NL6609002A - - Google Patents

Info

Publication number
NL6609002A
NL6609002A NL6609002A NL6609002A NL6609002A NL 6609002 A NL6609002 A NL 6609002A NL 6609002 A NL6609002 A NL 6609002A NL 6609002 A NL6609002 A NL 6609002A NL 6609002 A NL6609002 A NL 6609002A
Authority
NL
Netherlands
Application number
NL6609002A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL6609002A priority Critical patent/NL6609002A/xx
Priority to US646041A priority patent/US3482150A/en
Priority to GB29402/67A priority patent/GB1193113A/en
Priority to CH904067A priority patent/CH465063A/de
Priority to DK330567AA priority patent/DK119715B/da
Priority to AT592567A priority patent/AT278094B/de
Priority to SE09157/67*A priority patent/SE326776B/xx
Priority to NO168757*1A priority patent/NO120434B/no
Priority to DE19671614261 priority patent/DE1614261C/de
Priority to BE700582D priority patent/BE700582A/xx
Priority to ES342362A priority patent/ES342362A1/es
Priority to FR112242A priority patent/FR1534973A/fr
Publication of NL6609002A publication Critical patent/NL6609002A/xx

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/04—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements with semiconductor devices only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
NL6609002A 1966-06-29 1966-06-29 NL6609002A (xx)

Priority Applications (12)

Application Number Priority Date Filing Date Title
NL6609002A NL6609002A (xx) 1966-06-29 1966-06-29
US646041A US3482150A (en) 1966-06-29 1967-06-14 Planar transistors and circuits including such transistors
GB29402/67A GB1193113A (en) 1966-06-29 1967-06-26 Improvements in and relating to Transistors.
CH904067A CH465063A (de) 1966-06-29 1967-06-26 Transistor
DK330567AA DK119715B (da) 1966-06-29 1967-06-26 Planartransistør.
AT592567A AT278094B (de) 1966-06-29 1967-06-26 Transistor
SE09157/67*A SE326776B (xx) 1966-06-29 1967-06-26
NO168757*1A NO120434B (xx) 1966-06-29 1967-06-26
DE19671614261 DE1614261C (de) 1966-06-29 1967-06-27 Planartransistor und Schaltung mit einem solchen Transistor
BE700582D BE700582A (xx) 1966-06-29 1967-06-27
ES342362A ES342362A1 (es) 1966-06-29 1967-06-27 Un dispositivo transistor.
FR112242A FR1534973A (fr) 1966-06-29 1967-06-28 Transistor dit planar et circuit comportant un tel transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6609002A NL6609002A (xx) 1966-06-29 1966-06-29

Publications (1)

Publication Number Publication Date
NL6609002A true NL6609002A (xx) 1968-01-02

Family

ID=19797000

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6609002A NL6609002A (xx) 1966-06-29 1966-06-29

Country Status (10)

Country Link
US (1) US3482150A (xx)
AT (1) AT278094B (xx)
BE (1) BE700582A (xx)
CH (1) CH465063A (xx)
DK (1) DK119715B (xx)
ES (1) ES342362A1 (xx)
GB (1) GB1193113A (xx)
NL (1) NL6609002A (xx)
NO (1) NO120434B (xx)
SE (1) SE326776B (xx)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3911468A (en) * 1970-05-22 1975-10-07 Kyoichiro Fujikawa Magnetic-to-electric conversion semiconductor device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3183576A (en) * 1962-06-26 1965-05-18 Ibm Method of making transistor structures
US3302076A (en) * 1963-06-06 1967-01-31 Motorola Inc Semiconductor device with passivated junction
DE1464921B2 (de) * 1963-10-03 1971-10-07 Fujitsu Ltd , Kawasaki, Kanagawa (Japan) Verfahren zum herstellen einer halbleiteranordnung
DE1273698B (de) * 1964-01-08 1968-07-25 Telefunken Patent Halbleiteranordnung
US3363152A (en) * 1964-01-24 1968-01-09 Westinghouse Electric Corp Semiconductor devices with low leakage current across junction
NL134388C (xx) * 1964-05-15 1900-01-01
US3305913A (en) * 1964-09-11 1967-02-28 Northern Electric Co Method for making a semiconductor device by diffusing impurities through spaced-apart holes in a non-conducting coating to form an overlapped diffused region by means oftransverse diffusion underneath the coating

Also Published As

Publication number Publication date
DK119715B (da) 1971-02-15
SE326776B (xx) 1970-08-03
AT278094B (de) 1970-01-26
BE700582A (xx) 1967-12-27
ES342362A1 (es) 1968-10-16
DE1614261B2 (de) 1972-07-13
US3482150A (en) 1969-12-02
NO120434B (xx) 1970-10-19
GB1193113A (en) 1970-05-28
CH465063A (de) 1968-11-15
DE1614261A1 (de) 1970-05-27

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