SE321740B - - Google Patents

Info

Publication number
SE321740B
SE321740B SE4771/63A SE477163A SE321740B SE 321740 B SE321740 B SE 321740B SE 4771/63 A SE4771/63 A SE 4771/63A SE 477163 A SE477163 A SE 477163A SE 321740 B SE321740 B SE 321740B
Authority
SE
Sweden
Application number
SE4771/63A
Inventor
Adam J Mc
Original Assignee
Int Electronic Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Electronic Res Corp filed Critical Int Electronic Res Corp
Publication of SE321740B publication Critical patent/SE321740B/xx

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/26—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being integral with the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S165/00—Heat exchange
    • Y10S165/905—Materials of manufacture

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SE4771/63A 1962-09-12 1963-04-30 SE321740B (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US223170A US3213324A (en) 1962-09-12 1962-09-12 Variable cooler unit

Publications (1)

Publication Number Publication Date
SE321740B true SE321740B (xx) 1970-03-16

Family

ID=22835350

Family Applications (1)

Application Number Title Priority Date Filing Date
SE4771/63A SE321740B (xx) 1962-09-12 1963-04-30

Country Status (7)

Country Link
US (1) US3213324A (xx)
BE (1) BE631738A (xx)
CH (1) CH425917A (xx)
DE (1) DE1464689B2 (xx)
GB (1) GB1048923A (xx)
NL (1) NL292162A (xx)
SE (1) SE321740B (xx)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3694703A (en) * 1970-09-02 1972-09-26 Staver Co Inc The Heat dissipator for encased semiconductor device having heat tab extending therefrom
US4103737A (en) * 1976-12-16 1978-08-01 Marantz Company, Inc. Heat exchanger structure for electronic apparatus
US4104700A (en) * 1977-01-31 1978-08-01 Burroughs Corporation Heat pipe cooling for semiconductor device packaging system
CA1209719A (en) * 1982-05-05 1986-08-12 Terrence E. Lewis Low-stress-inducing omnidirectional heat sink
US4701828A (en) * 1984-11-07 1987-10-20 Al Weiner Heat sink assembly
US4588028A (en) * 1985-05-06 1986-05-13 Thermalloy Incorporated Heat sink and method of manufacture
US4720771A (en) * 1985-07-05 1988-01-19 Chrysler Motors Corporation Heat sink assembly for a circuit board mounted integrated circuit
KR930006439Y1 (ko) * 1991-05-03 1993-09-24 주식회사 금성사 마그네트론의 방열장치
US5311395A (en) * 1992-10-29 1994-05-10 Ncr Corporation Surface mount heat sink
US5311928A (en) * 1993-06-28 1994-05-17 Marton Louis L Heat dissipator
US6053240A (en) * 1996-08-09 2000-04-25 Aavid Thermal Technologies, Inc. Heat sink
WO1998007304A1 (en) * 1996-08-09 1998-02-19 Aavid Thermal Technologies, Inc. Heat sink
US6249437B1 (en) * 1999-10-15 2001-06-19 Tyco Electronics Logistics Ag Heat sink with offset fin profile
EP1199748A1 (en) * 2000-10-17 2002-04-24 Wen-Chen Wei Improved heat dissipater structure
TWM339197U (en) * 2007-12-13 2008-08-21 Asia Vital Components Co Ltd Heat dissipating unit
JP6226446B2 (ja) * 2012-10-09 2017-11-08 Ａｐｓジャパン株式会社 ヒートシンクの製造方法
US9593865B2 (en) * 2012-12-05 2017-03-14 Lennox Industries Inc. Finger air baffle for high efficiency furnace
US9883612B2 (en) 2015-06-02 2018-01-30 International Business Machines Corporation Heat sink attachment on existing heat sinks
JP1654099S (ja) * 2019-04-12 2020-03-02 放熱構造体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2984774A (en) * 1956-10-01 1961-05-16 Motorola Inc Transistor heat sink assembly
US2974263A (en) * 1958-01-06 1961-03-07 Marquette Corp Heat sink and diode assembly

Also Published As

Publication number Publication date
DE1464689B2 (de) 1978-12-07
CH425917A (de) 1966-12-15
BE631738A (xx)
DE1464689A1 (de) 1972-03-23
US3213324A (en) 1965-10-19
GB1048923A (en) 1966-11-23
NL292162A (xx)

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