SE326776B - - Google Patents
Info
- Publication number
- SE326776B SE326776B SE09157/67*A SE915767A SE326776B SE 326776 B SE326776 B SE 326776B SE 915767 A SE915767 A SE 915767A SE 326776 B SE326776 B SE 326776B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/04—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements with semiconductor devices only
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
- Bipolar Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL6609002A NL6609002A (en:Method) | 1966-06-29 | 1966-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE326776B true SE326776B (en:Method) | 1970-08-03 |
Family
ID=19797000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE09157/67*A SE326776B (en:Method) | 1966-06-29 | 1967-06-26 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US3482150A (en:Method) |
| AT (1) | AT278094B (en:Method) |
| BE (1) | BE700582A (en:Method) |
| CH (1) | CH465063A (en:Method) |
| DK (1) | DK119715B (en:Method) |
| ES (1) | ES342362A1 (en:Method) |
| GB (1) | GB1193113A (en:Method) |
| NL (1) | NL6609002A (en:Method) |
| NO (1) | NO120434B (en:Method) |
| SE (1) | SE326776B (en:Method) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3911468A (en) * | 1970-05-22 | 1975-10-07 | Kyoichiro Fujikawa | Magnetic-to-electric conversion semiconductor device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3183576A (en) * | 1962-06-26 | 1965-05-18 | Ibm | Method of making transistor structures |
| US3302076A (en) * | 1963-06-06 | 1967-01-31 | Motorola Inc | Semiconductor device with passivated junction |
| DE1464921B2 (de) * | 1963-10-03 | 1971-10-07 | Fujitsu Ltd , Kawasaki, Kanagawa (Japan) | Verfahren zum herstellen einer halbleiteranordnung |
| DE1273698B (de) * | 1964-01-08 | 1968-07-25 | Telefunken Patent | Halbleiteranordnung |
| US3363152A (en) * | 1964-01-24 | 1968-01-09 | Westinghouse Electric Corp | Semiconductor devices with low leakage current across junction |
| NL134388C (en:Method) * | 1964-05-15 | 1900-01-01 | ||
| US3305913A (en) * | 1964-09-11 | 1967-02-28 | Northern Electric Co | Method for making a semiconductor device by diffusing impurities through spaced-apart holes in a non-conducting coating to form an overlapped diffused region by means oftransverse diffusion underneath the coating |
-
1966
- 1966-06-29 NL NL6609002A patent/NL6609002A/xx unknown
-
1967
- 1967-06-14 US US646041A patent/US3482150A/en not_active Expired - Lifetime
- 1967-06-26 AT AT592567A patent/AT278094B/de not_active IP Right Cessation
- 1967-06-26 SE SE09157/67*A patent/SE326776B/xx unknown
- 1967-06-26 NO NO168757*1A patent/NO120434B/no unknown
- 1967-06-26 CH CH904067A patent/CH465063A/de unknown
- 1967-06-26 DK DK330567AA patent/DK119715B/da unknown
- 1967-06-26 GB GB29402/67A patent/GB1193113A/en not_active Expired
- 1967-06-27 ES ES342362A patent/ES342362A1/es not_active Expired
- 1967-06-27 BE BE700582D patent/BE700582A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| NO120434B (en:Method) | 1970-10-19 |
| ES342362A1 (es) | 1968-10-16 |
| BE700582A (en:Method) | 1967-12-27 |
| DE1614261B2 (de) | 1972-07-13 |
| US3482150A (en) | 1969-12-02 |
| DK119715B (da) | 1971-02-15 |
| GB1193113A (en) | 1970-05-28 |
| CH465063A (de) | 1968-11-15 |
| DE1614261A1 (de) | 1970-05-27 |
| NL6609002A (en:Method) | 1968-01-02 |
| AT278094B (de) | 1970-01-26 |