR (1) FR2015567B1 (xx)
GB (1) GB1242474A (xx)
NL (1) NL6911991A (xx)
SE (1) SE345764B (xx)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT7826422A0 (it) * 1977-09-22 1978-08-02 Rca Corp Circuito integrato planare a silicio su zaffiro (sos) e metodo per la fabbricazione dello stesso.
US5028566A (en) * 1987-04-10 1991-07-02 Air Products And Chemicals, Inc. Method of forming silicon dioxide glass films

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1449089A (fr) * 1964-07-09 1966-08-12 Rca Corp Dispositifs semi-conducteurs
FR1530106A (fr) * 1966-08-12 1968-06-21 Ibm Dispositifs semi-conducteurs perfectionnés et procédés de fabrication appropriés
GB1208030A (en) * 1967-06-28 1970-10-07 Hitachi Ltd A semiconductor device

Also Published As

Publication number Publication date
NL6911991A (xx) 1970-02-17
FR2015567B1 (xx) 1974-10-31
DE1764824A1 (de) 1971-11-04
GB1242474A (en) 1971-08-11
CH495632A (de) 1970-08-31
AT305374B (de) 1973-02-26
FR2015567A1 (xx) 1970-04-30

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