SE316534B - - Google Patents
Info
- Publication number
- SE316534B SE316534B SE906165A SE906165A SE316534B SE 316534 B SE316534 B SE 316534B SE 906165 A SE906165 A SE 906165A SE 906165 A SE906165 A SE 906165A SE 316534 B SE316534 B SE 316534B
- Authority
- SE
- Sweden
Links
Classifications
-
- H10W40/611—
-
- H10W40/22—
-
- H10W72/00—
-
- H10W76/138—
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE906165A SE316534B (Direct) | 1965-07-09 | 1965-07-09 | |
| NL6609153A NL6609153A (Direct) | 1965-07-09 | 1966-06-30 | |
| DE19661539652 DE1539652A1 (de) | 1965-07-09 | 1966-07-08 | Halbleiteranordnung |
| FR68754A FR1486215A (fr) | 1965-07-09 | 1966-07-08 | Dispositif à semi-conducteur |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE906165A SE316534B (Direct) | 1965-07-09 | 1965-07-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE316534B true SE316534B (Direct) | 1969-10-27 |
Family
ID=20275725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE906165A SE316534B (Direct) | 1965-07-09 | 1965-07-09 |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE1539652A1 (Direct) |
| FR (1) | FR1486215A (Direct) |
| NL (1) | NL6609153A (Direct) |
| SE (1) | SE316534B (Direct) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3805122A (en) * | 1971-12-03 | 1974-04-16 | Bbc Brown Boveri & Cie | Semiconductor disc assembly providing predetermined compressive force against opposite faces of the disc by clamped heat-conductive bodies |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3599057A (en) * | 1969-02-03 | 1971-08-10 | Gen Electric | Semiconductor device with a resilient lead construction |
| DE2118356A1 (de) * | 1971-04-15 | 1972-10-26 | Siemens AG, 1000 Berlin u. 8000 München | Scheibenförmiges Halbleiterbauelement |
| FR2162275A1 (en) * | 1971-12-08 | 1973-07-20 | Sescosem | Encapsulated high power semiconductor - with improved heat dissipation |
| CH592961A5 (Direct) * | 1975-09-23 | 1977-11-15 | Bbc Brown Boveri & Cie | |
| FR2598031B1 (fr) * | 1986-04-29 | 1988-12-02 | Alsthom | Boitier pour semi-conducteur de puissance |
| JP5321600B2 (ja) * | 2010-02-01 | 2013-10-23 | トヨタ自動車株式会社 | 半導体装置の製造方法および半導体装置 |
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1965
- 1965-07-09 SE SE906165A patent/SE316534B/xx unknown
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1966
- 1966-06-30 NL NL6609153A patent/NL6609153A/xx unknown
- 1966-07-08 DE DE19661539652 patent/DE1539652A1/de active Pending
- 1966-07-08 FR FR68754A patent/FR1486215A/fr not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3805122A (en) * | 1971-12-03 | 1974-04-16 | Bbc Brown Boveri & Cie | Semiconductor disc assembly providing predetermined compressive force against opposite faces of the disc by clamped heat-conductive bodies |
Also Published As
| Publication number | Publication date |
|---|---|
| FR1486215A (fr) | 1967-06-23 |
| NL6609153A (Direct) | 1967-01-10 |
| DE1539652A1 (de) | 1969-12-18 |