SE2250759A1

SE2250759A1 - Waveguide component

Info

Publication number: SE2250759A1
Application number: SE2250759A
Authority: SE
Inventors: Bernhard Beuerle; James Campion
Original assignee: Terasi Ab
Priority date: 2022-06-21
Filing date: 2022-06-21
Publication date: 2023-12-22
Also published as: WO2023247646A1

Abstract

The invention relates to a waveguide component comprising a contact surface for mating to a connection interface to improve the connection interface of a waveguide as well as to prevent rocking, cocking or tilting of the waveguide. The waveguide component comprises a first contact surface and a second contact surface, wherein at least one of the first contact surface and the second contact surface is configured to mate with the connection interface of a waveguide, wherein the waveguide component comprises a first layer and a second layer, the first layer comprises the first contact surface and the second contact surface, the second layer comprises a mechanical support structure supporting the first layer.

Description

WAVEGUIDE COMPONENT FIELD OF THE INVENTION The present invention relates to a waveguide component comprising a contact surface for mating to a connection interface to improve the connection interface of a waveguide as well as to prevent rocking, cocking or tilting of the waveguide.

BACKGROUND OF THE INVENTION Waveguides are usually manufactured in solid materials, with metals as the most prevalent. At high frequencies, above 100 GHz, the manufacturing tolerances greatly degrade the mechanical precision and electrical performance of the Waveguides. When connecting two Waveguides in series the flange from one waveguide is abutting a flange of the other waveguide. This requires that both Waveguides be mechanically aligned and connected to one another. This necessitates the use of specific alignment and connection features, the precision of which directly impacts the electrical performance of the resulting connection. In addition, there may be small irregularities in the surface of the flanges due to the insufficient mechanical precision in the manufacturing, and this may cause rocking, cocking or tilting of the Waveguides as well as create gaps between their interfaces, which is undesirable as it may degrade the electrical performance, as the connection is not electrically aligned.

Hence, an improved connection interface would be advantageous, for a waveguide to be able to connect electrically aligned to another waveguide or a device and in particular, implementing an interface with a more precise alignment features and without irregularities in the surface of the interface, to prevent gaps from forming would be advantageous.

OBJECT OF THE INVENTION It is an object of the present invention to provide a waveguide component for mating to a waveguide interface, to improve the connection interface of Waveguides, in order to improve the electrical performance. 80135SE01 2 Further, it is an object of the present invention to provide a waveguide component with increased mechanical manufacturing precision and alignment feature for mating to a waveguide interface to prevent irregularities in the connection interface and to limit gap formation, in order to get an electrically aligned connection.

It is a further object of the present invention to provide an alternative to the prior art.

In particular, it may be seen as an object of the present invention to provide a waveguide component that solves the above mentioned problems of the prior art.

SUMMARY OF THE INVENTION Thus, the above described object and several other objects are intended to be obtained in a first aspect of the invention by providing a waveguide component for connecting to a waveguide. The waveguide comprises a flange and a connection interface, the waveguide component comprises a first contact surface and a second contact surface, wherein at least one of the first contact surface and the second contact surface is configured to mate with the connection interface of the waveguide, wherein the waveguide component comprises a first layer and a second layer, the first layer comprises the first contact surface and the second contact surface, the second layer comprises a mechanical support structure supporting the first layer, and the waveguide component further comprises a waveguide opening configured to be aligned with a waveguide opening in the waveguide.

The waveguide component is intended for mounting on the interface of a flange of a waveguide to increase the electrical performance. The component makes it possible to implement a calibration standard or other testing artefact for rectangular waveguide instrumentation with precision, as the waveguide component mates with the interface of the waveguide to prevent rocking. Further, the waveguide component is intended for creating an electrically aligned support structure, which is compatible with conventional waveguide flanges. 80135SE01 3 The waveguide component has two sides, the first side and the second side. Each side has a contact surface. The first side comprises a first contact surface and the second side comprises a second contact surface. The contact surface is the part of the side that is intended to get in contact or mate with the interface of the flange of the waveguide or is intended to get in contact or mate with the device, which is connected to the waveguide, this may be another waveguide or a device.

The expressions "mate" or "mating" is to be understood as there is physical engagement between one of the contact surfaces and the flange, or between two contact surfaces of two different waveguide components. More general that there is a physical engagement between a contact surface and another element. This physical engagement is substantially preventing relative movement of the waveguide component with respect to the waveguide.

The waveguide component may be placed against the interface of the flange with the first side turned against the flange, or it may be turned so it is placed against the interface of the flange with the second side turned against the flange, so that either the first contact surface or the second contact surface is mating the flange.

The waveguide component may be manufactured to comprise two layers, a first layer and a second layer. The first layer comprises an upper side, which is the side facing away from the second layer and an underside, which is the side facing against the second layer. The second layer has the effect that it creates a mechanical support for the first layer, strengthening the waveguide component, to reduce the risk for the component to break.

The second layer forms the second side of the waveguide component together with the part of the underside of the first layer not covered by the second layer. The first side of the waveguide component is formed of the upper side of the first layen The second layer increase the rigidity of the waveguide component, by preventing bending and/or flexing of the first layer. The thickness of the first layer may be half the thickness of the second layer. In some embodiments, the thickness of the first layer may even be one quarter or less of the thickness of the second layer. 80135SE01 4 The second layer is fixed to the first layer. A mechanical support layer between the first layer and the second layer bonding the layers together may do this. Alternatively, the first layer and the second layer may be formed in one piece. It is noted that although the term "layer" is used in this connection, this does not necessarily indicates that the waveguide component is provided as separate elements pieced together as one or more, such as all waveguide component may be provided by producing the waveguide component from a single element.

The waveguide component comprises a waveguide opening placed centrally in the waveguide component. The waveguide opening is aligned with a similar opening, the waveguide channel, in the waveguide; the waveguide opening is for the wave from the waveguide to pass through the waveguide component.

The invention is particularly, but not exclusively, advantageous for obtaining a waveguide component, which can be mated with a connection interface of a waveguide to form an electrically aligned interface that prevents gaps from forming, in order to avoid rocking or cocking and thereby increase the electrical performance.

According to one embodiment, the waveguide component completely covers the connection interface of the waveguide.

A waveguide component may have a dimension, being the area of the contact surfaces, which covers the interface of the waveguide completely, so as to provide a connection surface, which provides multiple points of contact, so as to prevent rocking or cocking of the waveguide.

According to an embodiment, the mechanical support structure of the second layer comprises an outer structure surrounding the rim of the first layer.

In one embodiment, the outer structure surrounding the rim of the first layers is square shaped, while it in other embodiments, may have a circular shape, such as a triangular shape, such as a predefined shape. The shape and configuration of the outer shape may be chosen, so as to prevent damage to the first layer when handling the component. 80135SE01 According to an embodiment, the outer structure is outside the edges of the flange.

A waveguide component may comprise an outer structure arranged to be outside the edges of the flange, so as to ease the handling of the waveguide component, which may be fragile.

According to an embodiment, the mechanical support structure of the second layer comprises an inner structure arranged to fit into a recess in the connection interface of the waveguide.

A waveguide component may comprise an inner structure in the mechanical support structure, so as to fit into a recess in the connection interface of the waveguide. The inner structure has a predefined shape, so as to fit the recess in the interface of the waveguide. The inner structure may provide rigidity to the waveguide component, by increasing the overall thickness of the waveguide component at predefined areas, so as to prevent the first layer from bending and/or flexing.

According to an embodiment, the waveguide component comprises a mechanical support layer connecting the first layer and the second layer.

In the preferred embodiment, the first layer and the second layer are connected together by a mechanical support layer. The mechanical support layer preferable is Silicon dioxide SiOz. The layers are then joined together by bonding according to well-known processes.

According to an embodiment, the first layer and the second layer of the waveguide component is made of silicon.

Preferably, the first layer and the second layer are made of silicon, but other materials may also be used.

Preferably, the first layer and/or the second layers is coated in conductive material, such as gold. 80135SE01 6 According to an embodiment, the waveguide component comprises holes for fixture screws arranged to be aligned with similar holes in the flange.

The waveguide component comprises holes for screws, when the waveguide is fixed to another waveguide or a device, screws or bolts going through fixture holes in the waveguide component.

According to an embodiment, the waveguide component comprises holes for dowel pins arranged to be aligned with dowel pins in the flange.

Dowel pins are used to align the waveguide component, the waveguide and possible a second waveguide or a device, therefore there are dowel holes in the waveguide component to be aligned with dowel pins.

According to an embodiment, the first contact surface is substantially flat. In one embodiment the first side of the waveguide component is substantial flat, this is to be understood that the first side is substantial flat except for holes for i.e. screws, dowels.

According to an embodiment, the second contact surface is substantially flat.

In one embedment, the second contact surface of the waveguide component is substantial flat, which has to be understood as the second side is substantial flat except for hold for i.e. screws, dowels.

According to an embodiment, the waveguide component comprises a RF choke.

In some preferred embodiments, the waveguide component comprises an integrated RF choke. A RF choke can be implemented having a correct thickness such as a thickness ofn *Å/i, i being an integer, such as a layer of thickness being /1 z. The RF choke is designed to prevent electromagnetic leakage in case of the presence of a small gap when connecting the waveguide flange to a waveguide component. 80135SE01 7 Hereby, by using a RF choke, it is ensured that the implementation, using a waveguide component for the interface between the waveguide and another device, a non-contact interface is provided, which eliminates the electrical degradation caused by any gaps.

According to an embodiment, the first or second contact surface is facing outwards from the waveguide, when the waveguide component mounted on the waveguide, is adapted to mate a second waveguide or a device with a connection interface.

A waveguide component may be adapted to mate a second waveguide component, waveguide, or a device with a connection interface, by adapting the first or second contact surface to the surface, being the interface, of the second waveguide component, waveguide or device.

According to an embodiment, the waveguide component is used as a calibration standard.

A waveguide component may be adapted to be a continuous waveguide component or a discontinuous waveguide component. By discontinuous is preferably meant that the dimensions of wave guide openings are different from each other, or at least that some of the wave guide openings are different from each other, such as the first layer comprising a waveguide opening being different from the waveguide opening in the second layer. The length of the waveguide may be varied by the number of waveguide components mating, or by the thickness of the first layer and/or the second layer of the waveguide component. In some embodiments, the continuous waveguide or discontinuous waveguide is used as a calibration standard, having a combined waveguide opening length by aligning the individual wave guide openings of the each waveguide component.

According to an embodiment, the thickness of first layer of a waveguide component used as a calibration standard is 1/4 of a wavelength. According to an embodiment, a waveguide opening in a waveguide component creates a phase offset of an incoming wave ofn *Å/i, i,n being an integer, such as /1 4 . 80135SE01 8 According to an embodiment, a waveguide component comprises a backshort adapted to fit within a waveguide opening.

According to an embodiment, a plurality of waveguide components are used as a calibrations standard, wherein a first layer of each waveguide component has a thickness, such that the electrical length of the calibration standard is between O- 180 degrees.

A waveguide component may comprise an offset-short, such as by closing the waveguide opening by the second layer.

In a second aspect, the invention further relates to a method to manufacture a waveguide component, comprising the steps: o placing a first layer of silicon on top of a second layer of silicon with a mechanical support layer between to bind the first layer and the second layer together, o removing material from the first layer and second layer to create holes for fixture screws and dowel pins, o removing material from the second layer to create a mechanical support structure for supporting the first layer.

The waveguide component may be manufactured by placing a first layer on top of the second layer with a mechanical support layer between. The mechanical support layer are binding the layers together by well-known processes. Material is removed from the layers to form the fixture holes, the dowel holes, the waveguide opening, and preferably, a RF choke.

The first and second aspects of the present invention may each be combined with any of the other aspects. These and other aspects of the invention will be apparent from and elucidated with reference to the embodiments described hereinafter. 80135SE01 9 BRIEF DESCRIPTION OF THE FIGURES The waveguide component according to the invention will now be described in more detail with regard to the accompanying figures. The figures show one way of implementing the present invention and is not to be construed as being limiting to other possible embodiments falling within the scope of the attached claim set.

Fig. 1 shows a view of a waveguide component.

Fig. 2 shows an exploded view of the waveguide component in fig. 1.

Fig. 3 shows an exploded view with two waveguides with a waveguide component arranged between them.

Fig. 4 shows a waveguide.

Fig. 5 shows a waveguide mating with a waveguide component.

Fig. 6 shows an exploded view of the waveguide and the waveguide component in fig. 5.

Fig. 7 shows a waveguide component between two waveguides.

Fig. 8 shows a cross-sectional view of a waveguide mating a waveguide component.

Fig. 9 shows a waveguide component with a RF choke.

DETAILED DESCRIPTION OF AN EMBODIMENT Fig. 1 shows a view of a waveguide component 1. In fig. 1 the waveguide component 1 is seen from a side-top view, wherein the surface exposed, is the first contact surface 12 of the first layer 14. The waveguide component is typically made by a first layer and a second layer. The second layer 15 is visible as dashed lines in the waveguide component 1. The first contact surface 12 comprises a substantially flat surface, which is the surface of the first layers except for the holes. The holes 25, 26 are arranged in the waveguide component 1 to fit dowel pins and screws or bolts. Typically, are the smaller holes 26 for dowels, and the larger holes 25 for screws and/or bolts. The dowels and/or the screws and/or the bolts are typically arranged within the waveguide flange 11 or another device, and used align a waveguide to another element, such as another waveguide, such as a waveguide component, such as a device. 80135SE01 In some embodiments, the waveguide component 1 comprises an alignment feature, such as a protrusion, protruding into an alignment feature arranged in a mating connection interface. The protruding alignment feature may be mechanically aligned, so as to provide a more precise alignment, thereby increasing the electrical performance of the resulting connection.

Fig. 2 shows an exploded view of the waveguide component 1 from fig. 1. In fig. 2 the second layer 15 is visible. The second layer 15 comprises a mechanical support structure 16, which mechanical support structure supports the first layer 14. The mechanical support structure 16 comprises the outer structure 40 and the inner structure 41. The second contact surface 13 (not visible) is the underside of the first layer 14 not covered by the second layer 15. The second layer 15 forms the second side of the waveguide component 1 together with the underside of the first layer 14 not covered by the second layer 15.

The size of the waveguide component may be 20 mm x 20 mm or more but not more than 40 mm x 40 mm. The thickness of the waveguide component may be 1 mm or less.

The thickness first layer 14 may be 500 um or less, such as 300 pm or less, such as 100 um or less.

As illustrated, the outer structure 40 has a shape of a square, but other shapes such as a circular, such as a triangular, such as a predefined shape may be used, so as to fit the connection interface 19 of a surface it is mating. Typically, the outer structure 40 is outside the edges of a flange of a waveguide, as it provides stability and prevents rocking of the component, while it makes it less complicated to handle.

The inner structure provides a third contact surface substantially perpendicular to the first and second contact surfaces, so as to provide further contact surfaces when mating a waveguide connection interface 19. The third contact surface will typically be in contact with fastening means located in the waveguide, such as dowel pins, such as screws, such as bolts. 80135SE01 11 In fig. 3 an exploded view of two waveguides with a waveguide component 1 arranged in between them is showed. The waveguide component 1 is by the first contact surface 12 mating with the connection interface 19 arranged on the flange 11 of the first waveguide 10 and by the second contact surface 13, mating with the connection interface 19 arranged on the flange 11 of the second waveguide 10.

In the centre of the waveguide component 1 is a waveguide opening 17, which is the opening through which waves are passing. The waveguide opening 17 is aligned with a waveguide channel 18 in the waveguides 10. In some embodiments, the waveguide component 1 is aligned with one waveguide, as showed in fig. 5.

In fig. 4 a waveguide 10 and a connection interface 19 is showed. The view is a side-top view showing a typical waveguide connection interface comprising a recess around a circular connection interface. Both the recess and the circular connection interface typically comprise fastening means, such as dowels, such as bolts, such as screws, or holes to arrange said fastening means, so as to connect with different elements, such as a waveguide component, a waveguide or any other suitable device.

Fig. 5 shows a waveguide mating with a waveguide component 1. Here the waveguide component 1 is mating by one contact surface to the connection interface 19, while the second contact surface may be prepared to mate another connection interface of another element. The waveguide component 1 is aligned with the waveguide 10 by the dowe| pins 36 protruding from the connection interface from the flange 11.

Fig. 6 shows an exploded view of a waveguide 10 and a mating waveguide component 1. The waveguide component 1 is mounted on the flange 11 of the waveguide by the second contact surface 13 of the waveguide component, while the first contact surface 12 is available. The second contact surface 13 of the waveguide component 1 is arranged to mate with the connection interface 19 of 80135SE01 12 the waveguide 10. The support structure 16 of the second layer 15 may be fabricated to fit the connection interface, so as to increase the amount of contact points between the waveguide component 1 and the connection interface 19. The first contact surface 12 is substantially flat, so as to provide a uniform surface, which may be used to mate another element. Further, the waveguide component 1 is aligned to the connection interface, to provide an electrically aligned waveguide opening between the waveguide channel 18, sometime referred to as a waveguide opening, and the waveguide opening 17.

In some embodiments, the connection interface 18 is a detachable connected piece connected to the waveguide flange 11, which thereby provide user flexibility, as one may change the connection interface depending on the use of the waveguide. In other embodiments, the connection interface 18 is a part of the flange, such as made under the fabrication of the flange.

The mechanical support structure 16 of the second layer comprises an inner structure 41, which is arranged to fit into a recess 43 in the connection interface 19 of the waveguide 10.

Fig. 7 shows a waveguide component between two waveguides. The waveguide component 1 is mating with a first waveguide flange 11 by the first contact surface 12 and mating with a second waveguide flange 11 by the second contact surface. The two waveguides are identical. The waveguide channel 18 is only visible at one end of one of the waveguides, but it should be noted, that the waveguide channel, being the waveguide opening, is extending from one waveguide, through the waveguide component and through the second waveguide. The channel is electrically aligned, by the use of alignment features arranged on the waveguide component and the waveguide flanges. Further, the waveguide component is covering connection interface 19 of both flanges completely, while the outer structure 40 is extending outside the edges 50 of the flanges 11.

Fig. 8 shows a cross-sectional view of a waveguide mating a waveguide component. The waveguide component 1 comprises a first layer 14 and a second layer 15 separated by a mechanical support layer 60, and the waveguide 80135SE01 13 component 1 extend outside the edges 50 of the flange. The waveguide component 1 is mating a connection interface of a flange 11 of a waveguide 10. The connection interface comprises recesses, in which, part of the second layer 15 is arranged within and around. Mating a connection interface of a flange 11 with a waveguide component 1 with a second layer 15, provides more contact points between the component and the flange, which gives an increased electrical performance. The other contact surface not mating with a flange is substantially flat, and provides a surface that may be aligned with a further element, such as another waveguide component, such as another waveguide flange.

In fig. 9 a waveguide component with a RF choke is showed. Typically, the waveguide component 1 has a waveguide opening 17 arranged in the centre. Around the waveguide opening 17, the waveguide component 1 has a RF choke arranged substantially surrounding the waveguide opening 17.

As illustrated, the RF choke 16 may be formed as a circular recess having a width and a depth in the surface encircling the waveguide opening 17, but other shapes such as elliptical or square may be used. The dimensions of the RF choke 16 (e.g. width and depth) should preferably be matched to the frequency of operation, such as having a length ofå from the waveguide opening 17.

Although the present invention has been described in connection with the specified embodiments, it should not be construed as being in any way limited to the presented examples. The scope of the present invention is set out by the accompanying claim set. In the context of the claims, the terms "comprising" or "comprises" do not exclude other possible elements or steps. Also, the mentioning of references such as "a" or "an" etc. should not be construed as excluding a plurality. The use of reference signs in the claims with respect to elements indicated in the figures shall also not be construed as limiting the scope of the invention. Furthermore, individual features mentioned in different claims, may possibly be advantageously combined, and the mentioning of these features in different claims does not exclude that a combination of features is not possible and advantageous.

Claims

1. A waveguide component for connecting to a waveguide (10), the waveguide comprises a flange (11) and a connection interface (19), the waveguide component (1) comprises a first contact surface (12) and a second contact surface (13) wherein at least one of the first contact surface (12) and the second contact surface (13) is configured to mate with the connection interface of the waveguide, wherein the waveguide component comprises a first layer (14) and a second layer (15), the first layer comprises the first contact surface (12) and the second contact surface (13), the second layer (15) comprises a mechanical support structure (16) supporting the first layer (14), and the waveguide component (1) further comprises a waveguide opening (17) configured to be aligned with a waveguide opening (18) in the waveguide (10). . The waveguide component according to claim 1, wherein the waveguide component completely covers the connection interface (19) of the waveguide. . The waveguide component according to any of the claims 1-2, wherein the mechanical support structure (16) of the second layer comprises an outer structure (40) surrounding the rim (45) of the first layer. . The waveguide component according to claim 3, wherein the outer structure (40) is outside the edges (50) of the flange (11). . The waveguide component according to any of the claims 1-4, wherein the mechanical support structure (16) of the second layer comprises an inner structure (41) arranged to fit into a recess (43) in the connection interface (19) of the waveguide (10). . The waveguide component according to any of the claims 1-5, wherein the waveguide component (1) comprises a mechanical support layer (60) connecting the first layer (14) and the second layer (15). 80135SE The waveguide component according to any of the claims 1-6, wherein the first layer (14) and the second layer (15) of the waveguide component is made of silicon. The waveguide component according to any of the claims 1-7, wherein the waveguide component (1) comprises holes (25) for fixture screws arranged to be aligned with similar holes (35) in the flange. The waveguide component according to any of the claims 1-8, wherein the waveguide component comprises holes (26) for dowel pins arranged to be aligned with dowel pins (36) in the flange (11). 10.The waveguide component according to any of the claims 1-9, wherein the first contact surface (12) is substantially flat. 11.The waveguide component according to any of the claims 1-10, wherein the second contact surface (13) is substantially flat. 12.The waveguide component according to any of the claims 1-11, wherein the waveguide component (1) comprises a RF choke. 13.The waveguide component according to any of the claims 1-12, wherein the first or second contact surface (12, 13) is facing outwards from the waveguide (10), when the waveguide component mounted on the waveguide, is adapted to mate a second waveguide or a device with a connection interface. 14.A method to manufacture a waveguide component, comprising the steps: o placing a first layer (14) of silicon on top of a second layer (15) of silicon with a mechanical support layer (60) between to bind the first layer and the second layer together, o removing material from the first layer and second layer to create holes (25, 26) for fixture screws and dowel pins, 80135SEo removing material from the second layer to create a rnechanmalsupportstnuïure(16)forsupporUngthefWst layen