SE183262C1 - - Google Patents

Info

Publication number
SE183262C1
SE183262C1 SE183262DA SE183262C1 SE 183262 C1 SE183262 C1 SE 183262C1 SE 183262D A SE183262D A SE 183262DA SE 183262 C1 SE183262 C1 SE 183262C1
Authority
SE
Sweden
Prior art keywords
conductive
sample
etchant
raised
substrate
Prior art date
Application number
Other languages
English (en)
Swedish (sv)
Publication date
Publication of SE183262C1 publication Critical patent/SE183262C1/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
SE183262D SE183262C1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE183262T

Publications (1)

Publication Number Publication Date
SE183262C1 true SE183262C1 (enExample) 1963-01-01

Family

ID=38409824

Family Applications (1)

Application Number Title Priority Date Filing Date
SE183262D SE183262C1 (enExample)

Country Status (1)

Country Link
SE (1) SE183262C1 (enExample)

Similar Documents

Publication Publication Date Title
US2905539A (en) Method for the production of conductive patterns and resultant product
JP4541016B2 (ja) 繊細な図記号が装備された操作ボタン、装飾パネルおよびインストルメントパネルの製造方法
EP0107983A1 (en) Method for forming patterns in a metal layer
CN107846791A (zh) 一种软硬结合板前开盖保护软板的生产方法
CN104918416B (zh) 电路板阻焊加工方法和外层超厚铜电路板
CN112312662A (zh) 一种精细线路印制电路板的制作方法
CN104080275A (zh) 一种阶梯线路板的制作方法
CN105704948A (zh) 超薄印制电路板的制作方法及超薄印制电路板
KR101603980B1 (ko) 미세 패턴을 전주도금하는 방법
SE183262C1 (enExample)
EP0476867B1 (en) Method using a permanent mandrel for manufacture of electrical circuitry
KR970073249A (ko) 다층의 프린트회로 기판용의 제조라인(manufacturing line for multi-layered printed circuit board)
WO2007136734B1 (en) Fabrication of conductive micro traces using a deform and selective removal process
CN110049625A (zh) 一种具有镀金和化金工艺的pcb板制作方法
US2221502A (en) Process of forming screens
KR100621189B1 (ko) 잉크 마스킹을 이용한 부분도금방법
US20180376601A1 (en) Fabrication method of circuit board
JP6320879B2 (ja) 印刷用マスク及びその製造方法
CN107148153A (zh) 一种印制电路板的制备方法及装置
US6230402B1 (en) Electrical contact termination for a flexible circuit
GB2030779A (en) Improvements in or relating to the manufacture of flexible printed circuits
CN106686901A (zh) 一种线路板的抗氧化制作方法
CN104968158A (zh) 一种厚铜箔细线路微间距电路板外层线路加工方法
JPH04323393A (ja) 透孔を有する電鋳製品並びにその製造方法
US6280555B1 (en) Method of forming a printed circuit board