SE306863B - - Google Patents

Info

Publication number
SE306863B
SE306863B SE8987/65A SE898765A SE306863B SE 306863 B SE306863 B SE 306863B SE 8987/65 A SE8987/65 A SE 8987/65A SE 898765 A SE898765 A SE 898765A SE 306863 B SE306863 B SE 306863B
Authority
SE
Sweden
Application number
SE8987/65A
Inventor
R Dow
Original Assignee
M & T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M & T Chemicals Inc filed Critical M & T Chemicals Inc
Publication of SE306863B publication Critical patent/SE306863B/xx

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/0053Details of the reactor
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/60Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00049Controlling or regulating processes
    • B01J2219/00182Controlling or regulating processes controlling the level of reactants in the reactor vessel
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00049Controlling or regulating processes
    • B01J2219/00186Controlling or regulating processes controlling the composition of the reactive mixture

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
SE8987/65A 1964-07-10 1965-07-07 SE306863B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US38189564A 1964-07-10 1964-07-10

Publications (1)

Publication Number Publication Date
SE306863B true SE306863B (https=) 1968-12-09

Family

ID=23506782

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8987/65A SE306863B (https=) 1964-07-10 1965-07-07

Country Status (6)

Country Link
US (1) US3522155A (https=)
DE (1) DE1496913C3 (https=)
ES (1) ES315147A1 (https=)
GB (1) GB1051927A (https=)
NL (1) NL151448B (https=)
SE (1) SE306863B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2071199A5 (https=) * 1969-12-19 1971-09-17 Ibm France
US4162205A (en) * 1978-10-19 1979-07-24 Vulcan Materials Company Method of electroplating tin and alkaline electroplating bath therefor
US4252618A (en) * 1980-02-11 1981-02-24 Pitt Metals & Chemicals, Inc. Method of electroplating tin and alkaline electroplating bath therefor
US5450784A (en) * 1993-09-28 1995-09-19 Detroit Diesel Corporation Electroplated piston skirt for improved scuff resistance
US6740221B2 (en) 2001-03-15 2004-05-25 Applied Materials Inc. Method of forming copper interconnects
US7239747B2 (en) * 2002-01-24 2007-07-03 Chatterbox Systems, Inc. Method and system for locating position in printed texts and delivering multimedia information
WO2003085713A1 (en) * 2002-04-03 2003-10-16 Applied Materials, Inc. Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects
JP4275656B2 (ja) 2005-09-02 2009-06-10 住友金属工業株式会社 鋼管用ねじ継手

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL54999C (https=) * 1938-03-07
US2318592A (en) * 1940-02-24 1943-05-11 Du Pont Electrodeposition
US2424472A (en) * 1942-08-12 1947-07-22 Metal & Thermit Corp Tin plating from potassium stannate baths

Also Published As

Publication number Publication date
GB1051927A (https=)
DE1496913B2 (de) 1973-03-22
NL6508910A (https=) 1966-01-11
DE1496913C3 (de) 1973-10-25
ES315147A1 (es) 1966-08-01
NL151448B (nl) 1976-11-15
US3522155A (en) 1970-07-28
DE1496913A1 (de) 1969-08-14

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